Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Laser modeling method for semiconductor material micro-nano multi-scale function surface

A surface micromodeling and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, laser welding equipment, nanostructure manufacturing, etc., can solve the problems of high cost, difficult operation, low efficiency, etc., and achieve low cost, high preparation efficiency, and easy operation. simple effect

Inactive Publication Date: 2008-07-16
JIANGSU UNIV
View PDF0 Cites 37 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the technical problems of high cost, low efficiency, difficult operation and the like in the traditional super-hydrophobic functional microstructure surface preparation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser modeling method for semiconductor material micro-nano multi-scale function surface
  • Laser modeling method for semiconductor material micro-nano multi-scale function surface
  • Laser modeling method for semiconductor material micro-nano multi-scale function surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029]Figure 1 is a block diagram of a micro-nano multi-scale functional surface laser micro-modeling system. The laser micro-modeling system mainly includes three parts: a femtosecond laser, an external optical path unit and a micro-modeling unit. The DG535 delay pulse generator connected to the femtosecond laser is used to control the number of laser action pulses, while the power supply and controller are used to control the output of the laser and adjust the laser energy. The vacuum target chamber control box and the gas cylinder connected with the micro-modeling unit are used to set the vacuum degree and control the background gas filling and air pressure respectively. The micro-motion control system is composed of a three-dimensional micro-motion axis, a stepping motor, and a computer connected in sequence , used to scan the surface of the sample in multiple directions.

[0030] Figure 2 is a schematic diagram of the micro-modeling unit when the sample is in a vacuum-fi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a laser shaping method of a multi-scale functional surface of micronano for semiconductor material, relating to micronano material preparation and laser micromachining technical field; the invention aims at providing a method and a device for preparing femtosecond laser of super-hydrophobic functionalization for microstructural surface based on the semiconductor material and through the systematically technical design of multi-scale surface micro-shaping and microstructural surface processing, and realizing optional and controllable preparation of semiconductor material surface having multi-scale microstructure such as micron, submicron and nano. The invention solves the technical problems such as high cost, low efficiency and difficult operation in traditional preparation methods of microstructural surface with super-hydrophobic function.

Description

technical field [0001] The present invention relates to the technical field of micro-nano material preparation and laser micromachining, in particular refers to the micro-nano multi-scale microstructure processing on the surface of semiconductor materials by designing different process schemes and adopting femtosecond laser micromachining technology, and making the material surface The method of obtaining hydrophilic or hydrophobic properties can be applied to various semiconductor materials such as silicon, titanium dioxide, and gallium nitride. Background technique [0002] Semiconductors are widely used in science and technology, industrial and agricultural production and life. Among them, semiconductor devices made of silicon have better high temperature resistance and radiation resistance, and are especially suitable for making high-power devices. Therefore, silicon has become the most widely used additive material, and most of the current integrated circuits are made o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B82B3/00B23K26/00C04B41/53C04B41/45H01L21/302H01L21/461H01L21/268B23K26/12B23K26/122B23K26/352
Inventor 周明李保家蔡兰
Owner JIANGSU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com