A device and method for improving through-hole taper by liquid scattering

Abstract

The invention relates to a device for improving taper of a through hole through liquid scattering. The device comprises a laser generator and further comprises a reflection device and a reflective regulation mechanism, wherein the laser generator is relatively fixedly arranged on one side of a workpiece, and the reflection device and the reflective regulation mechanism are arranged on the other side of the workpiece; the reflection device comprises a cavity for containing a liquid, and the liquid level of the liquid is a reflective plane for reflecting a laser beam; after the laser generator processes the through hole with taper on the workpiece, the laser beam penetrating through the through hole falls to the reflective plane of the reflection device, is reflected through the reflective plane and falls to the hole circumference and the inner wall of the through hole; and the reflection device is regulated through the reflective regulation mechanism to generate ripples with different amplitudes on the reflective plane, so that the laser beam reflected by the reflective plane falls to different positions of the hole circumference and the inner wall of the through hole so as to gradually eliminate taper in the through hole.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a device and method for improving through-hole taper through liquid scattering. Background technique [0002] Laser drilling technology is a technology that uses a laser beam as a heat source and uses a heat removal method to separate materials. In the process of laser drilling, the high-power pulsed laser is focused on the surface of the workpiece, and the material is rapidly heated to the temperature of melting and vaporization, and then under the joint action of the recoil pressure of the rapid accumulation and expansion of the material gas and the pressure of the high-pressure auxiliary gas, The liquid in the molten state on the workpiece is extruded out of the hole, and the above process is continued under the action of the subsequent pulse laser, and the material is continuously removed until a through hole is formed. [0003] Compared with other drilling technologies, lase...

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Problems solved by technology

[0009] To sum up, the hole processed by the existing laser processing method inevitably has a taper, and the existing method can improve the taper of the hole to a certain extent, but there are still disadvantages such as complex device and difficult operation, and there is an urgent need Invent a new method to improve the taper of the hole in laser processing

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