92 results about "Pulse electroplating" patented technology

The invention discloses a pulse electroplating detection method, a pulse electroplating device and equipment, and the method comprises the steps: synchronously collecting transient current density data of a three-pole assembly in a pulse switching time window, and calculating a time derivative of a current density ratio to obtain electrochemical stress gradient data; performing space-time correlation analysis on the stress gradient data of the continuous pulse period, and tracking a spatial propagation trajectory of stress anomaly; a key monitoring area is determined according to the propagation trajectory, and ion migration impedance sensitivity distribution is detected through micro-amplitude current modulation; performing multi-dimensional coupling analysis on the stress gradient, the propagation trajectory and the impedance sensitivity data, and identifying time sequence correlation characteristics of stress evolution and ion anomaly; and performing quantitative evaluation and grade division on the electrochemical state of the avoidance area based on the coupling correlation characteristics. According to the scheme, early recognition and predictive evaluation of the ion migration abnormity of the boundary layer of the avoidance area can be realized in the pulse electroplating process, and the electroplating quality control precision and the process stability are remarkably improved.

The invention provides a gradient composite graphene electrolysis electrode plate and an in-situ preparation method thereof. The electrode plate comprises a metal conductive base material (such as titanium alloy), a porous ceramic skeleton layer (Al2O3-40% ZrO2, the porosity of which is 30 + / -5%), a chemical copper plating layer for filling pores, an electroplated nickel-ruthenium alloy catalytic layer (Ni: Ru = 9: 1) and 3-5 graphene functional layers (ID / IG is less than or equal to 0.08) grown in situ, wherein the porous ceramic skeleton layer (Al2O3-40% ZrO2) is laser-cladded on the surface of the porous ceramic skeleton layer (Al2O3-40% ZrO2). The preparation method comprises the following steps: performing laser cladding on a ceramic skeleton, wherein the power density is 300-500W / mm < 2 >, and sintering at 1600 DEG C to form metallurgical bonding; gradient plating: electroless copper plating (containing nano-diamond enhancement) and pulse electroplating of Ni Ru (duty ratio is 1: 5); and performing directional CVD growth: after reducing the catalyst layer by H2 at 1050 DEG C, introducing CH4 / H2 (the volume ratio is 1: 4) in a pulse manner, and realizing full coverage of the inner wall of the mesh by vortex air intake. The technical effects are as follows: (1) the overpotential of chlorine evolution in saturated salt water at 80 DEG C is as low as 268mV (1A / cm < 2 >); (2) strong acid environment service life gt; the time is 100 thousand hours (12 times that of the national standard); (3) the production cost is lt; and 620 / m < 2 > (90% lower than that of a traditional ruthenium-iridium coating). The problems of graphene transfer damage and special-shaped electrode covering are solved.

The invention belongs to the field of welding wire preparation, and particularly relates to a method for preparing an ODS steel welding wire based on a spray deposition and electric arc melting combined process. According to the technical scheme, the preparation method comprises the following steps: performing surface modification on Y2O3 particles and Fe powder to prepare mixed powder; an ODS alloy is smelted through a closed double-cabin smelting-injection system; during spray deposition, the preheated mixed powder is loaded; performing electric arc melting to form a nano oxide dispersed phase and strictly controlling the oxygen content of the ingot blank; the ingot blank is subjected to temperature equalization before forging, and H2 / Ar mixed gas is introduced; high-temperature rough rolling and low-temperature finish rolling are adopted for hot rolling strengthening; carrying out solid solution and two-stage aging composite heat treatment; hot drawing wire forming is matched with gradient annealing and protective atmosphere; and carrying out surface treatment through pulse copper electroplating or anti-oxidation layer spraying. According to the method, alloy components and microstructures can be accurately regulated and controlled, the problems of strengthening phase distribution and machining defects can be efficiently solved, and the strict requirements for high performance and high reliability of ODS steel welding wires in the fields of nuclear reactors, aerospace and the like are met.

The invention discloses an efficient and uniform electroplating manufacturing method of a thick copper plate. The efficient and uniform electroplating manufacturing method comprises the following steps: step 1, carrying out chemical oil removal treatment and micro-etching coarsening on a substrate; step 2, carrying out pre-impregnation treatment and manufacturing a mask; 3, a pulse electroplating device is adopted for carrying out edge auxiliary electroplating on the plate edge, and 4, plating solution closed-loop regulation and control are carried out, specifically, a regulation and control system is provided, the regulation and control system comprises a plating solution regulation and control device and an automatic compensation module, and a PLC control system controls the automatic compensation module to quantitatively supply additives according to the difference between a detection value and a required value. According to the method, the electric field intensity of the edge and the center of the substrate is balanced, the thickness uniformity of the copper layer is remarkably improved, and the thickness difference between the edge and the center is reduced; and the deposition rate stability of pulse electroplating is ensured. And meanwhile, the working efficiency is improved, the electroplating time is shortened, the energy consumption is reduced, the dosage of an electroplating additive is reduced, the service life of an electroplating solution is prolonged, the binding force of a copper layer and a substrate is improved, practicability is high, and high popularization significance is achieved.

The invention provides a pulse-direct current electrochemistry composite deposition process of a nickel-tungsten-phosphorus alloy coating, and belongs to the technical field of coating preparation, and the pulse-direct current electrochemistry composite deposition process comprises the following steps: carrying out silane coupling agent modification treatment on alpha-aluminum oxide; carrying out modification treatment on the hexagonal boron nitride nanosheet by adopting hexadecyl trimethyl ammonium bromide; carrying out polyacrylic acid modification treatment on the nano silicon dioxide; nickel salt, tungsten salt, phosphorus salt, a complexing agent, a buffering agent, a primary brightener, a secondary brightener, a wetting agent, modified aluminum oxide, modified boron nitride, modified silicon dioxide and deionized water are mixed, stirred and heated, and a composite plating solution is obtained; the substrate serves as a cathode, pulse current is applied to the substrate for pulse electroplating, then the current density of the pulse current is continuously and linearly reduced to a target value, and finally direct current electroplating is conducted under the target value; by optimizing the formula of the composite plating solution and the pulse-direct current composite electroplating process, the nickel-tungsten-phosphorus alloy composite plating layer with high hardness, low friction, high wear resistance and corrosion resistance is finally obtained.

The invention relates to the technical field of semiconductor packaging and micromachining, in particular to a defect-free electroplating filling method and system for a high-aspect-ratio glass through hole. The method comprises the following steps: preparing an ultrathin and compact copper seed composite layer with strong binding force on the inner wall of a glass through hole by adopting an atomic layer deposition (ALD) technology; preparing an electroplating solution containing a specific additive system; and implementing a segmented pulse electroplating strategy, and realizing defect-free copper filling from the bottom to the top of the through hole by regulating and controlling the current density, the pulse width and the intermittent time in stages and combining a reverse pulse technology. The system integrates ALD deposition, pulse electroplating and an electroplating liquid circulation system, and high precision and high yield in the filling process are ensured. The method effectively solves the problems of insufficient seed layer coverage, limited mass transfer, cavity / suture defects and the like in the filling of the glass through hole with the high depth-diameter ratio (greater than or equal to 20: 1), and is suitable for advanced packaging and manufacturing of large-size glass substrates (such as 510mm * 515mm).

The utility model relates to the technical field of pulse electroplating equipment, and discloses electroplating liquid stirring equipment for pulse electroplating, which comprises an electroplating tank, a multi-dimensional stirring mechanism is arranged in the electroplating tank, and the multi-dimensional stirring mechanism comprises a displacement adjusting unit and a multi-directional stirring unit; the multidirectional stirring unit comprises a transverse axial flow device and a longitudinal axial flow device, the longitudinal axial flow device is used for driving the electroplating liquid to longitudinally flow, and the transverse axial flow device is used for driving the electroplating liquid to horizontally flow. According to the electroplating liquid stirring equipment for pulse electroplating, the multi-dimensional stirring mechanism drives electroplating liquid to flow in the horizontal direction and the vertical direction through combination of the transverse axial flow device and the longitudinal axial flow device. The direction of the transverse axial flow device is adjusted through a bottom rotary driving seat, the longitudinal axial flow device breaks through a traditional single vortex mode through vertical stirring, and three-dimensional flow is formed by driving electroplating liquid to flow in the horizontal direction and the vertical direction and adjusting the direction of the transverse axial flow device, so that the center and edge areas of an electroplating pool are covered; the flow velocity gradient difference is reduced.

This invention belongs to the field of nuclear power control rod processing technology, specifically relating to a chromium plating method and a continuous-pass chromium plating apparatus for ultra-long, ultra-fine, thin-walled cladding tubes used in nuclear power control rods. The chromium plating method includes pretreatment and chromium plating treatment. The pretreatment includes degreasing and cleaning the ultra-long, ultra-fine, thin-walled cladding tube. The chromium plating treatment is a continuous-pass chromium plating process, in which the pretreated cladding tube is continuously passed horizontally and at a uniform speed along its axial direction through at least one chromium plating tank. The cladding tube is supported by a support structure as it passes through each chromium plating tank, maintaining horizontal linear movement. Within each chromium plating tank, an annular anode surrounds the movement path of the cladding tube, and a pulsed power supply applies a cathode current to the cladding tube for pulse electroplating. This invention, by employing a uniform-speed continuous-pass chromium plating method and using an annular anode, ensures that the chromium plating time and current conditions are consistent along the entire axial length of the workpiece.

The present disclosure provides a circuit board production equipment and system capable of reducing the plating film clamping, which comprises a plating device and a dry film stripping device. The plating device comprises a first plate feeding mechanism, a plating tank and a pulse plating controller. The dry film stripping device comprises a second plate feeding mechanism, a stripping tank, a film residue filtering mechanism, a stripping liquid circulation control mechanism, a stripping monitoring sensor group, a stripping control box and a plate discharging mechanism. The pulse plating controller is used to switch the current between the on and off, and the plating parameters are controllable by setting the plating parameters. The temperature controller and the conveying rate controller are used to set the stripping temperature and the conveying rate of the stripping section, so as to fully strip the circuit board, reduce the surface tension of the dry film, quickly penetrate into the film clamping layer, soften and dissolve part of the dry film residue, and make the adhesion between the dry film and the copper layer disappear, thereby achieving the purpose of effectively removing the film clamping.

The present invention relates to the field of semiconductor device manufacturing technology, and in particular to a method for preparing a high-frequency response power transistor. First, an N-drift layer is grown on an N+ silicon substrate with a resistivity of >1000Ω·cm. An isolation trench with a depth of 12μm and a depth-to-width ratio of 5.9:1 is etched by ICP, and a SiO2 / Si3N4 composite dielectric layer is filled to expand the depletion layer to 18.5μm, thereby reducing the collector junction capacitance to 68pF and the breakdown voltage to 205V. Secondly, an interdigitated emitter is formed on the front side, and the back side is thinned to 100±2μm and then laser drilled. The through-holes are filled with pulse electroplated copper, and the copper pillar array compresses the loop inductance to 2.7nH. Finally, a Ti / Ni / Au transition layer is sputtered, and a diamond-copper composite substrate is hot-pressed and bonded. An 80nm TiC phase is formed at the interface, with a thermal conductivity of 635W / m·K and a thermal resistance reduced to 0.61K / W. The present invention optimizes capacitance, inductance, and thermal resistance, reducing switching losses by 57.8% and increasing power density to 51.2W / cm 2 , suitable for MHz-level high-frequency power systems.

The invention relates to the technical field of metal wire processing, and discloses a metal wire processing galvanization treatment process for aerospace engineering, which comprises the following steps: removing oil stains and oxide layers on the surface of a metal wire through multi-stage electrolytic degreasing, composite pickling rust removal, reverse water washing, micro-polishing and plasma activation; after the metal wire is subjected to rare earth enhanced plating assisting treatment, zinc-aluminum rare earth alloy pulse electroplating is adopted, dynamic filtering is matched, and an alloy plating layer is formed on the surface of the pretreated metal wire; redundant zinc liquid is removed through nitrogen-electromagnetic composite wiping, and then gradient cooling shaping is conducted; after the binding force of the alloy coating and the matrix is strengthened through low-temperature vacuum diffusion annealing, residual stress is eliminated through micro-vibration drawing; and trivalent chromium passivation and nanometer sealing are adopted to form a double protection layer. Through the synergistic effect of multi-stage pretreatment, rare earth enhanced coating formation, gradient post-treatment and dual protection, the binding force, uniformity, corrosion resistance and stability of the metal wire zinc coating for aerospace engineering are remarkably improved.

The invention discloses a method for improving copper-free holes of a circuit board, which comprises the following steps: when the hole diameter of a finished hole is 0.2-0.5 mm, the diameter of a drill bit is 0.15-0.45 mm, the rotating speed of the drill bit is 80000-120000 rpm, the feeding speed is 0.3-1.0 m / min, and the retracting speed is greater than or equal to 5 m / min; when the hole diameter of the finished hole is 0.5-1.5 mm, the diameter of a drill bit is 0.45-1.4 mm, the rotating speed of the drill bit is 20000-50000 rpm, the feeding speed is 1-3 m / min, and the retracting speed is larger than or equal to 5 m / min; copper deposition pretreatment: degumming, coarsening, cleaning, activating and washing the base material; copper deposition: copper deposition liquid medicine comprises the following components: 5-10 g / L of copper sulfate, 2-5 g / L of a reducing agent, 20-40 g / L of a complexing agent and 0.1-0.5 g / L of a stabilizer, the pH value of the copper deposition liquid medicine is 9-9.5, the temperature is 30-35 DEG C, and the reducing agent is formaldehyde; in the initial stage, the current density is 1-2 A / dm < 2 >, and the electroplating time is 5-10 min; and in the subsequent stage, the current density is 2-3 A / dm < 2 >, and the electroplating liquid is uniformly stirred by adopting mechanical stirring in the electroplating process. According to the method for improving the copper-free condition of the circuit board hole, the drilling technology, the copper deposition pretreatment technology, the copper deposition liquid medicine and the electroplating technology are optimized, the phenomenon that copper does not exist in the hole is avoided, and the conductivity of a product is improved.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The single-surface silver layer composite copper foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous and dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface forms a bonding function surface; the silver layer is formed through pulse electroplating or double-pulse electroplating and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer, a bonding layer and the single-surface silver layer composite copper foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the second surface is combined with the dielectric layer through the bonding layer. The scheme can consider high-frequency low-loss transmission performance, bonding reliability with the dielectric layer and storage stability, and is suitable for 224G and 448G high-frequency data communication.

The utility model discloses iron-based horizontal pulse electroplating equipment which comprises an electroplating tank and a copper dissolving tank used for dissolving pure copper particles to form electroplating liquid, and the copper dissolving tank is connected with the electroplating tank through a conveying pipeline; the electroplating bath comprises a bath body and a plurality of groups of anode boxes arranged in the bath body, each group of anode box comprises a lower frame body arranged at the bottom of the bath body, an upper frame body spaced from the lower frame body, a plating solution spraying device arranged on the lower frame body and the upper frame body, and a titanium mesh flatly laid in the lower frame body, and the titanium mesh of each group of anode boxes is respectively connected with a pulse rectifier. According to the iron-based horizontal pulse electroplating equipment provided by the utility model, the maintenance frequency can be obviously reduced, so that the cost of manpower and material resources is saved, the productivity is improved, the purpose of continuous clean production can be achieved by utilizing a Fe < 2 + > / Fe < 3 + > redox electron pair technology and only by regularly supplementing pure copper particles in the copper dissolving tank, the uniformity of electroplating copper thickness can be improved, and the deep electroplating capability of electroplating can be improved.

The invention relates to the technical field of antennas, in particular to an OBD (On-Board Diagnostic) integrated multi-band antenna manufacturing method based on an LDS (Laser Direct Structuring) process, which comprises the following steps of: carrying out injection molding on an OBD shell substrate by adopting a modified composite material containing a copper-nickel metal organic matter; cooperative processing is carried out through a 532nm and 1064nm dual-wavelength laser; treating in a chemical copper plating solution containing graphene quantum dots for 25-35 minutes; during treatment in a chemical nickel plating solution with the pH value of 8.5-9.5, pulse electroplating is synchronously carried out; local gold plating is assisted by femtosecond laser; processing an impedance gradient transition region in a nitrogen plasma environment; and S7, monitoring the components of the plating layer in real time through an online mass spectrometer, dynamically adjusting the parameters of the plating solution, and controlling the atomic ratio of Cu to Ni within the range of 3: 1 to 5: 1. Compared with the prior art, the method for manufacturing the OBD integrated multi-band antenna based on the LDS process can realize the structural integration of the antenna and the OBD shell, saves the internal space occupied by a traditional independent antenna, and facilitates the miniaturization of OBD equipment.

The utility model relates to the technical field of electroplating devices, in particular to a multilayer circuit board through hole pulse electroplating device. According to the technical scheme, the electroplating device comprises a bottom plate, a filter box, an electroplating tank, a mounting frame, a storage frame and a vibration motor, the filter box is arranged at the upper end of the bottom plate, the electroplating tank is arranged at the upper end of the filter box, a hydraulic rod is arranged above the electroplating tank, the mounting frame is arranged at the lower end of the hydraulic rod, and the storage frame is arranged below the mounting frame; guide plates are arranged at the two ends of the storage frame, springs are arranged between the guide plates and the mounting frame, and a vibration motor is arranged on the rear side of the lower end of the mounting frame. When the multi-layer circuit board through holes are subjected to pulse electroplating processing, the storage frame for storing the multi-layer circuit board is connected with the vibration structure, so that shaking is realized, and the problems that bubbles are formed in the through holes sometimes due to the fact that the through holes are small, and part of the through holes cannot be subjected to effective electroplating processing are solved.

The invention relates to a current density adjusting method, device and equipment for anode pulse electroplating. The method comprises the following steps: acquiring an anode pulse current of a current time period, and performing periodic reverse modulation on the anode pulse current based on a double-pulse current mode to obtain a reverse pulse current signal; performing closed-loop feedback adjustment processing on the anode pulse current based on the reverse pulse current signal to obtain an adjusted anode pulse current, and obtaining the anode pulse current density based on the electrical characteristics of the adjusted anode pulse current; determining a cathode potential change trend of the cathode region based on an electrical coupling relationship between the anode pulse current density and the cathode region, and performing compensation processing on a time sequence of the anode pulse current density based on the cathode potential change trend to obtain a current density adjustment strategy, and the pulse current density of the anode is kept in a preset dynamic change range in the pulse electroplating period. By adopting the method, the accurate dynamic control of the anode pulse current density can be realized.

The invention relates to the technical field of circuit board hole plating, and discloses a circuit board hole plating process, which comprises the following steps of: carrying out film pasting treatment on a circuit board after copper deposition and flash plating, exposing and developing the circuit board, placing the exposed and developed circuit board in an electrocoppering solution, covering the circuit board with the area of an anode, and enabling the anode to be parallel to the circuit board; holes are plated in a copper-iron system pulse electroplating mode, in the forward and reverse pulse electroplating process, the forward pulse time T1 is 0-100 milliseconds, the reverse pulse time T2 is not larger than 50 milliseconds, and preferably, the forward pulse time T1 is 100 milliseconds, and the reverse pulse time T2 is 10 milliseconds. In the whole technological process, the concentration difference of Fe < 3 + > exists between the hole opening of the through hole of the circuit board and the position in the through hole of the circuit board, the concentration of Fe < 3 + > is changed under the condition of positive and negative current exchange, thin copper electroplating copper at the hole opening and thick copper electroplating copper in the hole can be formed, subsequent procedure production is facilitated, quality scrapping is reduced, and the reliability of the circuit board is enhanced.

The invention relates to the technical field of copper foil processing, in particular to an ultra-thick rolled copper foil with low roughness and high peel strength and a preparation method thereof. The quaternary composite additive composed of L-ascorbic acid, nanocellulose, trisodium citrate and sodium polyaspartate is introduced into the roughening liquid and the curing liquid, gradient pulse electroplating is combined, the surface roughness Rz of the obtained copper foil is smaller than or equal to 1.2 micrometers, the peel strength is larger than or equal to 1.5 N / mm, and the electroplating liquid is free of cyanide and heavy metal pollution. Through the synergistic effect of additive molecules and process optimization, the contradiction between low roughness and high stripping resistance is solved, and the method is suitable for the high-end fields of 5G high-frequency substrates, new energy automobile battery current collectors and the like.

The invention relates to the technical field of alloy plating layers, in particular to a tungsten alloy plating layer and a preparation method thereof and a liner tube with holes, the tungsten alloy plating layer is a tungsten-nickel alloy plating layer, the plating layer is compact and free of defects, the thickness of the plating layer is 40-100 microns, and the Vickers hardness of the plating layer is not lower than 900 HV1. The preparation method comprises the following steps: forming a stable electroplating solution by using a special composite complexing agent, conductive salt, a buffer agent and an additive as auxiliary materials, and electroplating under matched pulse parameters and mechanical stirring through plasma cleaning in combination with a profiling anode and pulse electroplating technology. According to the method, the high-hardness tungsten alloy coating with uniform thickness and excellent performance can be deposited on a workpiece with a complex shape, particularly the inner wall and the outer wall of a liner tube with holes and the inner surfaces of all the holes, and the technical problem of uniformity of the coating on the surface of a deep hole and a complex structural part is solved.

The invention belongs to the field of material surface treatment, and particularly relates to a preparation method of a high-strength crack-free ultra-fine grain chromium layer. A pulse electroplating method is adopted, and the method specifically comprises the following steps that (1) mechanical grinding and polishing are conducted; (2) chemical oil removal; (3) pickling and activating; step (4), slowly rising current for pre-plating; (5) formal plating is conducted, specifically, the workpiece to be plated serves as a cathode, and a lead-tin alloy is adopted as an anode; the plating solution comprises CrO3 and sulfuric acid; the duty ratio gamma of pulse electroplating is 65-80%, the conduction time is 450-600 ms, the cut-off time is 110-150 ms, the anode current density is 35-40 A / dm < 2 >, and the temperature of the plating solution is 55-62 DEG C. The invention provides the preparation method of the high-strength crack-free pulse electroplating chromium layer, the method has the characteristics of high deposition efficiency, high hardness, no crack and the like, and the prepared coating has good mechanical property and density.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a PTFE / PE composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The composite silver foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface is provided with a polytetrafluoroethylene layer or a PET layer; the silver layer is formed through pulse electroplating or double-pulse electroplating, and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer and the composite silver foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the polytetrafluoroethylene layer or the PET layer of the second surface is combined with the dielectric layer. The scheme can consider high-frequency low-loss transmission performance, combination reliability with the dielectric layer and storage stability, and is suitable for 448G and above high-speed data communication.

This invention relates to the field of metal surface treatment technology, specifically to tin-plated copper wire for preventing tin plating layer peeling and its production process. The production process of the tin-plated copper wire for preventing tin plating layer peeling includes: preparing a nano-alumina-pillared nano-graphene sheet composite material; pretreatment; pulse electroplating; post-plating washing; and passivation sealing. This invention first disperses carboxyl-modified graphene in anhydrous ethanol, then adds an aluminum source precursor. Electrostatic self-assembly allows the aluminum source to be adsorbed onto the graphene sheet surface. After acid-catalyzed gelation, aging, and calcination heat treatment, a nano-alumina-pillared nano-graphene sheet composite material is obtained. This composite material is then added together with polytetrafluoroethylene (PTFE) particles to a mixed tin plating solution. After pulse electroplating of the pretreated copper wire, the nano-alumina-pillared nano-graphene sheets and PTFE particles synergistically improve the bonding force between the tin plating layer and the copper wire substrate, thereby effectively preventing tin plating layer peeling.

This invention relates to the field of electroplating solution component detection technology, specifically disclosing an intelligent detection method and system for composite electroplating solution components. First, electrochemical sensing signals are simultaneously acquired during pulse electroplating and subjected to adaptive noise reduction processing to generate standardized signal slices. Then, time-domain dynamic trajectory parameters and frequency-domain distribution parameters are extracted through multi-scale feature analysis. Next, enhanced feature vectors are generated using feature cross-validation and adversarial generation processing. Then, real-time concentration data of each component is obtained using a preset feature-concentration mapping relationship. Finally, parameter reconstruction is triggered based on concentration deviation analysis results, achieving closed-loop optimization of the detection process. This invention effectively solves the problem of component detection inaccuracy caused by transient multi-physics field coupling interference under high-frequency pulse conditions, improving detection accuracy and system stability, and providing a reliable online monitoring solution for precision electroplating processes.

The application discloses a manufacturing method of binding PAD size CPK control >=1.33, and belongs to the technical field of PCB manufacturing. The method comprises the following steps: an engineering design step, in which a horn-shaped compensation pattern is added at the right-angle position of the binding PAD, and additional compensation design is performed; an electroplating step, in which direct current hole filling and pulse thickening are combined, and the copper thickness difference is controlled to be within ±3 μm; a circuit manufacturing step, in which LDI exposure with an analytical precision <=15 / 15 μm is adopted, nine-point method is used to measure the copper thickness to set parameters before etching, a vacuum two-fluid etching machine is adopted, and etching uniformity >=95% is controlled; and a detection control step, in which a flash tester is used to test the binding PAD size, Minitab is used to calculate CPK, and >=1.33 is ensured. Through horn-shaped compensation, differential compensation, pulse electroplating uniformity control, high-precision etching and CPK quantitative verification, the process capability index of the binding PAD size is improved from less than 1.00 to more than 1.33, the pattern precision and process stability are significantly improved, and the failure rate is reduced.

This invention discloses a surface treatment process for household appliance parts, comprising the following steps: S1, pre-treating the metal-based household appliance parts by degreasing, rust removal, water washing, and drying; S2, placing the pre-treated household appliance parts in a vacuum plasma device and bombarding them with a mixture of argon and oxygen; S3, immersing the activated household appliance parts in a composite electroplating solution and forming a composite coating on the surface of the household appliance parts using pulse electroplating; S4, immersing the household appliance parts treated in S3 in a mixture of silane coupling agent and nano-silica sol, pulling them into a film, and then subjecting them to wet gas-phase catalysis; S5, placing the household appliance parts treated in S4 in a curing oven for step-by-step temperature curing. This invention can significantly improve the adhesion, corrosion resistance, and wear resistance of the coating, solving the problems of poor coating adhesion and insufficient wear and corrosion resistance in existing household appliance treatment processes.

This invention discloses a MEMS optimized process for a wide-temperature-range silicon pressure sensor chip, comprising forming a honeycomb-shaped stress buffer cavity on a double-sided polished silicon wafer, generating a bilayer composite film on the surface of the top silicon layer of the SOI wafer, and then bonding them to form a heterostructure; on the surface of the top silicon layer of the SOI wafer, a depth-direction doping concentration gradient is formed by a three-stage variable-angle ion implantation process, and a temperature compensation electrode is fabricated by electron beam lithography to construct a gradient-doped piezoresistive network, a corrugated SiON dielectric layer is grown on the surface, tapered vias are etched, and copper metal is filled using a pulse electroplating process to achieve internal interconnection, forming a metal interconnect structure; and gradient SiN is sequentially deposited on its surface. X A thin film is used to coat the surface of a heterogeneous structure with Au / Sn eutectic solder. A miniature Pt temperature sensor is integrated into the package cavity and coated with a polysilazane composite protective layer. This effectively improves the performance stability and reliability of the chip over a wide temperature range, and adapts it to complex high and low temperature environments.

The utility model relates to the technical field of electroplating, in particular to a pulse electroplating device which comprises a workbench, a material receiving seat, a driving mechanism, a material placing frame and a drying mechanism, a pulse electroplating equipment body is arranged on one side of the top end of the workbench, a treatment box is arranged on the other side of the top end of the workbench, and a recovery pipe is arranged at the bottom end of the side wall of the treatment box; the driving mechanism is mounted in the middle of the top end of the workbench, and the mounting frame is driven by the driving mechanism to rotate and adjust along the workbench and vertically adjust along the workbench; the material placing frame corresponds to the pulse electroplating equipment body and the treatment box; the drying mechanism is composed of a driving assembly and a drying assembly. According to the pulse electroplating equipment disclosed by the utility model, the two groups of material placing frames alternately work between the pulse electroplating equipment body and the treatment box, so that redundant electroplating liquid on an electroplated electronic component can be dried in time, the processing time is shortened, the processing efficiency is improved, and the redundant electroplating liquid in the treatment box can be recycled into the recycling box, so that waste is avoided.

The invention discloses a high-compactness functional current collector and a preparation method and application thereof, and relates to the technical field of current collectors. The high-compactness functional current collector is prepared by magnetron sputtering copper plating on the surface of the PET base film in cooperation with a pulse electroplating process; according to the conductive seed layer obtained through magnetron sputtering and the thickened copper layer obtained through pulse electroplating, the compactness of the functional copper foil is optimized by controlling the single orientation of crystal grains in the growth process on the surface of the base material, the conductivity is improved, and the product performance is optimized; under the condition that the performance of the high-compactness functional current collector is not influenced, the surface active agent is added into the electroplating solution to reduce the surface tension of the electroplating solution, so that the surface of a cathode is more easily wetted by the solution, and the interface defects of a plating layer are reduced; by adding the composite additive into the electroplating solution, the compactness, copper plating rate and uniformity of a copper layer are improved.

The utility model discloses pulse electroplating equipment capable of accurately controlling a plating layer, which comprises an electroplating bath, a control component is arranged in the electroplating bath, the top of the electroplating bath is fixedly connected with a support rod, the top of the support rod is fixedly connected with a support plate, the top of the support plate is fixedly connected with a lifting cylinder, and the lifting cylinder is fixedly connected with a lifting cylinder. The bottom of the lifting air cylinder is fixedly connected with a concave plate through a piston rod, a hoisting mechanism is arranged at the bottom of the concave plate, and the hoisting mechanism comprises a hoisting assembly. According to the pulse electroplating equipment capable of accurately controlling the plating layer, the hoisting mechanism is arranged, the distance between the movable rings on the two sides can be flexibly adjusted under the driving of the driving motor, and workpieces of different sizes can be hoisted or three sets of workpieces can be hoisted at the same time for subsequent electroplating operation in cooperation with a fixed ring; therefore, the flexibility and the practicability of the pulse electroplating equipment are improved.