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Method and device for cutting transparent material by using ultra-short pulse laser

A technology of ultra-short pulse laser and transparent materials, applied in glass cutting devices, fine working devices, laser welding equipment, etc., can solve the problems of slow cutting speed, rough cutting surface, etc., achieve deep cutting depth, good cutting surface quality, small kerf effect

Active Publication Date: 2015-04-01
WUHAN JUNNO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The cutting speed of this method is slow, and the cutting surface is rough, and the impact of laser shock on the surrounding of the cutting groove still exists

Method used

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  • Method and device for cutting transparent material by using ultra-short pulse laser
  • Method and device for cutting transparent material by using ultra-short pulse laser
  • Method and device for cutting transparent material by using ultra-short pulse laser

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Effect test

Embodiment 1

[0053] Please refer to Figure 5 , the present embodiment adopts the picosecond laser ultrashort pulse laser generating device-picosecond laser 8 of high repetition rate, in the present embodiment, can adopt two kinds of different picosecond lasers, and a kind of is that the repetition frequency Fcon is 15 megahertz , a picosecond laser with a maximum average output power of 100W and a single pulse width of 12ps, the pulse is modulated by an external electro-optical switch, and the modulation frequency Frep is 1 Hz to 1 MHz. The modulation pulse width Wt can be controlled between 20 nanoseconds and 2 microseconds, so that each trigger signal can output 1-12 laser pulses. The other is the seed source output frequency Fseed and 50 MHz, with two high-frequency electro-optic switches inside and outside the laser cavity for modulation, the average output power Po is 50W, and the repetition frequency Frep is 400 kHz to 1 MHz. For a laser with a width of 8ps, each trigger signal pul...

Embodiment 2

[0059] The basic structure is similar to Embodiment 1, the difference is that in the laser transmission optical path, the laser is divided into two beams A and B through the beam splitter 14, the A beam accounts for between 15-40% of the laser output power, and the A and B beams respectively use The diopter-adjustable beam expander 15 expands the beam, and then adds a 1 / 2 wave plate 16 on the A beam path to deflect the laser polarization direction by 90 degrees, and then combines the A and B beams into one beam through the polarization beam splitter prism 18, and then uses 4. The wave plate 19 converts the laser linear polarization into circular polarization.

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Abstract

The invention provides a method for cutting a transparent material by using ultra-short pulse laser. The ultra-short pulse laser output by an ultra-short pulse laser generating device is condensed by a condensation device so as to form a bunching laser beam; the bunching laser beam enters from the surface of the transparent material to be machined, so that the center refractive index at a laser application point is increased to form a waveguide structure along a laser emitting direction; the laser is transmitted to the inside of the transparent material along the waveguide structure, and continuously generates a waveguide structure along the laser emitting direction in a transmission process until the entire waveguide structure and the laser penetrate through the transparent material; and therefore, the laser moves in a direction which is vertical to the surface of the transparent material at uniform speed, so that a waveguide plane is formed in the transparent material. The invention further provides a device for cutting the transparent material by using the ultra-short pulse laser. The method and the device for cutting the transparent material by using the ultra-short pulse laser provided by the invention have the advantages of fast cutting speed, small cutting seam, no material consumption and no powder pollution. When the machined material bears a suitable external force, the material is cracked only along a stress fault surface; the broken surface nearly has no conical degree; and the roughness is good.

Description

technical field [0001] The invention discloses a transparent material cutting method and cutting device using ultrashort pulse laser. Background technique [0002] In the current transparent substrate or wafer processing, the method of cutting with a grinding wheel or scribing with a diamond knife is mainly used to fracture with a mechanical roller, and the cutting speed is up to 30mm / s. The main disadvantage of this method is that the quality of the cutting edge produced is poor, a large amount of debris will be generated and a large amount of deionized water is required, and deionized water will cause environmental pollution. Although deionized water can be refined and recycled, it still cannot avoid pollution at the same time It will also increase operating costs. [0003] In addition, the current display industry has gradually begun to use annealed strengthened glass in large quantities, and cutting with a diamond knife or a grinding wheel will cause stress defect point...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/064C03B33/02B28D5/04B23K26/06
CPCY02P40/57
Inventor 王辉文郭琛
Owner WUHAN JUNNO TECH
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