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Multi-row lead frame electroplating equipment

A technology of multi-row lead wires and electroplating equipment, applied in the direction of electrolysis process, electrolytic components, etc., can solve the problems of electroplating solution leakage, inability to electroplate multi-row lead frames, etc.

Pending Publication Date: 2018-08-10
ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional lead frame electroplating equipment can only electroplate single or double row lead frames at a time, but cannot electroplate multiple rows of lead frames
If multiple rows of lead frames are directly plated, there will be leakage of the plating solution

Method used

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  • Multi-row lead frame electroplating equipment
  • Multi-row lead frame electroplating equipment
  • Multi-row lead frame electroplating equipment

Examples

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Embodiment Construction

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening ele...

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Abstract

The invention relates to multi-row lead frame electroplating equipment. The multi-row lead frame electroplate equipment comprises a mold, a pressing device, a sheet feeding wheel, a sheet dischargingwheel and an anode nozzle arranged in the mold. The mold comprises a mold body, a plurality of mold belts and at least two rows of mold nail groups, wherein the mold body is rotatable, the mold beltsare arranged on the outer peripheral wall of the mold body, and the mold nail groups are arranged on the outer peripheral wall of the mold body at intervals. The mold body is provided with a pluralityof groups of electroplating areas which can simultaneously complete electroplating of a multi-row lead frame, thereby effectively improving the electroplating efficiency of the lead frame and reducing the electroplating cost. The pressing device presses the multi-row lead frame on the periphery of the mold, mold pins are used for penetrating through positioning holes in the multi-row lead frame to position the lead frame, so that the lead frame can be tightly adhered to the mold body to prevent electroplating solution from leaking, and the electroplating effect is good.

Description

technical field [0001] The invention relates to the technical field of lead frame electroplating, in particular to a multi-row lead frame electroplating equipment. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. In order to ensure the chip loading and bonding performance in the packaging process, and to form a good diffusion bonding between the chip and the wire and the lead frame, it is necessary to carry out special surface on the chip mounting and bonding areas (lead pins and small islands...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D5/08C25D17/00
CPCC25D5/08C25D7/0607C25D17/00
Inventor 刘国强徐卉军
Owner ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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