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41results about How to "Improve taper" patented technology

Method and device for cutting transparent material by using ultra-short pulse laser

The invention provides a method for cutting a transparent material by using ultra-short pulse laser. The ultra-short pulse laser output by an ultra-short pulse laser generating device is condensed by a condensation device so as to form a bunching laser beam; the bunching laser beam enters from the surface of the transparent material to be machined, so that the center refractive index at a laser application point is increased to form a waveguide structure along a laser emitting direction; the laser is transmitted to the inside of the transparent material along the waveguide structure, and continuously generates a waveguide structure along the laser emitting direction in a transmission process until the entire waveguide structure and the laser penetrate through the transparent material; and therefore, the laser moves in a direction which is vertical to the surface of the transparent material at uniform speed, so that a waveguide plane is formed in the transparent material. The invention further provides a device for cutting the transparent material by using the ultra-short pulse laser. The method and the device for cutting the transparent material by using the ultra-short pulse laser provided by the invention have the advantages of fast cutting speed, small cutting seam, no material consumption and no powder pollution. When the machined material bears a suitable external force, the material is cracked only along a stress fault surface; the broken surface nearly has no conical degree; and the roughness is good.
Owner:WUHAN JUNNO TECH

Laser perforating device capable of improving conical degree and inner wall quality of hole and method

The invention discloses a laser perforating device capable of improving the conical degree and the inner wall quality of a hole, and a method. According to the method of the laser perforating device, a workpiece is subjected to primary laser perforating and then rotates 180 degrees in the x direction of the hole through a rotatable clamp, so that the workpiece is just soaked into water, x and y coordinates of the small hole are not changed, and then secondary laser perforating is conducted through a laser-induced cavitation technology; and in addition, the laser perforating device capable of improving the conical degree and the inner wall quality of the hole is designed and comprises a power box, an uncovered cuboid container, a laser head, a laser guide pipe, a CCD camera, a laser device, a z-direction moving mechanism, a fixing clamp device, an x-y moving platform and a rotatable clamp device. According to the laser perforating device and the method thereof, the mode of conducting laser perforating in air and the mode of conducting laser perforating in water are coupled, secondary perforating is completed by turning over the workpiece so that the conical degree of the hole can be improved, the laser perforating technology and the laser-induced cavitation technology are combined in the secondary perforating process, and the inner wall of the hole is strengthened by impact waves generated through cavitation.
Owner:JIANGSU UNIV

Spatial positioning of photon emitters in a plasmonic illumination device

There is provided an illumination device (100) comprising: a substrate (104); an optically transmissive first layer (106) arranged on the substrate; a photon emitting layer (108), arranged on the optically transmissive first layer and comprising a photon emitting material configured to receive energy from an energy source and to emit light having a predetermined wavelength; a periodic plasmonic antenna array, arranged on the substrate and embedded within the first layer, and comprising a plurality of individual antenna elements (114) arranged in an antenna array plane, the plasmonic antenna array being configured to support a first lattice resonance at the predetermined wavelength, arising from coupling of localized surface plasmon resonances in the individual antenna elements to photonic modes supported by the system comprising the plasmonic antenna array and the photon emitting layer, wherein the plasmonic antenna array is configured to comprise plasmon resonance modes such that light emitted from the plasmonic antenna array has an anisotropic angle distribution; and wherein the photon emitting layer is arranged at a distance from the antenna array plane corresponding to a location of maximum field enhancement for light out-coupling resulting from the plasmonic-photonic lattice resonances.
Owner:LUMILEDS

Laser drilling device and method capable of improving hole taper

ActiveCN105904105AImprove taperOvercoming problems that require extremely high motion precision requirementsLaser beam welding apparatusOptoelectronicsLaser beams
The invention discloses a laser drilling device capable of improving hole taper. The laser drilling device comprises a laser generator and further comprises a reflection unit and a reflection regulating mechanism, wherein the laser generator is fixedly arranged on one side of a workpiece in a relative manner; the reflection unit and the reflection regulating mechanism are arranged on the other side of the workpiece; after the laser generator machines a through hole with a taper in the workpiece, the laser beams penetrate through the through hole, fall on the reflection plane of the reflection unit, and finally fall on the circumference and the inner wall of the through hole after being reflected on the reflection plane; the reflection regulating mechanism drives the reflection unit to move to enable the reflected laser beams to fall on different positions of the circumference and the inner wall of the through hole so as to gradually eliminate the taper in the through hole. Only the same laser generator is adopted to machine the target workpiece and improve dimensionality of the target workpiece so as to avoid the defects of complicated device, higher cost and difficulty in control caused by introduction of a magnetic field, a flow field and other energy fields, and simplify installation and application.
Owner:GUANGDONG UNIV OF TECH

Laser punching method and device for metal

The embodiment of the invention belongs to the technical field of laser machining and relates to a laser punching method and device for metal. The laser punching method comprises the steps that a laser beam is positioned to the machining hole position of a target machining hole and output, and the machining hole position is hollowed out according to a first laser punching trajectory chart; after hollow-out machining, redundant leftover materials in the target machining hole are removed in a laser filling mode, a transition machining hole is formed, and the hole diameter of the transition machining hole is smaller than that of the target machining hole; and the edge of the transition machining hole is reshaped according to a second laser machining trajectory chart, and the target machininghole is formed. The laser punching device is used for executing the laser punching method and comprises an electrical control part, a laser, a beam expanding mirror, a galvanometer system, a telecentric focusing lens, a working platform and a cleaning device. According to the laser punching method and device, the machining efficiency can be improved effectively, thermal deformation is prevented from occurring to a machined product, and meanwhile the circular degree and taper of the hole are effectively improved.
Owner:HANS LASER TECH IND GRP CO LTD

Method and device for cutting transparent material by using ultra-short pulse laser

The invention provides a method for cutting a transparent material by using ultra-short pulse laser. The ultra-short pulse laser output by an ultra-short pulse laser generating device is condensed by a condensation device so as to form a bunching laser beam; the bunching laser beam enters from the surface of the transparent material to be machined, so that the center refractive index at a laser application point is increased to form a waveguide structure along a laser emitting direction; the laser is transmitted to the inside of the transparent material along the waveguide structure, and continuously generates a waveguide structure along the laser emitting direction in a transmission process until the entire waveguide structure and the laser penetrate through the transparent material; and therefore, the laser moves in a direction which is vertical to the surface of the transparent material at uniform speed, so that a waveguide plane is formed in the transparent material. The invention further provides a device for cutting the transparent material by using the ultra-short pulse laser. The method and the device for cutting the transparent material by using the ultra-short pulse laser provided by the invention have the advantages of fast cutting speed, small cutting seam, no material consumption and no powder pollution. When the machined material bears a suitable external force, the material is cracked only along a stress fault surface; the broken surface nearly has no conical degree; and the roughness is good.
Owner:WUHAN JUNNO TECH

Rotary cutting tool

The invention is suitable for the technical field of cutting tools and particularly suitable for the technical field of micro drill bits for milling edges of printed circuit boards, and discloses a rotary cutting tool. The rotary cutting tool comprises a cutting part which has a taper; the diameter of the front end of the cutting part is smaller than that of the rear end of the cutting part; the cutting part is provided with a plurality of main spiral grooves of the same spiral angle; the main spiral grooves are evenly distributed in the circumferential direction, and the screwing direction of each main spiral groove is rightwards; the cutting part is further provided with an auxiliary spiral groove which comprises a leftwards-screwed spiral groove spirally ascending from the front end to the rear end of the cutting part; the auxiliary spiral groove spirally ascending and the main spiral grooves form a plurality of cutting teeth on the cutting part; and in the spiral direction of the auxiliary spiral groove, the tooth width portions between the adjacent cutting teeth coincide with one another. According to the rotary cutting tool, the auxiliary spiral groove of the cutting part is of a leftwards-screwed structure, and the main spiral grooves of the cutting part are of rightwards-screwed structures. The actual area of the cross section of each spiral groove is increased, chip blockage is not likely to happen, the service life can be prolonged by 86.24%, and precision can be improved by 33.89%.
Owner:SHENZHEN JINZHOU PRECISION TECH

Method for improving laser cutting quality of pendulous reed of accelerometer

ActiveCN103086597AEliminate dross defectsImprove energy unevennessGlass severing apparatusGlass productionSlagLaser cutting
The invention provides a method for improving laser cutting quality of a pendulous reed of an accelerometer. The method is the method comprising the steps of manufacturing a cutting assisting device, installing, fixing, vibrating, cutting by laser and the like, so that the adhering slag is reduced, the taper of a cut is improved, and thus the laser cutting quality of the pendulous seed is improved. According to the method, the assisting device is provided and used for precisely positioning on real time, a sacrificial plate is added during cutting the pendulous reed through the laser, thus the residues without being taken away by the assisting gas can be attached on the sacrificial plate, and the defect due to the adhering slag close to the kerf of the pendulous reed can be removed, and the taper of the cut due to the scattering of the laser on the surface of a glass can be improved; the vibration is carried out during cutting through the laser, so that a laser focus can upwards and downwards move within the thickness range of the pendulous reed, and as a result, the problem that uniform energy in the thickness direction of the pendulous reed due to the concentrating of the laser energy in the focus cannot be realized can be greatly reduced, the purposes of reducing the taper of the kerf, improving the processing precision of the pendulous reed structure as well as improving the graphs and sizes of two surfaces can be realized, and the yield of processing is increased by more than 10%.
Owner:航天科工惯性技术有限公司

A laser drilling device and method for improving hole taper and inner wall quality

The invention discloses a laser perforating device capable of improving the conical degree and the inner wall quality of a hole, and a method. According to the method of the laser perforating device, a workpiece is subjected to primary laser perforating and then rotates 180 degrees in the x direction of the hole through a rotatable clamp, so that the workpiece is just soaked into water, x and y coordinates of the small hole are not changed, and then secondary laser perforating is conducted through a laser-induced cavitation technology; and in addition, the laser perforating device capable of improving the conical degree and the inner wall quality of the hole is designed and comprises a power box, an uncovered cuboid container, a laser head, a laser guide pipe, a CCD camera, a laser device, a z-direction moving mechanism, a fixing clamp device, an x-y moving platform and a rotatable clamp device. According to the laser perforating device and the method thereof, the mode of conducting laser perforating in air and the mode of conducting laser perforating in water are coupled, secondary perforating is completed by turning over the workpiece so that the conical degree of the hole can be improved, the laser perforating technology and the laser-induced cavitation technology are combined in the secondary perforating process, and the inner wall of the hole is strengthened by impact waves generated through cavitation.
Owner:JIANGSU UNIV

A production method for an electroformed stencil with mark points

The present invention relates to a production method for an electroformed stencil with mark points, including the production of the electroformed stencil and the production of the mark points. The production method is characterized by comprising the steps of: placing the fixed electroformed stencil on a cutting base platform; selecting any two openings diagonally positioned on the electroformed stencil, reading coordinates of specific points of the openings, positioning the electroformed stencil through the coordinates of specific points, and determining coordinates of the mark points via comparing with an original file; adjusting cutting parameters and the vertical height of a laser cutting head to enable a laser focus to fall on the surface of the electroformed stencil; and emitting laser light through the laser cutting head to perform cutting at the mark point area on the surface of the electroformed stencil. According to the production method for the electroformed stencil with mark points, the obtained electroformed stencil has good surface quality, no pinholes or pittings, thereby improving printing quality; and the mark points have high positioning accuracy, and relatively high degrees of recognition, improving alignment accuracy of a PCB with the electroformed stencil.
Owner:KUN SHAN POWER STENCIL

A laser drilling device and method for improving hole taper

ActiveCN105904105BImprove taperOvercoming problems that require extremely high motion precision requirementsLaser beam welding apparatusOptoelectronicsLaser beams
The invention discloses a laser drilling device capable of improving hole taper. The laser drilling device comprises a laser generator and further comprises a reflection unit and a reflection regulating mechanism, wherein the laser generator is fixedly arranged on one side of a workpiece in a relative manner; the reflection unit and the reflection regulating mechanism are arranged on the other side of the workpiece; after the laser generator machines a through hole with a taper in the workpiece, the laser beams penetrate through the through hole, fall on the reflection plane of the reflection unit, and finally fall on the circumference and the inner wall of the through hole after being reflected on the reflection plane; the reflection regulating mechanism drives the reflection unit to move to enable the reflected laser beams to fall on different positions of the circumference and the inner wall of the through hole so as to gradually eliminate the taper in the through hole. Only the same laser generator is adopted to machine the target workpiece and improve dimensionality of the target workpiece so as to avoid the defects of complicated device, higher cost and difficulty in control caused by introduction of a magnetic field, a flow field and other energy fields, and simplify installation and application.
Owner:GUANGDONG UNIV OF TECH

A cone machine

The invention discloses a tapered pipe machine. The tapered pipe machine comprises an engine base, a main shaft and an idler wheel, wherein the main shaft comprises a mould part and a power part; a mould cavity is formed in the radial direction of the mould part, and is internally provided with a mould plate; the main shaft is sleeved with the idler wheel; the mould plate comprises an impacting plate and a striking plate; the impacting plate is mounted in the mould cavity and can slide along the radial direction of the main shaft; the mould part is provided with a mould hole; the power part is provided with a positioning hole; the mould hole and the positioning hole are separated by a separation plate; a plurality of adjusting holes are formed in the axial direction of the main shaft; the striking plate is provided with a positioning part and is arranged inside the mould hole along the adjusting holes and the positioning part penetrates through the separation plate to enter the positioning hole; the positioning hole is internally provided with a positioning mechanism; the positioning mechanism can drive the striking plate to move along the axial direction of the main shaft; an oil inlet is formed in one side of the engine base and an oil outlet is formed in the other side of the engine base; lubricating oil can flow in a space between the main shaft and the idler wheel. The tapered pipe machine has the advantages of convenience for adjustment, simple structure and low noises.
Owner:NINGBO LEBO INTELLIGENT MACHINERY
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