6 results about "Laser micromachining" patented technology

Optical assembly for generating the second and third harmonic frequencies of a laser beam using two optically nonlinear crystals (C1 and C2) placed in a temperature-controlled environment. The first optically nonlinear crystal (C1) converts the fundamental harmonic frequency to the second harmonic, while the second optically nonlinear crystal (C2) converts the fundamental and second harmonics to the third harmonic. The system includes beam intensity attenuation mechanisms using a first half-wave plate (HWP1) and first and second polarizers (P1, P2) that direct the beam according to the user's requirements. Motorized linear shifts (T1, T2) provide switching between harmonic frequency generation modes. Different cuts of the optically nonlinear crystals (C1 and C2) allow for optimization of phase matching and conversion efficiency. This assembly is designed for highly accurate and flexible generation of harmonic laser beams with wide industrial applications, especially in laser micromachining.

This invention belongs to the field of laser micromachining and relates to a coaxial monitoring system for ultrafast laser micromachining. The system includes an ultrafast laser, a beam-splitting plate, a laser focusing lens, an intermediate lens group, a filter, a fixed-magnification telecentric lens, and a high dynamic range camera. The ultrafast laser emits ultrafast laser light. The beam-splitting plate and the laser focusing lens are arranged sequentially from front to back along the optical path of the ultrafast laser. The laser focusing lens focuses the ultrafast laser light onto the workpiece, generating visible monitoring light on the workpiece. The visible monitoring light passes through the laser focusing lens and is reflected by the beam-splitting plate to form reflected visible monitoring light. The intermediate lens group, filter, fixed-magnification telecentric lens, and high dynamic range camera are arranged sequentially from front to back along the optical path of the reflected visible monitoring light. This invention provides a coaxial monitoring system for ultrafast laser micromachining that improves imaging clarity and resolution.

A method of processing a substrate includes disposing the substrate into a liquid-assist medium such that the substrate is in an orientation that is within ten degrees of vertical. The substrate is attached to a mount assembly comprising a window-substrate and one or more spacers located at a surface of the window-substrate. The substrate is attached to the one or more spacers such that a gap is present between a first surface of the substrate and the surface of the window-substrate. The liquid-assist medium is present within the gap and at a back surface of the substrate. The method further includes directing a pulsed laser beam to form a focus spot having an initial position in the liquid-assist medium behind the back surface, and moving the focus spot through a body of the substrate to create a modification that forms a feature.

This invention provides a magnetic field-assisted laser texturing method and apparatus, belonging to the field of laser micromachining. Addressing the problems of poor controllability of texture morphology and susceptibility to metallurgical defects in existing laser texturing methods, this invention applies a controllable magnetic field to the laser processing area. The Lorentz force exerted by the magnetic field on the molten metal in the molten pool influences its flow behavior. By adjusting the strength, direction, and / or alternating frequency of the magnetic field, the height of the texturing protrusions or the depth of the pits, as well as the mechanical properties, can be actively controlled. Furthermore, a quantitative formula relating magnetic induction intensity to morphological characteristics is established. This invention is simple to operate, low in cost, and can significantly improve the consistency of surface texture and the mechanical properties of materials.

This invention provides a laser micromachining system and method. The laser micromachining system includes a laser, a beam expander, a half-wave plate, a one-dimensional aperture stop (AOD), a slit stop, a Dowell prism, a 4f imaging system, and a focusing lens for processing. The laser emits a laser beam; the beam expander expands and collimates the laser beam output from the laser; the half-wave plate adjusts the polarization direction of the incident light; the one-dimensional AOD diffracts the incident laser; the slit stop filters out unwanted diffracted light; the Dowell prism controls the rotation of the outgoing light; the 4f imaging system images the light field distribution from the exit surface of the Dowell prism onto the entrance pupil of the focusing lens; and the focusing lens focuses the laser beam into a focal spot that acts on the processing surface of the sample. This laser micromachining system and method solves the problems of complex structure, difficult control, and low diffraction efficiency in two-dimensional AOD systems, achieving high-speed, high-precision, and adjustable aperture processing of micro-holes.

This invention relates to a method for optimizing ultrafast laser micromachining parameters based on causal enhancement modeling, comprising the following steps: S1, constructing a multi-dimensional dataset for ultrafast laser micromachining and performing hierarchical filtering; S2, mining the dynamic causal relationship between processing parameters and quality indicators and quantifying the causal effect; S3, constructing a dynamic causal enhancement-based micromachining quality prediction surrogate model; S4, establishing a multi-objective particle swarm optimization algorithm with quality priority to optimize processing parameters; S5, experimental verification and iterative parameter optimization. The method provided by this invention achieves intelligent, efficient, and precise optimization of laser processing parameters by constructing a surrogate model with dynamic causal feature fusion and combining it with a multi-objective particle swarm optimization algorithm with quality priority, thereby improving the consistency and stability of micro-hole processing quality.