Oscillating diode electroplating machine

An electroplating machine and diode technology, which is applied to circuits, electrolytic processes, electrolytic components, etc., can solve the problems of unqualified quality, bent leads of diodes, and unstable coefficient of variation of diodes, and achieves the effect of uniform plating thickness and less coefficient of variation.

Inactive Publication Date: 2018-01-05
张晓宇
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the electroplating method in the prior art is easy to bend the lead wire of the diode, and the thickness of the electroplating layer is uneven during electroplating, and the coefficient of variation of the diode is large and unstable, which easily causes the problem of unqualified quality.

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  • Oscillating diode electroplating machine

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Embodiment Construction

[0012] Attached below figure 1 The present invention will be further described with specific embodiments.

[0013] Such as figure 1 Shown, the present invention: the oscillating diode electroplating machine is composed of electroplating machine body 1, electroplating tank 2, variable resistance box 13, hydraulic lifting shaft 16, oscillator 17, transmission vibration shaft 16, oscillating electroplating motor 6, vibrating screen 14 and Composed of conductive nails 10, it is characterized in that: the lower end of the electroplating machine body 1 is provided with an electroplating tank 2, the bottom of the electroplating tank 2 is provided with a conductive nail 10, and the upper end of the electroplating machine body 1 is provided with an oscillating electroplating motor 6. The motor 6 is fixedly connected to the oscillator 17, the lower end of the oscillator 17 is connected to the upper end of the hydraulic lifting shaft 16, the lower end of the hydraulic lifting shaft 16 i...

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Abstract

The invention discloses an oscillating diode electroplating machine, which is composed of an electroplating machine body, an electroplating tank, a rheostat box, a hydraulic transmission shaft, an oscillator, a vibration transmission shaft, an oscillating electroplating motor, a vibrating screen and conductive nails. The electroplating machine body The lower end is provided with an electroplating tank, the bottom of the electroplating tank is provided with conductive nails, the upper end of the electroplating machine body is provided with an oscillating electroplating motor, the oscillating electroplating motor is fixedly connected to the oscillator, the lower end of the oscillator is connected to the upper end of the hydraulic lifting shaft, and the lower end of the hydraulic lifting shaft is connected to the vibration transmission shaft. The upper end of the shaft is connected, the lower end of the vibration transmission shaft is connected with the vibrating screen, and a rheostat box is installed on the oscillating electroplating motor. The beneficial effect of the above technology is to adopt an oscillating electroplating machine, two oscillators, two hydraulic lifting shafts and a rheostat box. The lifting shaft drives the vibrating screen from top to bottom. The thickness is uniform, the coefficient of variation is small, and the electroplating efficiency can be improved by increasing the current to increase the rotation speed of the oscillating electroplating machine.

Description

technical field [0001] The invention relates to the field of electroplating machines, in particular to an oscillating diode electroplating machine. Background technique [0002] Diode lead electroplating machine has methods such as barrel plating and rack plating. Plating is suitable for electroplating of small parts that cannot be or are not suitable for hanging due to factors such as shape and size. It adopts rack plating or basket plating for early small parts electroplating. Compared with it, it saves labor, improves labor production efficiency, and greatly improves the surface quality of the plated parts. Rack plating is that the workpiece is clamped on the rack, which is suitable for large parts. The number of products that can be plated in each batch is small, and the thickness of the coating is 10 μm. above process. However, the electroplating method in the prior art is easy to bend the lead wire of the diode, and the thickness of the electroplating layer is uneven ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/16C25D5/20C25D7/12C25D21/12
Inventor 张晓宇
Owner 张晓宇
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