141results about How to "Improve slice quality" patented technology

The invention provides a method for cutting a transparent material by using ultra-short pulse laser. The ultra-short pulse laser output by an ultra-short pulse laser generating device is condensed by a condensation device so as to form a bunching laser beam; the bunching laser beam enters from the surface of the transparent material to be machined, so that the center refractive index at a laser application point is increased to form a waveguide structure along a laser emitting direction; the laser is transmitted to the inside of the transparent material along the waveguide structure, and continuously generates a waveguide structure along the laser emitting direction in a transmission process until the entire waveguide structure and the laser penetrate through the transparent material; and therefore, the laser moves in a direction which is vertical to the surface of the transparent material at uniform speed, so that a waveguide plane is formed in the transparent material. The invention further provides a device for cutting the transparent material by using the ultra-short pulse laser. The method and the device for cutting the transparent material by using the ultra-short pulse laser provided by the invention have the advantages of fast cutting speed, small cutting seam, no material consumption and no powder pollution. When the machined material bears a suitable external force, the material is cracked only along a stress fault surface; the broken surface nearly has no conical degree; and the roughness is good.