Method and device for excimer laser processing tapered micropores

A technology of excimer laser and excimer laser, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of small taper of tapered hole, micro-needle tip that cannot meet the requirements of medical applications, and large bottom hole diameter and other problems, to achieve the effect of high reliability, high machining accuracy, and good surface quality.

Inactive Publication Date: 2018-11-20
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The existing method of laser processing tapered microholes, the tapered hole obtained has a small taper and a large bot

Method used

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  • Method and device for excimer laser processing tapered micropores
  • Method and device for excimer laser processing tapered micropores
  • Method and device for excimer laser processing tapered micropores

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Embodiment Construction

[0026] Below in conjunction with accompanying drawing, the technical details of the method and device proposed by the present invention are described in further detail:

[0027] refer to figure 1 , a processing device for excimer laser processing tapered microholes proposed by the present invention includes: computer and control software, indicating light, excimer laser, mask and mask exchange table, 248nm band high reflectivity reflector, focusing projection Objective lens, sample placement stage, three-dimensional electronically controlled displacement stage and motor driver.

[0028] The invention can process excimer laser on the organic glass PMMA sheet to process the tapered microholes with better taper.

[0029] The specific steps of excimer laser processing tapered holes on plexiglass PMMA include:

[0030] (1) Calibrate the optical path structure of the excimer laser processing system, and judge whether the indicator light and the laser beam are coaxially coincident...

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Abstract

The invention discloses a method and device for excimer laser processing tapered micropores. The device comprises an indicator light (1), an excimer laser (2), a mask exchange table (3), a mask (4), areflection mirror (5), a focused projection objective (6), a sample placement table (7), a three-dimensional electronically controlled table (8), a motor driver (9) and a computer (10). According tothe method and device, the taper of the micropores is enlarged by changing the size of the mask during the processing, the defects that the taper of fine taper holes is small and is difficult to control at present are overcome, and the purpose of obvious improving of the taper of the micropores is achieved; a gas laser such as the excimer laser is used as a laser light source to process the taperholes, because the gas photon energy is larger than the chemical bond energy among materials, chemical bonds of the materials can be directly broken to achieve cold processing, and the better surfaceprocessing quality is achieved; and the method and device have the advantages that the processing precision and reliability are high, the materials have a high absorption rate of light, and no heat affected zone exists.

Description

technical field [0001] The invention belongs to the technical field of laser micromachining, in particular to an excimer laser machining method and device for machining tapered microholes. Background technique [0002] With the rapid development of modern science, advanced manufacturing technology, biomedicine and other high-tech fields, the demand for precision micro-devices is increasingly urgent. Traditional processing methods can no longer meet people's needs. Laser processing is a relatively popular processing method. In the field of micro-processing, laser processing also has technical advantages that cannot be compared with any other technology. It is different from traditional material processing. It It is a multi-photon absorption process, the nonlinear action process is dominant, and the processing precision is high. The current development of nanosecond pulsed excimer laser is relatively mature. It has the advantages of short wavelength, high single-photon energy...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/06B23K26/08B23K26/60B23K26/70
CPCB23K26/00B23K26/0661B23K26/0884B23K26/60B23K26/70
Inventor 陈涛王争飞单等玉
Owner BEIJING UNIV OF TECH
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