Device and method for auxiliary laser back etching of low-taper glass deep hole by means of liquid flowing coating

Abstract

The invention discloses a device and method for auxiliary laser back etching of a low-taper glass deep hole by means of a liquid flowing coating, and belongs to the field of laser machining in non-traditional machining. The device comprises a laser chemical combined machining system and a control system. The problem that the laser absorption efficiency of transparent hard and brittle material is low is solved. By adopting an alkaline solution added with a colorant, the laser absorptivity of the material machining region can be increased, and the material internal stress accumulation can be reduced. Compared with the prior art that a common solid coating can only achieve the effect at the moment of laser impact, the liquid flowing coating can achieve self-adaptation laser machining of marks, the coating can achieve the continuous effect along with depth changes of laser drilling, and the coating is particularly applicable to machining deep holes. The method sufficiently utilizes the laser pre-machining front face effect, compared with existing methods, the method is low in cost, the deep hole taper can be remarkably lowered, the deep hole wall quality is improved, and the laser energy utilization rate is increased.

Description

technical field [0001] The invention belongs to the field of laser processing in special processing, and relates to a device and method for processing low-taper glass deep holes by liquid flow coating assisted laser back-facing wet etching. Background technique [0002] With the development of industry, the micromachining of transparent hard and brittle materials represented by glass is becoming more and more important, among which glass deep hole processing is a difficult point in technology and manufacturing. Due to the fact that hard and brittle materials are easily broken during the process of machining holes, such as the traditional machining drilling method, it is very easy to crack the entire material, which has the disadvantages of relatively low yield, serious pollution, long processing time and poor processing accuracy. ; And laser processing has gradually become the mainstream processing method of micro-processing due to its advantages of high efficiency and high ...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of low laser absorption efficiency of transparent hard and brittle materials, the present invention proposes a liquid flow coating assisted laser backside wet etching method to improve the taper of deep holes. The severe effect leads to large edge chipping on the upper surface, and with the layered scanning from top to bottom, thermal stress and compress

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