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Through hole electroplating and filling method and preparation method of printed circuit board

A through-hole electroplating and pulse electroplating technology, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve the problems of core board thickness exceeding 10mil, poor use effect, and no starting point of plating, etc., and achieve good heat dissipation and connectivity effect, increased plating efficiency, and the effect of avoiding filling voids

Active Publication Date: 2020-12-04
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process is prone to drill deviation on both sides (such as figure 2 As shown) and the thickness of the core board exceeds 10mil, poor hole shape and other problems, resulting in poor subsequent use effect
At present, there is no direct filling and leveling process of mechanical hole filling. The main reason is that the wall of the mechanical drilling hole is flat, and the additives in the hole filling potion cannot form a significant gradient difference after adsorption, that is, there is no starting point for plating, and it cannot be filled and leveled.

Method used

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  • Through hole electroplating and filling method and preparation method of printed circuit board
  • Through hole electroplating and filling method and preparation method of printed circuit board
  • Through hole electroplating and filling method and preparation method of printed circuit board

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Embodiment 1

[0044] Embodiment 1 of the present invention is: a through-hole electroplating filling method, such as image 3 shown, including the following steps:

[0045] 1) Through-holes are formed on the substrate to be plated by mechanical drilling, and the substrate to be plated after the through-holes are formed is placed in the pulse plating solution for reversing pulse electroplating. The results are as follows Figure 4 The electroplating layer shown (in the figure, the diameter distance of the through hole is 113.07 μm, and the copper thickness of the hole is 24.45 μm). Among them, the composition and content of the pulse plating solution are as follows: 150g / L CuSO 4 ·5H 2 O, 95mL / L sulfuric acid (added with commercially available 98.3% sulfuric acid solution), 64ppm Cl -, 150ppm inhibitor (copolymer of polyethylene glycol and polypropylene glycol, average molecular weight 800), 80ppm first leveler (polypropyleneimine, average molecular weight 1800), 5ppm accelerator (sodium ...

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Abstract

The invention discloses a through hole electroplating and filling method and a preparation method of a printed circuit board. The through hole electroplating and filling method comprises the followingsteps: S1, carrying out reversing pulse electroplating on a to-be-plated substrate with a through hole by utilizing pulse electroplating liquid; and S2, carrying out hole filling treatment on the through hole treated in the step S1. Wherein the pulse electroplating solution contains metal ions to be plated, halogen ions and an accelerator, the accelerator comprises organic sulfonate, and the concentration c of the organic sulfonate meets the following relational expression: c is equal to or more than 1 ppm and less than 8 ppm; and the reversing pulse electroplating adopts PPR square wave current with at least one turn-off time, and the single turn-off time ranges from 20 ms to 80 ms. According to the scheme, the pulse electroplating liquid is combined with PPR electroplating to realize the situation that the electroplating efficiency in the middle of the hole is higher than that in a hole opening and surface copper in the electroplating process, so that protrusions exist on the surface of the copper in the hole, plating starting points are provided for hole filling lotion, and then electroplating hole filling is achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board preparation, in particular to a through-hole electroplating and filling method and a method for preparing a printed circuit board. Background technique [0002] Printed circuit boards (PCB), also known as printed circuit boards, are providers of electrical connections for electronic components. With the development of electronic products in the direction of miniaturization, convenience, and intelligence, the assembly density and integration of components on printed circuit boards also increase. Especially with the development of 4G and 5G communication technologies, the signal transmission volume, transmission The requirements for speed and transmission distance are getting higher and higher. As the main carrier of electronic signal transmission, printed circuit boards are also developing towards high frequency, high power, miniaturization, and high-density concentration of component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/18C25D7/00C25D3/38C25D5/02H05K3/42
CPCC25D3/38C25D5/02C25D5/18C25D7/00H05K3/424
Inventor 赵刚俊何思良刘梦茹
Owner DONGGUAN SHENGYI ELECTRONICS
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