Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for cutting ultrathin dimension stone in large specification by using small circular saw blade

A circular saw blade and large-scale technology, which is used in the field of cutting large-scale ultra-thin stone with a small circular saw blade, can solve the problem that the thickness uniformity of ultra-thin stone is not ideal, the performance is difficult to be greatly improved, and it is difficult to process ultra-thin stone. Plate and other problems, to achieve the effect of low breakage rate, large reduction in production cost, and reduction in geometric size

Inactive Publication Date: 2008-05-14
翦凝刚
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The larger the diameter of the circular saw blade, the thicker the thickness, the larger the gap for cutting stone, the greater the resistance, the greater the power consumption, and the greater the waste of stone.
Of course, the unit price of the product is higher, that is, the ultra-thin stone plate processed by the existing cutting method has a high product price, which makes it difficult for many people to accept it.
At the same time, the greater the radial runout and end face runout of the circular saw blade, the less uniform the thickness of the cut ultra-thin stone, and it is difficult to process ultra-thin stone plates with a large area and thinner thickness (for example, according to public information, Liaoning The thickness of the 3000mm×1500mm thin stone plate produced by a certain company is still not less than 5.5mm)
[0013] On the other hand, the current production of synthetic diamond circular saw blades is limited by the characteristics of the metal itself, and it is difficult to greatly improve the performance. Therefore, it is not possible to overcome the defects of the above cutting methods by improving the circular saw blade itself. realistic

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for cutting ultrathin dimension stone in large specification by using small circular saw blade
  • Method for cutting ultrathin dimension stone in large specification by using small circular saw blade
  • Method for cutting ultrathin dimension stone in large specification by using small circular saw blade

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0033] like figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 Shown, the present invention cuts the method for large-scale ultra-thin stone plate with small circular saw blade, and its processing steps are as follows:

[0034] (1) According to the sum of the thicknesses of two stone slabs 18,17 to be obtained plus the thickness of the circular saw blade 2 plus the thickness of the circular saw blade 2 end face runouts, select the thickness of the required double-sided polished stone slab 1. For example: a double-sided polished 1600mm×800mm stone slab 1 is to be cut into one 1600mm×800mm×2mm and four 1600mm×200mm×4mm stone slabs. The circular saw blade 2 of Φ500mm can be selected, the thickness of the circular saw blade 2 is 4mm, and the end face runout is 0.5mm, so the kerf 19 is 4.5mm, and the thickness of the selected stone plate 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for preparing a large-area super-thin stone material by use of small circular saw blade includes such steps as cutting on the big stone slab according to the sizes of needed small stone slabs to form multiple ditches, fixing the big stone slab to the bench of a horizontal cutting machine, sucking the first needed small stone strip by a sucking unit, using small circular saw blade to saw the big stone slob for separating the first small stone strip from the big one, repeating said steps until all small stone strips are separated to obtain a large-area super-thin stone material and several small super-thin stone strips. Said horizontal cutting machine is also disclosed.

Description

Technical field: [0001] The invention relates to a method for cutting ultra-thin stone materials, specifically a method for cutting (processing) large-sized ultra-thin stone (plate) materials with a small (sized artificial diamond) circular saw blade. Background technique: [0002] Since the 1990s, ultra-thin (so-called ultra-thin, defined internationally as its thickness less than 8 mm) stone (including granite and marble) panels have gradually replaced artificial tiles with their natural and gorgeous natural colors and patterns. The main force of decorative materials. [0003] Cutting (processing) ultra-thin stone slabs at home and abroad generally adopt the following methods: cutting with frame saws and band saws. Due to low processing efficiency and high processing costs, and band saws cannot cut granite, and frame saws are too bulky, Therefore, the above methods have been gradually eliminated; while the beaded wire saw is more suitable for heterosexual stone processing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/32B28D1/04B28D7/04
Inventor 翦凝刚
Owner 翦凝刚
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products