Laser punching method and device for metal

Abstract

The embodiment of the invention belongs to the technical field of laser machining and relates to a laser punching method and device for metal. The laser punching method comprises the steps that a laser beam is positioned to the machining hole position of a target machining hole and output, and the machining hole position is hollowed out according to a first laser punching trajectory chart; after hollow-out machining, redundant leftover materials in the target machining hole are removed in a laser filling mode, a transition machining hole is formed, and the hole diameter of the transition machining hole is smaller than that of the target machining hole; and the edge of the transition machining hole is reshaped according to a second laser machining trajectory chart, and the target machininghole is formed. The laser punching device is used for executing the laser punching method and comprises an electrical control part, a laser, a beam expanding mirror, a galvanometer system, a telecentric focusing lens, a working platform and a cleaning device. According to the laser punching method and device, the machining efficiency can be improved effectively, thermal deformation is prevented from occurring to a machined product, and meanwhile the circular degree and taper of the hole are effectively improved.

Description

technical field [0001] The embodiments of the present invention belong to the technical field of laser processing, and in particular, relate to a method and equipment for laser drilling of metal. Background technique [0002] The existing process of laser drilling holes in metal usually uses the filling method of the software itself or the method of superimposing energy at a single point to control the laser to form a high-energy-density light and heat source after being focused by a common focusing mirror. Gasification evaporation punching. [0003] During the process of realizing the present invention, the inventor found that the prior art has at least the following problems: [0004] 1. The processing efficiency is slow, such as figure 1 As shown in the figure, the existing processing technology relies on the method of laser filling line segment or the method of superimposing energy at a single point to accumulate energy, removing metal substances in the processing hole...

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Problems solved by technology

[0004] 1. The processing efficiency is slow, such as figure 1 As shown, the existing processing technology relies on the method of laser filling line segments or the method of superimposing energy at a single point to accumulate energy, remove the metal substances in the processing hole layer by layer, and the processing time is long;

[0005] 2. The processed product is easy to deform, because the processing time is too long, the processed product cannot get effective heat dissipation, and the processed product has already deformed before the processing hole reaches a certain roundness;

[0006] 3. Due to the difference in the incident angle of the laser, there is a difference in the aperture of the edge and the center of the processed hole, resulting in a difference in the roundness of the aperture. Different hole tapers

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