37results about How to "Small kerf" patented technology

The invention provides a method for cutting a transparent material by using ultra-short pulse laser. The ultra-short pulse laser output by an ultra-short pulse laser generating device is condensed by a condensation device so as to form a bunching laser beam; the bunching laser beam enters from the surface of the transparent material to be machined, so that the center refractive index at a laser application point is increased to form a waveguide structure along a laser emitting direction; the laser is transmitted to the inside of the transparent material along the waveguide structure, and continuously generates a waveguide structure along the laser emitting direction in a transmission process until the entire waveguide structure and the laser penetrate through the transparent material; and therefore, the laser moves in a direction which is vertical to the surface of the transparent material at uniform speed, so that a waveguide plane is formed in the transparent material. The invention further provides a device for cutting the transparent material by using the ultra-short pulse laser. The method and the device for cutting the transparent material by using the ultra-short pulse laser provided by the invention have the advantages of fast cutting speed, small cutting seam, no material consumption and no powder pollution. When the machined material bears a suitable external force, the material is cracked only along a stress fault surface; the broken surface nearly has no conical degree; and the roughness is good.

The invention discloses a diamond inner circle cutting blade and a preparation method thereof. The diamond inner circle cutting blade comprises a round matrix which comprises a first main surface, a second main surface, a third main surface, a fourth main surface, a first side surface located on the edge of the outer circumference, and a second side surface located on the edge of the inner circumference; the third main surface and the fourth main surface are correspondingly formed in the manner that the upper end and the lower end of the second side surface extend outwards in the direction of the first side surface by equal distances; the third main surface and the first main surface are connected through a first annular side face; the fourth main surface and the second main surface are connected through a second annular side face; the height of the first annular side face in the axial direction of the round matrix is equal to that of the second annular side face in the axial direction of the round matrix; and the third main surface, the fourth main surface and the second side surface are each provided with a diamond coating containing diamond particles.