6results about How to "Reasonable ratio" patented technology

The present application relates to the technical field of wrapping film, and discloses a processing technology of puncture-resistant high-strength wrapping film, comprising the following specific steps: S1, proportioning preparation of ingredients: the proportioned PE raw material is placed in a first ingredient box, and the tackifying master batch is introduced into a weighing box to control the proportion of each; S2, mixing of wrapping film raw materials: the proportioned PE raw material and tackifying master batch are introduced into the machine body through a material guide plate, when the tackifying master batch needs to be proportioned and then enters the machine body for stirring, first start the closing motor, the operation of the closing motor drives the first bidirectional screw rod to rotate, the first bidirectional screw rod drives the second bidirectional screw rod to rotate, and the gravity sensor is used to weigh the tackifying master batch falling in the weighing box, so that the raw materials of the wrapping film are reasonably proportioned, and the participation of personnel in the production process is reduced.

The present application relates to the technical field of high polymer composite material, and especially to a co-extrusion fabric, a preparation method and application thereof, and is especially suitable for the field of steel-plastic composite floor which is strict in size stability and mechanical property requirement, such as building decoration, industrial floor, outdoor paving, etc., the co-extrusion fabric comprises the following raw material components in parts by weight: polyethylene: 40-70 parts; elastomer: 20-50 parts; compatibilizer: 3-10 parts; inorganic mineral: 5-10 parts; antioxidant: 0.1-1 part; lubricant: 0.5-1 part; a low-shrinkage, anti-warping polyethylene composite zinc-aluminum-magnesium alloy steel-plastic floor co-extrusion fabric is provided, by optimizing the raw material ratio, selecting special compatibilizer and inorganic mineral filler, the efficient compatibility of polyethylene, elastomer and inorganic filler is realized, the polyethylene crystalline morphology is controlled, the material shrinkage is greatly reduced, the hidden danger of warping deformation is eliminated, and the mechanical strength, toughness and weather resistance of the material are improved.

The application relates to the field of advanced structural ceramics, and particularly discloses a gel injection molding method for preparing high-performance silicon nitride ceramics and a preparation method thereof. Raw materials include beta-SiN submicron powder 75 parts, YO submicron powder 8 parts, TiC submicron powder 5 parts, AlO superfine powder 5 parts, ZrO submicron powder 2 parts and wollastonite 5 parts in terms of mass ratio, a complex whisker regulator and an entry liquid are used, and ceramics are prepared through gel injection molding, dehydration, degreasing and gas pressure sintering. The grain morphology and interface combination are optimized through the whisker regulator, the slurry dispersion and the green body uniformity are improved through the entry liquid, and the product has a density greater than or equal to 99%, a Vickers hardness greater than or equal to 1700HV and a bending strength greater than or equal to 930MPa through 1700-1850 DEG C. gas pressure sintering, and the product has high density, high hardness, high toughness, wear resistance, corrosion resistance and long service life.

This utility model relates to the field of textile fabrics, and more particularly to a green and environmentally friendly fabric, comprising a reinforcing surface layer and an environmentally friendly base layer. A heat-melting yarn is disposed between the reinforcing surface layer and the environmentally friendly base layer. The environmentally friendly base layer is made of regenerated cellulose fibers. The top and bottom ends of the heat-melting yarn are fixedly connected to the reinforcing surface layer and the environmentally friendly base layer, respectively. The heat-melting yarn is woven from heat-melting fibers. The reinforcing surface layer is woven from fiber bundles, which include tensile fibers, flame-retardant fibers, absorbent fibers, polyester fibers, and corrosion-resistant fibers. The tensile fibers, flame-retardant fibers, absorbent fibers, polyester fibers, and corrosion-resistant fibers are bundled together to form a tight structure. This invention solves the technical problems of insufficient environmental performance and functionality in traditional fabrics.

This invention discloses a liquefied gas storage tank and a vessel for transporting liquefied gas. The liquefied gas storage tank includes a main shielding layer that contacts the liquefied gas on one side, a secondary shielding layer disposed on the other side of the main shielding layer, and at least one liquefied gas loading / unloading tower. The base of the liquefied gas loading / unloading tower includes: a lower part of the base body fixedly connected to the bottom wall; a corrugated plate of the secondary shielding layer connected to the lower part of the base body; and a closed end at one end of at least one corrugation of the secondary shielding layer facing the lower part of the base body. An upper part of the base body has mounting holes in the main shielding layer, through which the upper part of the base body is fixedly connected to the lower part of the base body. By opening mounting holes on the flat surface of the main shielding layer to achieve the installation of the pump tower base, the integrity of the corrugated structure of the main shielding layer is fully preserved, ensuring the expansion and contraction performance of the main shielding layer in low-temperature environments and improving the low-temperature sealing reliability of the storage tank.

The present application relates to a kind of TR assembly package high thermal conductive eutectic medium temperature solder and foil strip preparation method, belong to microelectronic system packaging field.The solder composition: Sb 10.5~12.5wt%, Sn 0.5~2.0wt%, Ag 0.1~0.5wt%, Cu 0.1~0.5wt%, Pd 0.05~0.2wt%, Ni 0.05~0.2wt%, In 0.01~0.1wt%, P0.002~0.01wt%, the balance is Pb.Its foil strip preparation method includes raw material selection and intermediate alloy preparation, non-vacuum medium frequency induction melting, fast cooling horizontal casting and isothermal rolling step.The alloy melting point is moderate, has high strength, high thermal fatigue and high thermal conductivity etc.;Alloy foil composition is uniform, IMC is small, surface is clean, and the yield is high, satisfies the multistage packaging demand of TR assembly in microelectronic system.