130results about How to "Reduce plating cost" patented technology

The invention relates to a light composite electro-catalysis energy-saving anode for non-ferrous metal electro-deposition, which is composed of a metal substrate, an interlayer and a composite electro-catalysis superficial layer in sequence from inside to outside, wherein the metal substrate is Al or Al base alloy (Al-M1), the interlayer is a composite layer Al2O3-(Pb-M2) composed of Al2O3 or Pb base alloy, and the composite electro-catalysis superficial layer is a composite deposite (Pb-M2)-M3Ox composed of Pb or Pb base alloy and oxide catalyst or a composite deposite PbO2-M3Ox composed of PbO2 and oxide catalyst. The preparation method of the anode comprises the following steps: preparation of the metal substrate: carrying out anodic oxidation on the metal substrate surface and prefabricating a multihole Al2O3 layer; then performing an electro-deposition Pb or Pb base alloy layer on the multihole Al2O3 layer; and plating a (Pb-M2)-M3Ox or PbO2-M3Ox composite superficial layer on the surface of the Pb or Pb base alloy layer. The anode prepared by the invention can effectively reduce production energy consumption, improve cathode product quality, lower labor intensity, is suitable for industrialized production and can replace the Pb base alloy anode applied in the existing industry.

The invention opens a plating method of the semiautomatic vertical jet. The process is to install the Ti skep that is set the effuser between the space and the PCB in the plating vat. The horizontal pendulum is used to transfer the liquid uniformly. The inflating pipe that is changed from two into one is used in the active carbon or reverse tank treatment.

A restraint anchorage for a child safety seat for an automotive vehicle having a cross member disposed behind the vehicle's seat. U-shaped latch wires are attached to the cross member. Collars are provided on the legs of the latch wires which engage one side of the cross members. The ends of the legs which protrude through holes provided in the cross member are peened over to form enlarged heads locking the latch wire to the cross member.

The invention discloses a nickel-nano-diamond composite plating solution, which is in blend composition with the size ratio 0.1-2:22 through the modified nano-diamond water or dilute sulfuric acid solution and the water solution of nickel sulfate, nickel chloride, boric acid, saccharin and butynediol. The invention also discloses the preparation method of the composite plating solution. The composite plating solution of the invention has a high degree of stability, in which the key issues existed in the composite plating technique of nano-diamond that the nano-diamond is easy to be in agglomeration and settlement and the plating solution is unstable are resolved. Moreover the composite plating solution is in favor of the stable control of the structure and properties of the composite coating. During the preparation process, the ultrasound technology and the organic surface-active agent are not required to use, which is not only help reduce the plating cost, but also the environmental problems resulted from the adoption of the organic surface-active agents comprising sulfur, phosphorous and other elements are avoided. The composite coating obtained from the plating solution through a simple plating process is bright and smooth. Compared with the coating that the nano-diamond is not comprised and obtained under the same conditions, the micro-hardness of the composite coating can be increased at most by 38%, and the coefficient of friction can be reduced by 29%.

The invention discloses an electroplating method of an integrated circuit lead frame, which is characterized by comprising the following steps of: firstly, manufacturing a screen plate (5); secondly, diluting light sensing ink (6); thirdly, carrying out printing on a lead frame (1); fourthly, drying; fifthly; exposing; sixthly, developing; seventhly, electroplating a metal layer; eighthly, removing a film; and ninthly, cleaning and sunning. Compared with the prior art, the invention has the advantages that because steps that the light sensing ink and a screen plate technology are firstly used to carry out film coating on the lead frame and then exposing, developing and electroplating are carried out are adopted, the screen plate is printed only aiming to a special region so as to efficiently save the use level of the light sensing ink, the use level of the light sensing ink is obviously less than the that of dry film, and in addition, the price of the light sensing ink is obviously lower than the that of the dry film, therefore, the invention has low electroplating cost and is beneficial to batch production.

The invention discloses a method for improving excessive circuit etching of a circuit board, belonging to the field of outer circuit etching of printed circuit boards. The method for improving excessive circuit etching of the circuit board disclosed by the invention comprises the following steps of: micro-electroplating a copper layer with the thickness of 5-6 mu m on a complete board; transferring an outer pattern onto the outer layer of the circuit board to form a circuit pattern, wherein the width of a copper circuit is 0.03-0.04 mm more than that of a copper circuit required practically; thickening a pattern electroplated copper layer till the thickness is 11-13 mu m, and then, electrotinning with the thickness of 5-6 mu m; and vacuumizing and etching after demoulding. According to the invention, the processes before and after etching are improved in an unified manner; therefore, the improvement range of outer circuit etching is enlarged; the effect of preventing excessive circuit etching can be achieved better; the production efficiency of outer circuit etching is effectively increased; scraps due to the fact that circuits are too thin are reduced; and the electroplating quality is increased.

The invention discloses a rolling terminal and a making method thereof. The rolling terminal comprises a rolling bar; insertion bars vertically extended with the bar are uniformly arranged on the bar; tail ends of the insertion bars are outwards lapped over; and only one surface of the insertion bars is coated with a clad layer. On the premise of no influence on product function and a final terminal structure, a plate is formed by stamping, electroplated and formed by secondary stamping, so an electroplating process of the terminal is changed from immersion plating to brush plating, and the terminal provided with the insertion bars of which only one surface is coated with the clad layer is finally formed, and the electroplating cost is greatly reduced.

The invention relates to a resin composition capable of being directly electroplated. The resin composition comprises the following components in parts by weight: 75 to 95 parts of thermoplastic resin, 2 to 5 parts of a microcapsule foaming agent and 3 to 20 parts of conductive powder, wherein the thermoplastic resin is selected from ABS (Acrylonitrile Butadiene Styrene), PC (Poly Carbonate), PP (Propene Polymer), PE (Poly Ethylene), PA (Poly Amide), PBT (Poly Butylene Terephthalate), PET (Poly Ethylene Terephthalate), PMMA (Poly Methyl Methacrylate), ASA (Acrylonitrile Styrene Acrylate), AES (Acrylonitrile Ethylene Styrene) or is an alloy resin of the ABS, the PC, the PP, the PE, the PA, the PBT, the PET, the PMMA, the ASA and the AES; the conductive powder is antimony-doped stannic oxide powder. The resin composition contains the microcapsule foaming agent and the conductive powder, so that fine and even holes can be formed in a product after the resin composition is molded in an injection molding manner; meanwhile, the product has the certain conductivity, so that a metal layer can be directly electroplated on the surface of the product. Thus, the working procedures of coarsening and palladium soaking in an electroplating process are omitted. Therefore, the complicated electroplating process is simplified, the working efficiency is improved and the electroplating cost is lowered. More importantly, a concentrated sulfuric acid and a dichromic acid do not need to serve as a coarsening liquid during the electroplating process, so that the pollution is greatly reduced, i.e., the environmental friendliness is realized.

The invention discloses a plastic substrate electroplating method. According to the plastic substrate electroplating method, the treatment time of such processes as roughing, copper plating and nickel plating is reduced, a semi-bright nickel plating process in a traditional electroplating process is directly cancelled, the production capacity is greatly improved, the electroplating cost and the usage amount of chromium are reduced so that the pollution on the natural environment is reduced, and the time taken by the traditional process and the thickness of a copper plated layer as well as the thickness of a nickel plated layer are reduced; the plastic substrate electroplated surface finally treated by use of a PVD coating method is more environment-friendly in contrast with the traditional electroplating process, and is better in heat resistance, corrosion resistance, scratch resistance and oxidation resistance; and in addition, a temperature and a gas content adopted in the PVD coating technology are adjusted so that the PVD films of various bright colors with strong metal texture and third dimension can be formed to overcome the shortcoming of thin colors that can be plated by use of the traditional plastic electroplating process.

The invention discloses an imitation gold electroplating method. The imitation gold electroplating method is characterized by comprising the operation steps of part installing and suspending, oil removing and rust removing treatment, hot water washing, corrosion treatment, cold water washing, bright nickel plating, cold water washing, imitation gold plating treatment for 50-80 seconds, cold water washing, passivation treatment, cold water washing, drying, varnishing, spin-drying, baking, workpiece mounting and dismounting, and inspecting and packaging. Ultrasonic degreasing and the electrochemical method are combined to remove oil for the oil removing treatment; an ultrasonic wave cleaning mode is adopted for the hot water washing and cold water washing; the imitation gold plating is performed at the temperature of 20-25 DEG C and with the pH of 8.0-9.0 and the current density of 5-10A/dm<3>. The imitation gold electroplating method is simple and convenient to operate, and a plating layer is high in bonding force; a treated workpiece is bright in color, and has long service life; the plating cost is low.

The invention relates to the field of aluminum-silicon alloy electroplating, in particular to a method for improving the nickel electroplating quality of aluminum-silicon alloy. The method comprises the steps of organic oil removal, cleaning, electrolytic degreasing, drying, sand blasting, cleaning, oil removal, cleaning, descaling, cleaning, racking, cleaning, activation, cleaning, hard sulfuricacid anodizing, cleaning, copper pre-plating, cleaning, activation, cleaning, nickel pre-plating, nickel plating, cleaning, cleaning with hot water, cleaning and drying. According to the method, through adding of the steps of activation and hard sulfuric acid anodizing, the bonding between a substratum and copper plating is promoted, and generation of watermarks after plating is avoided; the qualified rate reaches 97%, and rework is reduced after the plating quality is qualified; the plating cost is reduced, so that the overall manufacturing cost is further reduced; meanwhile, the delivery cycle is shortened; and the method is high in adaptation to operators, and benefits scale promotion.

The invention discloses an electroplating nickel-containing wastewater resource utilization technology which comprises the steps of firstly collecting and storing electroplating nickel-containing wastewater, removing suspended solids in wastewater, filtering part of organism and auxiliaries out through activated carbon, then sequentially performing ultrafiltration, nanofiltration and reverse-osmosis operation on the purified electroplating nickel-containing wastewater to obtain concentrated solution and finally evaporating the concentrated solution in environment with temperature of 160 DEG C and steam pressure larger than 0.6Mpa to obtain nickel crystal. According to the electroplating nickel-containing wastewater resource utilization technology, the wastewater is sand filtered to remove particles, part of organic pollutant and part of heavy metal are filtered out by the activated carbon, finally wastewater can reach a standard to be reused through ultrafiltration, nanofiltration and reverse osmosis; furthermore, percolate can be reused to a plating tank after crystallization, and plating cost is reduced.

The invention discloses a hydrargyrum vertical type conductive seat which comprises a bottom plate, a guide wheel, a hydrargyrum head, a fixing block, supporting blocks, a regulating screw, a fixing seat, a rubber coating wheel and a spring sheet, wherein the bottom plate is connected with a guide wheel shaft A and the guide wheel, the guide wheel is provided with a connecting seat and a hydrargyrum head with a shield, and the side of the guide wheel is provided with the rubber coating wheel in a pressure connecting mode. The rubber coating wheel comprises a PP wheel and a silica gel wheel and is connected with the fixing block through a guide wheel B. The supporting blocks A, B and C are axially connected with the fixing seat through a fixed shaft, the fixing seat is fixedly connected with the bottom plate, the side surface of the supporting block B is provided with the spring sheet and the regulating screw, and the regulating screw is provided with a limiting nut and a PP pressing block. Since the spring sheet is controlled through the regulating screw, the rubber coating wheel can compress the material belt on the guide wheel, the electric conduction of the conductive seat is even, the tension of the material belt is stable, the quality of the electroplated product is high, the rejection rate is low, the medicine solution loss is reduced, the cost is saved and the working efficiency is improved.

The invention provides an aliphatic polyamide compound for environment-friendly electroplating. The polyamide compound is prepared from the following raw materials in percentage by weight: 40 percentto 90 percent of aliphatic polyamide resin, 3 percent to 20 percent of a thermoplastic elastomer, 0 percent to 2 percent of a coupling agent and 0 percent to 40 percent of inorganic ore powder, wherein the melt index of the thermoplastic elastomer is higher than that of the aliphatic polyamide resin. The invention further provides a preparation method of the aliphatic polyamide compound for the environment-friendly electroplating; the aliphatic polyamide compound provided by the invention can be treated by utilizing an environment-friendly potassium permanganate roughening solution, so that the aliphatic polyamide compound is suitable for the development of the environment-friendly electroplating; after the electroplating is carried out, the electroplating binding force between the polyamide compound and the surface of an electroplating cladded layer can reach 10N or more; the utilization safety is ensured.

The invention provides a polyamide compound for environment-friendly electroplating. The polyamide compound is prepared from the following raw materials in percentage by weight: 40 percent to 90 percent of aromatic-ring-containing polyamide resin, 3 percent to 20 percent of a thermoplastic elastomer, 0 percent to 20 percent of aliphatic polyamide, 0 percent to 2 percent of a coupling agent and 0 percent to 40 percent of inorganic ore powder, wherein the melt index of the thermoplastic elastomer is higher than that of the aromatic-ring-containing polyamide resin and the aliphatic polyamide. Theinvention further provides a preparation method of the polyamide compound for the environment-friendly electroplating; the polyamide compound provided by the invention has better electroplating performance and mechanical property and can be treated by utilizing an environment-friendly potassium permanganate roughening solution, so that the polyamide compound is suitable for the development of theenvironment-friendly electroplating; after the electroplating is carried out, the electroplating binding force between the polyamide compound and the surface of an electroplating cladded layer can reach 10N or more; the utilization safety is ensured.

The invention relates to multi-row lead frame electroplating equipment. The multi-row lead frame electroplate equipment comprises a mold, a pressing device, a sheet feeding wheel, a sheet dischargingwheel and an anode nozzle arranged in the mold. The mold comprises a mold body, a plurality of mold belts and at least two rows of mold nail groups, wherein the mold body is rotatable, the mold beltsare arranged on the outer peripheral wall of the mold body, and the mold nail groups are arranged on the outer peripheral wall of the mold body at intervals. The mold body is provided with a pluralityof groups of electroplating areas which can simultaneously complete electroplating of a multi-row lead frame, thereby effectively improving the electroplating efficiency of the lead frame and reducing the electroplating cost. The pressing device presses the multi-row lead frame on the periphery of the mold, mold pins are used for penetrating through positioning holes in the multi-row lead frame to position the lead frame, so that the lead frame can be tightly adhered to the mold body to prevent electroplating solution from leaking, and the electroplating effect is good.

The invention relates to a silvering touch finger electroplating hanger of a circuit breaker. The silvering touch finger electroplating hanger of the circuit breaker is characterized in that an electroplating support, an electric conductive assembly and a shielding assembly are included; the electric conductive assembly comprises a stainless steel electric conductive substrate and a plurality of sets of touch finger electric conductive contact sockets which are distributed in the horizontal direction and are arranged on the stainless steel electric conductive substrate; the shielding assembly comprises an insulation shielding plate and insulation shielding plates arranged on the two side faces; all the sets of the touch finger electric conductive contact sockets are respectively provided with a rubber shielding bar and a pressing plate in the horizontal direction. The silvering touch finger electroplating hanger of the circuit breaker has the advantages that circuit breaker touch fingers are placed on all the sets of the touch finger electric conductive contact sockets, the electroplating support, the stainless steel electric conductive substrate, metal springs of the touch finger electric conductive contact sockets and the touch fingers are electrically connected to form a cathode, the cathode is matched with a silvering solution which is used as an anode in an electroplating pool so that electroplating can be realized, then a silvering layer is plated in a non-rubber shielding bar area, local electroplating can be achieved, electroplating cost is lowered, electroplating efficiency can be guaranteed, and the problem of production efficiency restriction caused by local protection impregnation is solved.

The invention discloses a method for electroplating a lead frame, which comprises the following steps: (1) preparing a wet-film solution (5); (2) electroplating a film layer on the lead frame; (3), cleaning and drying the lead frame; (4) exposing the lead frame; (5) developing the lead frame; (6) electroplating a metal layer on the lead frame; (7) performing film removal treatment; and (8) cleaning and air-drying the lead frame. Compared with the prior art, the method has the advantages that: because a mask treatment is performed on the lead frame by using an electroplated film before the metal layer is plated on the lead frame, the side edge of the lead frame is also electroplated with a mask, a metal plating layer cannot be plated on the side edge of the lead frame when the metal layer is electroplated on the lead frame, and the electroplating quality of the lead frame is ensured; and simultaneously the price of the film is lower than that of a dry film. Thus, the method has a low electroplating cost, is favorable for batch production and has a high yield of finished products.