41results about How to "Improve taper" patented technology

The invention provides a method for cutting a transparent material by using ultra-short pulse laser. The ultra-short pulse laser output by an ultra-short pulse laser generating device is condensed by a condensation device so as to form a bunching laser beam; the bunching laser beam enters from the surface of the transparent material to be machined, so that the center refractive index at a laser application point is increased to form a waveguide structure along a laser emitting direction; the laser is transmitted to the inside of the transparent material along the waveguide structure, and continuously generates a waveguide structure along the laser emitting direction in a transmission process until the entire waveguide structure and the laser penetrate through the transparent material; and therefore, the laser moves in a direction which is vertical to the surface of the transparent material at uniform speed, so that a waveguide plane is formed in the transparent material. The invention further provides a device for cutting the transparent material by using the ultra-short pulse laser. The method and the device for cutting the transparent material by using the ultra-short pulse laser provided by the invention have the advantages of fast cutting speed, small cutting seam, no material consumption and no powder pollution. When the machined material bears a suitable external force, the material is cracked only along a stress fault surface; the broken surface nearly has no conical degree; and the roughness is good.

The invention discloses a roller bit and a manufacturing method thereof. A rolling cone bearing or a conical arc-shaped slide block flap is taken as a bearing system; a conical rolling or sliding bearing system is arranged tightly in a way that the thrust surface of a locking nut is adjacent to the small-end end face of a rolling cone or the slide block flap, and the large-end end face of the rolling cone or the slide block flap is adjacent to the inner thrust surface of a cone shell; meanwhile, a reliable locking function of the cone shell is realized. An efficient boring process is adopted for processing by means of the characteristic of simple structure of a conical claw shaft. The service life of the bearing system of the roller bit is prolonged, and the manufacturing efficiency is increased.

The invention discloses a laser perforating device capable of improving the conical degree and the inner wall quality of a hole, and a method. According to the method of the laser perforating device, a workpiece is subjected to primary laser perforating and then rotates 180 degrees in the x direction of the hole through a rotatable clamp, so that the workpiece is just soaked into water, x and y coordinates of the small hole are not changed, and then secondary laser perforating is conducted through a laser-induced cavitation technology; and in addition, the laser perforating device capable of improving the conical degree and the inner wall quality of the hole is designed and comprises a power box, an uncovered cuboid container, a laser head, a laser guide pipe, a CCD camera, a laser device, a z-direction moving mechanism, a fixing clamp device, an x-y moving platform and a rotatable clamp device. According to the laser perforating device and the method thereof, the mode of conducting laser perforating in air and the mode of conducting laser perforating in water are coupled, secondary perforating is completed by turning over the workpiece so that the conical degree of the hole can be improved, the laser perforating technology and the laser-induced cavitation technology are combined in the secondary perforating process, and the inner wall of the hole is strengthened by impact waves generated through cavitation.

The invention provides a etching compound, using said compound to carry out wet etching for TFT grid wiring material Al-Nd / Mo bilaminar membrane or Mo / Al- Nd / Mo three-layer membrane, which forms film transistor liquid crystal displayer, the wet etching employs single process by way of no undercut by lower membrane Al- Nd or Mo; the taper is good and configuration of Mo monolayer film of source / drain wiring material is outstanding. The etching compound comprises phosphoric acid, aqua fortis, acetic acid, acetic acid surface activator and water.

A method for preparing uniform three dimensional nanometer fluid passage by femto-second laser comprises the steps of irradiating transparent material by femto-second laser, chemical attacking and hotdrawing. the three dimensional nanometer fluid passage prepared by the method in the invention achieves the advantages of uniform longitudinal appearance, good roundness of passage cross section, high smoothness of the passage inner wall and small passage inner diameter to nanometer scale.

The invention provides a device and method for punching through a laser beam. The device comprises a container (20), a laser output shaper (50) and a driving system (31). The laser output shaper (50) is located in the container (20) and rotationally connected with the container (20). The laser output shaper (50) comprises a laser device array and a convex lens array. The laser device array comprises an even number of laser devices which are arranged linearly and symmetrical about the rotating axis of the laser output shape (50). The convex lens array comprises convex lenses in one-to-one correspondence with the laser devices. The position of each convex lens is adjustable in the vertical direction. The laser output shaper (50) further comprises a controller used for controlling the beam strength of each laser device. The driving system (31) is used for driving the laser output shaper (50) to rotate. The device and method can achieve laser punching more easily and conveniently, and holes with small taper can be manufactured.

The present invention relates to a production method for an electroformed stencil with mark points, including the production of the electroformed stencil and the production of the mark points. The production method is characterized in that the opening pattern area of the electroformed stencil is surrounded by hanging holes arranged in a rectangular area, used to determine the coordinates of the mark points. The production of the mark point comprises the steps of: placing the fixed electroformed stencil on a cutting base platform; then determining the coordinates of the mark points; adjusting cutting parameters and the vertical height of a laser cutting head to enable a laser focus to fall on the surface of the electroformed stencil; emitting laser light through the laser cutting head to perform cutting at the mark point area on the surface of the electroformed stencil. According to the production method for the electroformed stencil with mark points, the obtained electroformed stencil has good surface quality, no pinholes or pittings, thereby improving printing quality; and the mark points have high positioning accuracy, and relatively high degrees of recognition, improving alignment accuracy of a PCB with the electroformed stencil.

The invention discloses a device and method for processing low-taper glass deep holes assisted by liquid flow coating, which belongs to the field of laser processing in special processing, and includes a laser chemical composite processing system and a control system; For the problem of low laser absorption efficiency of brittle materials, the present invention uses an alkaline solution added with dyeing agent, which can improve the laser absorption rate of the material processing area and reduce the internal stress accumulation of the material. Compared with ordinary solid coatings that can only work at the moment of laser shock, the liquid flow coating proposed by this method can adapt to the laser processing marks, and the coating can achieve continuous action with the depth of laser drilling, especially suitable for For machining deep holes. The method makes full use of the positive effect of laser preprocessing, and compared with the existing method, the cost is low, the taper of the deep hole can be significantly reduced, the quality of the wall of the deep hole can be improved, and the energy utilization rate of the laser can be improved.

The invention discloses a laser drilling device capable of improving hole taper. The laser drilling device comprises a laser generator and further comprises a reflection unit and a reflection regulating mechanism, wherein the laser generator is fixedly arranged on one side of a workpiece in a relative manner; the reflection unit and the reflection regulating mechanism are arranged on the other side of the workpiece; after the laser generator machines a through hole with a taper in the workpiece, the laser beams penetrate through the through hole, fall on the reflection plane of the reflection unit, and finally fall on the circumference and the inner wall of the through hole after being reflected on the reflection plane; the reflection regulating mechanism drives the reflection unit to move to enable the reflected laser beams to fall on different positions of the circumference and the inner wall of the through hole so as to gradually eliminate the taper in the through hole. Only the same laser generator is adopted to machine the target workpiece and improve dimensionality of the target workpiece so as to avoid the defects of complicated device, higher cost and difficulty in control caused by introduction of a magnetic field, a flow field and other energy fields, and simplify installation and application.