Numerical control diamond wire sapphire slicing machine

A diamond wire and sapphire technology, applied in the field of CNC diamond wire sapphire slicer, can solve the problems of difficult slicing process, decreased product quality, difficult sapphire processing, etc.
CN103950122AActive Publication Date: 2014-07-30WUXI SHANGJI AUTOMATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUXI SHANGJI AUTOMATION
Publication Date
2014-07-30

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Abstract

The invention provides a numerical control diamond wire sapphire slicing machine. According to the numerical control diamond wire sapphire slicing machine, the sawing process is simplified, the machining efficiency of the slicing machine is improved and the quality of a finished product is high, therefore, the aims of reducing production cost and improving economic benefits are fulfilled. The numerical control diamond wire sapphire slicing machine comprises a machine frame, wherein a feeding mechanism is arranged on the machine frame; two leading wire guide wheel structures are arranged on the machine frame and correspond to the feeding mechanism; diamond wires are wounded on the two leading wire guide wheel structures at intervals in sequence; cooling and lubricating spraying nozzles are correspondingly mounted above the leading wire guide wheel structures on the machine frame; a take-up winding device and a pay-off winding device are respectively arranged on the two sides of each leading wire guide wheel structure on the machine frame. The numerical control diamond wire sapphire slicing machine is characterized in that a swinging mechanism is arranged on the feeding mechanism.
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Description

technical field

[0001] The invention relates to the technical field of CNC machine tool automation, in particular to a CNC diamond wire sapphire slicer. Background technique

[0002] In the field of LED manufacturing, there are currently only two kinds of substrates that can be used for commercialization, namely sapphire and silicon carbide substrates, but silicon carbide substrates are expensive. Therefore, 80% of global LED companies use sapphire as the main raw material for manufacturing LED products. Due to the high hardness of sapphire, it is difficult to process; especially the slicing process is more difficult. Ordinary sapphire slicers will have many problems during the working process, causing product quality to decline or even scrapped. Contents of the invention

[0003] Aiming at the above problems, the present invention provides a numerically controlled diamond wire sapphire slicer, which simplifies the sawing process, improves the processing efficiency of th...

Claims

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