Device and method for processing low-taper glass deep holes by liquid flow coating assisted laser back wet etching

Abstract

The invention discloses a device and method for processing low-taper glass deep holes assisted by liquid flow coating, which belongs to the field of laser processing in special processing, and includes a laser chemical composite processing system and a control system; For the problem of low laser absorption efficiency of brittle materials, the present invention uses an alkaline solution added with dyeing agent, which can improve the laser absorption rate of the material processing area and reduce the internal stress accumulation of the material. Compared with ordinary solid coatings that can only work at the moment of laser shock, the liquid flow coating proposed by this method can adapt to the laser processing marks, and the coating can achieve continuous action with the depth of laser drilling, especially suitable for For machining deep holes. The method makes full use of the positive effect of laser preprocessing, and compared with the existing method, the cost is low, the taper of the deep hole can be significantly reduced, the quality of the wall of the deep hole can be improved, and the energy utilization rate of the laser can be improved.

Description

technical field [0001] The invention belongs to the field of laser processing in special processing, and relates to a device and method for processing low-taper glass deep holes by liquid flow coating assisted laser back-facing wet etching. Background technique [0002] With the development of industry, the micromachining of transparent hard and brittle materials represented by glass is becoming more and more important, among which glass deep hole processing is a difficult point in technology and manufacturing. Due to the fact that hard and brittle materials are easily broken during the process of machining holes, such as the traditional machining drilling method, it is very easy to crack the entire material, which has the disadvantages of relatively low yield, serious pollution, long processing time and poor processing accuracy. ; And laser processing has gradually become the mainstream processing method of micro-processing due to its advantages of high efficiency and high ...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of low laser absorption efficiency of transparent hard and brittle materials, the present invention proposes a liquid flow coating assisted laser backside wet etching method to improve the taper of deep holes. The severe effect leads to large edge chipping on the upper surface, and with the layered scanning from top to bottom, thermal stress and compressive stress will continue to accumulate inside the glass, which will damage the surface quality of the entrance and exit; while the laser processes the workpiece from the bottom surface upwards , the non-focused laser will penetrate the glass, and the impact pressure will not be superimposed inside, so the laser back etching can obtain better surface quality of deep holes to a certain extent

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