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Nickel electroplating solution and application thereof

A technology of nickel electroplating solution and conductive salt, which is applied in jewelry, etc., can solve the problems of small metallized parts, rough crystallization of nickel layer, long plating time, etc., to reduce difficulty, good toughness and ductility, and bright and full appearance Effect

Inactive Publication Date: 2018-01-16
广东羚光新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the small size and small metallized part of the terminal, the 0201 type chip components require a long electroplating time when using conventional nickel electroplating technology. The corrosion of the liquid leads to the failure of electrical properties, and the nickel layer of the product after electroplating has rough crystallization and poor solder resistance

Method used

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  • Nickel electroplating solution and application thereof

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Effect test

Embodiment 1

[0022] The nickel electroplating solution of the present embodiment comprises the component of following mass concentration: nickel sulfate 15g / L, sodium tetraborate 40g / L, sodium sulfate 300g / L, bisbenzenesulfonimide 0.1g / L, ethylenediaminetetraacetic acid Disodium 10g / L. The pH value of the nickel electroplating solution is 7.0.

[0023] The nickel electroplating solution is prepared by conventional mixing method from nickel sulfate, sodium tetraborate, sodium sulfate, bisbenzenesulfonimide, disodium edetate and deionized water.

[0024] At a plating temperature of 50°C and a plating current density of 0.4A / dm 2 1. Under the electroplating condition that the electroplating time is 100min, use the nickel electroplating solution to perform nickel electroplating treatment on the 0201 type chip resistor.

Embodiment 2

[0026] The nickel electroplating solution of the present embodiment comprises the component of following mass concentration: nickel sulfamate 20g / L, boric acid 45g / L, sodium sulfamate 400g / L, sodium o-benzoylsulfonimide 0.05g / L, Sodium potassium tartrate 20g / L. The pH value of the nickel electroplating solution is 7.5.

[0027] The nickel electroplating solution is prepared by conventional mixing method from nickel sulfamate, boric acid, sodium sulfamate, sodium o-benzoylsulfonimide, potassium sodium tartrate and deionized water.

[0028] At a plating temperature of 40°C and a plating current density of 0.6A / dm 2 1. Under the electroplating condition that the electroplating time is 80 minutes, use the nickel electroplating solution to perform nickel electroplating treatment on the 0201 type chip resistor.

Embodiment 3

[0030] The nickel electroplating solution of the present embodiment comprises the component of following mass concentration: nickel chloride 10g / L, sodium oxalate 45g / L, sodium chloride 400g / L, sodium propyne sulfonate 0.05g / L, sodium alginate 20g / L L. The pH value of the nickel electroplating solution is 6.5.

[0031] The nickel electroplating solution is prepared from nickel chloride, sodium oxalate, sodium chloride, sodium propyne sulfonate, sodium alginate and deionized water through a conventional mixing method.

[0032] At a plating temperature of 60°C and a plating current density of 0.2A / dm 2 1. Under the electroplating condition that the electroplating time is 120min, use the nickel electroplating solution to perform nickel electroplating treatment on the 0201 type chip resistor.

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Abstract

The invention relates to a nickel electroplating solution. The nickel electroplating solution is prepared from the following components by mass concentration: 10 to 20 g / L of main salt, 40 to 50 g / L of a buffer agent, 300 to 500 g / L of conductive salt, 0.01 to 0.1 g / L of a stress relieving agent and 2 to 20 g / L of a stabilizing agent, wherein the main salt is one or more of nickel aminosulfonate,nickel sulfate, nickel chloride and nickel oxalate; the conductive salt is one or more of sodium sulfamate, sodium sulfate, sodium chloride and sodium acetate. The pH value of the nickel electroplating solution is 6.5 to 7.5. The nickel electroplating solution disclosed by the invention has the advantages of no corrosiveness, high electroplating efficiency and environment-friendly formula; a nickel layer obtained by electroplating of the nickel electroplating solution is uniform, compact, high in hardness and anti-corrosion; the nickel electroplating solution is particularly suitable for nickel electroplating for sheet elements.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a nickel electroplating solution and its application. Background technique [0002] In recent years, the development of electronic equipment in the direction of shortness, lightness and thinness has stimulated the rapid development of surface mount technology and surface mount components, which of course has also accelerated the development of the chip resistor industry. Chip resistors are also known as surface mount resistors. Like other chip components (SMC, SMD), they are a new generation of leadless or short lead microelectronic components suitable for surface mount technology (SMT). 0201-type chip capacitors, 0201-type chip resistors, 0201-type chip inductors, 0201-type chip thermistors, 0201-type chip varistors and other small chip components are now more and more widely used. But in the process of industrialization, some problems need to be solved urgently. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D7/00
Inventor 梁俊展谭汝泉宋先刚黄澳斌王惠敏冯辉
Owner 广东羚光新材料股份有限公司
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