62 results about "Pulse electroplating" patented technology

The invention discloses an efficient and uniform electroplating manufacturing method of a thick copper plate. The efficient and uniform electroplating manufacturing method comprises the following steps: step 1, carrying out chemical oil removal treatment and micro-etching coarsening on a substrate; step 2, carrying out pre-impregnation treatment and manufacturing a mask; 3, a pulse electroplating device is adopted for carrying out edge auxiliary electroplating on the plate edge, and 4, plating solution closed-loop regulation and control are carried out, specifically, a regulation and control system is provided, the regulation and control system comprises a plating solution regulation and control device and an automatic compensation module, and a PLC control system controls the automatic compensation module to quantitatively supply additives according to the difference between a detection value and a required value. According to the method, the electric field intensity of the edge and the center of the substrate is balanced, the thickness uniformity of the copper layer is remarkably improved, and the thickness difference between the edge and the center is reduced; and the deposition rate stability of pulse electroplating is ensured. And meanwhile, the working efficiency is improved, the electroplating time is shortened, the energy consumption is reduced, the dosage of an electroplating additive is reduced, the service life of an electroplating solution is prolonged, the binding force of a copper layer and a substrate is improved, practicability is high, and high popularization significance is achieved.

The invention provides a pulse-direct current electrochemistry composite deposition process of a nickel-tungsten-phosphorus alloy coating, and belongs to the technical field of coating preparation, and the pulse-direct current electrochemistry composite deposition process comprises the following steps: carrying out silane coupling agent modification treatment on alpha-aluminum oxide; carrying out modification treatment on the hexagonal boron nitride nanosheet by adopting hexadecyl trimethyl ammonium bromide; carrying out polyacrylic acid modification treatment on the nano silicon dioxide; nickel salt, tungsten salt, phosphorus salt, a complexing agent, a buffering agent, a primary brightener, a secondary brightener, a wetting agent, modified aluminum oxide, modified boron nitride, modified silicon dioxide and deionized water are mixed, stirred and heated, and a composite plating solution is obtained; the substrate serves as a cathode, pulse current is applied to the substrate for pulse electroplating, then the current density of the pulse current is continuously and linearly reduced to a target value, and finally direct current electroplating is conducted under the target value; by optimizing the formula of the composite plating solution and the pulse-direct current composite electroplating process, the nickel-tungsten-phosphorus alloy composite plating layer with high hardness, low friction, high wear resistance and corrosion resistance is finally obtained.

The invention relates to the technical field of semiconductor packaging and micromachining, in particular to a defect-free electroplating filling method and system for a high-aspect-ratio glass through hole. The method comprises the following steps: preparing an ultrathin and compact copper seed composite layer with strong binding force on the inner wall of a glass through hole by adopting an atomic layer deposition (ALD) technology; preparing an electroplating solution containing a specific additive system; and implementing a segmented pulse electroplating strategy, and realizing defect-free copper filling from the bottom to the top of the through hole by regulating and controlling the current density, the pulse width and the intermittent time in stages and combining a reverse pulse technology. The system integrates ALD deposition, pulse electroplating and an electroplating liquid circulation system, and high precision and high yield in the filling process are ensured. The method effectively solves the problems of insufficient seed layer coverage, limited mass transfer, cavity / suture defects and the like in the filling of the glass through hole with the high depth-diameter ratio (greater than or equal to 20: 1), and is suitable for advanced packaging and manufacturing of large-size glass substrates (such as 510mm * 515mm).

The utility model relates to the technical field of pulse electroplating equipment, and discloses electroplating liquid stirring equipment for pulse electroplating, which comprises an electroplating tank, a multi-dimensional stirring mechanism is arranged in the electroplating tank, and the multi-dimensional stirring mechanism comprises a displacement adjusting unit and a multi-directional stirring unit; the multidirectional stirring unit comprises a transverse axial flow device and a longitudinal axial flow device, the longitudinal axial flow device is used for driving the electroplating liquid to longitudinally flow, and the transverse axial flow device is used for driving the electroplating liquid to horizontally flow. According to the electroplating liquid stirring equipment for pulse electroplating, the multi-dimensional stirring mechanism drives electroplating liquid to flow in the horizontal direction and the vertical direction through combination of the transverse axial flow device and the longitudinal axial flow device. The direction of the transverse axial flow device is adjusted through a bottom rotary driving seat, the longitudinal axial flow device breaks through a traditional single vortex mode through vertical stirring, and three-dimensional flow is formed by driving electroplating liquid to flow in the horizontal direction and the vertical direction and adjusting the direction of the transverse axial flow device, so that the center and edge areas of an electroplating pool are covered; the flow velocity gradient difference is reduced.

This invention belongs to the field of nuclear power control rod processing technology, specifically relating to a chromium plating method and a continuous-pass chromium plating apparatus for ultra-long, ultra-fine, thin-walled cladding tubes used in nuclear power control rods. The chromium plating method includes pretreatment and chromium plating treatment. The pretreatment includes degreasing and cleaning the ultra-long, ultra-fine, thin-walled cladding tube. The chromium plating treatment is a continuous-pass chromium plating process, in which the pretreated cladding tube is continuously passed horizontally and at a uniform speed along its axial direction through at least one chromium plating tank. The cladding tube is supported by a support structure as it passes through each chromium plating tank, maintaining horizontal linear movement. Within each chromium plating tank, an annular anode surrounds the movement path of the cladding tube, and a pulsed power supply applies a cathode current to the cladding tube for pulse electroplating. This invention, by employing a uniform-speed continuous-pass chromium plating method and using an annular anode, ensures that the chromium plating time and current conditions are consistent along the entire axial length of the workpiece.

The present disclosure provides a circuit board production equipment and system capable of reducing the plating film clamping, which comprises a plating device and a dry film stripping device. The plating device comprises a first plate feeding mechanism, a plating tank and a pulse plating controller. The dry film stripping device comprises a second plate feeding mechanism, a stripping tank, a film residue filtering mechanism, a stripping liquid circulation control mechanism, a stripping monitoring sensor group, a stripping control box and a plate discharging mechanism. The pulse plating controller is used to switch the current between the on and off, and the plating parameters are controllable by setting the plating parameters. The temperature controller and the conveying rate controller are used to set the stripping temperature and the conveying rate of the stripping section, so as to fully strip the circuit board, reduce the surface tension of the dry film, quickly penetrate into the film clamping layer, soften and dissolve part of the dry film residue, and make the adhesion between the dry film and the copper layer disappear, thereby achieving the purpose of effectively removing the film clamping.

The invention discloses a method for improving copper-free holes of a circuit board, which comprises the following steps: when the hole diameter of a finished hole is 0.2-0.5 mm, the diameter of a drill bit is 0.15-0.45 mm, the rotating speed of the drill bit is 80000-120000 rpm, the feeding speed is 0.3-1.0 m / min, and the retracting speed is greater than or equal to 5 m / min; when the hole diameter of the finished hole is 0.5-1.5 mm, the diameter of a drill bit is 0.45-1.4 mm, the rotating speed of the drill bit is 20000-50000 rpm, the feeding speed is 1-3 m / min, and the retracting speed is larger than or equal to 5 m / min; copper deposition pretreatment: degumming, coarsening, cleaning, activating and washing the base material; copper deposition: copper deposition liquid medicine comprises the following components: 5-10 g / L of copper sulfate, 2-5 g / L of a reducing agent, 20-40 g / L of a complexing agent and 0.1-0.5 g / L of a stabilizer, the pH value of the copper deposition liquid medicine is 9-9.5, the temperature is 30-35 DEG C, and the reducing agent is formaldehyde; in the initial stage, the current density is 1-2 A / dm < 2 >, and the electroplating time is 5-10 min; and in the subsequent stage, the current density is 2-3 A / dm < 2 >, and the electroplating liquid is uniformly stirred by adopting mechanical stirring in the electroplating process. According to the method for improving the copper-free condition of the circuit board hole, the drilling technology, the copper deposition pretreatment technology, the copper deposition liquid medicine and the electroplating technology are optimized, the phenomenon that copper does not exist in the hole is avoided, and the conductivity of a product is improved.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The single-surface silver layer composite copper foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous and dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface forms a bonding function surface; the silver layer is formed through pulse electroplating or double-pulse electroplating and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer, a bonding layer and the single-surface silver layer composite copper foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the second surface is combined with the dielectric layer through the bonding layer. The scheme can consider high-frequency low-loss transmission performance, bonding reliability with the dielectric layer and storage stability, and is suitable for 224G and 448G high-frequency data communication.

The invention relates to the technical field of copper foil processing, in particular to an ultra-thick rolled copper foil with low roughness and high peel strength and a preparation method thereof. The quaternary composite additive composed of L-ascorbic acid, nanocellulose, trisodium citrate and sodium polyaspartate is introduced into the roughening liquid and the curing liquid, gradient pulse electroplating is combined, the surface roughness Rz of the obtained copper foil is smaller than or equal to 1.2 micrometers, the peel strength is larger than or equal to 1.5 N / mm, and the electroplating liquid is free of cyanide and heavy metal pollution. Through the synergistic effect of additive molecules and process optimization, the contradiction between low roughness and high stripping resistance is solved, and the method is suitable for the high-end fields of 5G high-frequency substrates, new energy automobile battery current collectors and the like.

The invention relates to the technical field of alloy plating layers, in particular to a tungsten alloy plating layer and a preparation method thereof and a liner tube with holes, the tungsten alloy plating layer is a tungsten-nickel alloy plating layer, the plating layer is compact and free of defects, the thickness of the plating layer is 40-100 microns, and the Vickers hardness of the plating layer is not lower than 900 HV1. The preparation method comprises the following steps: forming a stable electroplating solution by using a special composite complexing agent, conductive salt, a buffer agent and an additive as auxiliary materials, and electroplating under matched pulse parameters and mechanical stirring through plasma cleaning in combination with a profiling anode and pulse electroplating technology. According to the method, the high-hardness tungsten alloy coating with uniform thickness and excellent performance can be deposited on a workpiece with a complex shape, particularly the inner wall and the outer wall of a liner tube with holes and the inner surfaces of all the holes, and the technical problem of uniformity of the coating on the surface of a deep hole and a complex structural part is solved.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a PTFE / PE composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The composite silver foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface is provided with a polytetrafluoroethylene layer or a PET layer; the silver layer is formed through pulse electroplating or double-pulse electroplating, and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer and the composite silver foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the polytetrafluoroethylene layer or the PET layer of the second surface is combined with the dielectric layer. The scheme can consider high-frequency low-loss transmission performance, combination reliability with the dielectric layer and storage stability, and is suitable for 448G and above high-speed data communication.

This invention relates to the field of metal surface treatment technology, specifically to tin-plated copper wire for preventing tin plating layer peeling and its production process. The production process of the tin-plated copper wire for preventing tin plating layer peeling includes: preparing a nano-alumina-pillared nano-graphene sheet composite material; pretreatment; pulse electroplating; post-plating washing; and passivation sealing. This invention first disperses carboxyl-modified graphene in anhydrous ethanol, then adds an aluminum source precursor. Electrostatic self-assembly allows the aluminum source to be adsorbed onto the graphene sheet surface. After acid-catalyzed gelation, aging, and calcination heat treatment, a nano-alumina-pillared nano-graphene sheet composite material is obtained. This composite material is then added together with polytetrafluoroethylene (PTFE) particles to a mixed tin plating solution. After pulse electroplating of the pretreated copper wire, the nano-alumina-pillared nano-graphene sheets and PTFE particles synergistically improve the bonding force between the tin plating layer and the copper wire substrate, thereby effectively preventing tin plating layer peeling.

This invention relates to the field of electroplating solution component detection technology, specifically disclosing an intelligent detection method and system for composite electroplating solution components. First, electrochemical sensing signals are simultaneously acquired during pulse electroplating and subjected to adaptive noise reduction processing to generate standardized signal slices. Then, time-domain dynamic trajectory parameters and frequency-domain distribution parameters are extracted through multi-scale feature analysis. Next, enhanced feature vectors are generated using feature cross-validation and adversarial generation processing. Then, real-time concentration data of each component is obtained using a preset feature-concentration mapping relationship. Finally, parameter reconstruction is triggered based on concentration deviation analysis results, achieving closed-loop optimization of the detection process. This invention effectively solves the problem of component detection inaccuracy caused by transient multi-physics field coupling interference under high-frequency pulse conditions, improving detection accuracy and system stability, and providing a reliable online monitoring solution for precision electroplating processes.

The application discloses a manufacturing method of binding PAD size CPK control >=1.33, and belongs to the technical field of PCB manufacturing. The method comprises the following steps: an engineering design step, in which a horn-shaped compensation pattern is added at the right-angle position of the binding PAD, and additional compensation design is performed; an electroplating step, in which direct current hole filling and pulse thickening are combined, and the copper thickness difference is controlled to be within ±3 μm; a circuit manufacturing step, in which LDI exposure with an analytical precision <=15 / 15 μm is adopted, nine-point method is used to measure the copper thickness to set parameters before etching, a vacuum two-fluid etching machine is adopted, and etching uniformity >=95% is controlled; and a detection control step, in which a flash tester is used to test the binding PAD size, Minitab is used to calculate CPK, and >=1.33 is ensured. Through horn-shaped compensation, differential compensation, pulse electroplating uniformity control, high-precision etching and CPK quantitative verification, the process capability index of the binding PAD size is improved from less than 1.00 to more than 1.33, the pattern precision and process stability are significantly improved, and the failure rate is reduced.

This invention discloses a surface treatment process for household appliance parts, comprising the following steps: S1, pre-treating the metal-based household appliance parts by degreasing, rust removal, water washing, and drying; S2, placing the pre-treated household appliance parts in a vacuum plasma device and bombarding them with a mixture of argon and oxygen; S3, immersing the activated household appliance parts in a composite electroplating solution and forming a composite coating on the surface of the household appliance parts using pulse electroplating; S4, immersing the household appliance parts treated in S3 in a mixture of silane coupling agent and nano-silica sol, pulling them into a film, and then subjecting them to wet gas-phase catalysis; S5, placing the household appliance parts treated in S4 in a curing oven for step-by-step temperature curing. This invention can significantly improve the adhesion, corrosion resistance, and wear resistance of the coating, solving the problems of poor coating adhesion and insufficient wear and corrosion resistance in existing household appliance treatment processes.

This invention discloses a MEMS optimized process for a wide-temperature-range silicon pressure sensor chip, comprising forming a honeycomb-shaped stress buffer cavity on a double-sided polished silicon wafer, generating a bilayer composite film on the surface of the top silicon layer of the SOI wafer, and then bonding them to form a heterostructure; on the surface of the top silicon layer of the SOI wafer, a depth-direction doping concentration gradient is formed by a three-stage variable-angle ion implantation process, and a temperature compensation electrode is fabricated by electron beam lithography to construct a gradient-doped piezoresistive network, a corrugated SiON dielectric layer is grown on the surface, tapered vias are etched, and copper metal is filled using a pulse electroplating process to achieve internal interconnection, forming a metal interconnect structure; and gradient SiN is sequentially deposited on its surface. X A thin film is used to coat the surface of a heterogeneous structure with Au / Sn eutectic solder. A miniature Pt temperature sensor is integrated into the package cavity and coated with a polysilazane composite protective layer. This effectively improves the performance stability and reliability of the chip over a wide temperature range, and adapts it to complex high and low temperature environments.

The utility model relates to the technical field of electroplating, in particular to a pulse electroplating device which comprises a workbench, a material receiving seat, a driving mechanism, a material placing frame and a drying mechanism, a pulse electroplating equipment body is arranged on one side of the top end of the workbench, a treatment box is arranged on the other side of the top end of the workbench, and a recovery pipe is arranged at the bottom end of the side wall of the treatment box; the driving mechanism is mounted in the middle of the top end of the workbench, and the mounting frame is driven by the driving mechanism to rotate and adjust along the workbench and vertically adjust along the workbench; the material placing frame corresponds to the pulse electroplating equipment body and the treatment box; the drying mechanism is composed of a driving assembly and a drying assembly. According to the pulse electroplating equipment disclosed by the utility model, the two groups of material placing frames alternately work between the pulse electroplating equipment body and the treatment box, so that redundant electroplating liquid on an electroplated electronic component can be dried in time, the processing time is shortened, the processing efficiency is improved, and the redundant electroplating liquid in the treatment box can be recycled into the recycling box, so that waste is avoided.

The invention discloses a high-compactness functional current collector and a preparation method and application thereof, and relates to the technical field of current collectors. The high-compactness functional current collector is prepared by magnetron sputtering copper plating on the surface of the PET base film in cooperation with a pulse electroplating process; according to the conductive seed layer obtained through magnetron sputtering and the thickened copper layer obtained through pulse electroplating, the compactness of the functional copper foil is optimized by controlling the single orientation of crystal grains in the growth process on the surface of the base material, the conductivity is improved, and the product performance is optimized; under the condition that the performance of the high-compactness functional current collector is not influenced, the surface active agent is added into the electroplating solution to reduce the surface tension of the electroplating solution, so that the surface of a cathode is more easily wetted by the solution, and the interface defects of a plating layer are reduced; by adding the composite additive into the electroplating solution, the compactness, copper plating rate and uniformity of a copper layer are improved.

The utility model discloses pulse electroplating equipment capable of accurately controlling a plating layer, which comprises an electroplating bath, a control component is arranged in the electroplating bath, the top of the electroplating bath is fixedly connected with a support rod, the top of the support rod is fixedly connected with a support plate, the top of the support plate is fixedly connected with a lifting cylinder, and the lifting cylinder is fixedly connected with a lifting cylinder. The bottom of the lifting air cylinder is fixedly connected with a concave plate through a piston rod, a hoisting mechanism is arranged at the bottom of the concave plate, and the hoisting mechanism comprises a hoisting assembly. According to the pulse electroplating equipment capable of accurately controlling the plating layer, the hoisting mechanism is arranged, the distance between the movable rings on the two sides can be flexibly adjusted under the driving of the driving motor, and workpieces of different sizes can be hoisted or three sets of workpieces can be hoisted at the same time for subsequent electroplating operation in cooperation with a fixed ring; therefore, the flexibility and the practicability of the pulse electroplating equipment are improved.

The invention relates to a preparation method of a bimetallic particle loaded graphite felt electrode material, which comprises the following steps: (1) carrying out in-situ state recovery on a flow battery system to ensure that the flow battery system is in an initial state; (2) weighing a certain amount of metal modifier, adding the metal modifier into a certain amount of concentrated hydrochloric acid, and magnetically stirring until the metal modifier is completely dissolved to obtain an electroplating solution A; (3) adding a certain amount of electroplating liquid A into the negative electrode electrolyte, starting a liquid path circulation system, and fully rinsing the graphite felt by the electroplating liquid; and (4) performing electrochemical deposition through a pulse type electroplating method, and stopping electroplating when the voltage reaches a specified value. Through in-situ online improvement, the preparation process is simple, the cost is low, the battery structure is not changed, the method is suitable for flow battery stacks of various models and sizes, the loading capacity and uniformity of metal particles can be controlled by adjusting the pulse process and the electroplating liquid concentration, the prepared composite electrode material can effectively improve the performance of the battery, and the application prospect is wide. And the system efficiency is obviously improved.

The application discloses a kind of RDL copper surface microstructure detailed processing method and system, for the problems such as grain coarsening, high surface roughness, poor process stability of traditional electroplating copper process, the method is realized optimization by four-step core process: first by micro-current cathode electrolytic cleaning, complex acid-based microetching and in-situ reduction complete synergistic pretreatment;Then controlled multi-pulse electroplating is carried out using a specific formula plating solution and "nucleation pulse-relaxation-growth pulse" multi-stage waveform, cooperate with flow field optimization;Subsequently implement in-situ infrared transient thermal annealing;Finally, the process parameters are dynamically adjusted by multi-module online monitoring and AI closed-loop feedback.The application can obtain equiaxed grain structure with an average grain size of <300 nm, the surface roughness of copper layer Ra≤10nm, significantly improve the electrical performance and process robustness (Cpk>1.67), while eliminating the post-polishing / long-time annealing step, optimizing the production cycle and cost, suitable for mass production.

The invention discloses a bipolar current collector with double copper layers and a preparation method thereof, and relates to the field of battery current collectors, the current collector takes an aluminum foil as a substrate, and a compact first copper layer prepared by magnetron sputtering and a thickened second copper layer prepared by electroplating are sequentially arranged on one side of the substrate. The first copper layer is prepared by adopting an intermittent deposition method, a pause interval is set in the deposition process, and substrate heating and low-energy ion beam bombardment are assisted, so that the compactness and the bonding strength of a plating layer are remarkably improved; and the second copper layer is prepared by adopting a pulse electroplating method, so that the non-porous and uniform structure is further ensured. Through a sputtering and electroplating composite process, a copper-aluminum interface which is high in binding force and free of defects is successfully constructed, electrolyte permeation is effectively blocked, and generation of lithium-aluminum alloy is prevented, so that the use safety of the bipolar current collector is greatly improved, and the cycle life of a battery is greatly prolonged.

The invention discloses an electroplating device which sequentially comprises a pulse electroplating pool for applying pulse current to groove pins, a transition pool for stopping applying current to the groove pins and a direct current electroplating pool for applying direct current to the groove pins according to the processing sequence of the groove pins. And the conveying line is used for carrying the groove pins to sequentially and continuously pass through and immerse the pulse electroplating pool, the transition pool and the direct-current electroplating pool at a constant speed. The invention further discloses an automatic electroplating production line for the groove pins. The groove pin electroplating device has the beneficial effect that the electroplating effect of the groove pin, especially the pin groove part of the groove pin, can be improved.

The double-pulse electroplating ceramic power supply comprises a first direct-current power supply, a second direct-current power supply, an IGBT (Insulated Gate Bipolar Translator) module, a pulse generator and an inductor, the negative electrode of the first direct-current power supply and the positive electrode of the second direct-current power supply are connected and are both connected with a ground wire; the positive electrode of the first direct-current power supply and the negative electrode of the second direct-current power supply are respectively connected to the IGBT module; the pulse generator is connected with the IGBT module and outputs double pulse current to the IGBT module, and the IGBT module is controlled by the pulse generator; one output end of the IGBT module is connected with the input end of the inductor, the output end of the inductor is connected with a workpiece, the other output end of the IGBT module is connected with the electroplating pool, the workpiece is electroplated based on double-pulse current, and parameters of double-pulse electroplating can be adjusted through the pulse generator. The electroplating ceramic power supply can accurately regulate and control current parameters, output is stable, energy efficiency is high, and different electroplating ceramic process requirements are met.

The invention discloses a nickel thickness uniformity method for a thin gold high-corrosion-resistance hard gold process. The nickel thickness uniformity method comprises the following steps: sequentially carrying out oil removal, micro-etching and acid pickling pretreatment on a to-be-electroplated copper base material; a nickel-phosphorus alloy layer is electroplated on the pretreated copper base material through the pulse electroplating technology, the mass percent of phosphorus in the nickel-phosphorus alloy layer is larger than 10%, and the thickness of the nickel-phosphorus alloy layer is controlled to range from 5 micrometers to 15 micrometers; electroplating a hard gold layer on the nickel-phosphorus alloy layer by using a pulse electroplating process, wherein the thickness of the hard gold layer is less than 0.1 mu m; wherein the nickel-phosphorus alloy electroplating layer and the hard gold electroplating layer both adopt a pulse rectifier, and the nickel thickness uniformity is controlled by changing the tank body circulation mode and the baffle plate structure of the electroplating tank. According to the method, the thickness of the gold layer can be obviously reduced on the premise of ensuring the corrosion resistance and the plugging performance, and the thickness of the nickel layer can be uniformly controlled.

The application discloses a kind of electrolytic copper foil preparation methods based on pulse plating, comprising the following steps: selecting suitable electrolyte, and electrolyte is added to electrolytic cell;Set appropriate electrolyte flow rate;Access pulse power supply, set average current density to 20~50A / dm 2 , pulse width is 1~10ms, duty cycle is 1~30%, pulse waveform is rectangular wave;Start pulse power supply to start pulse electrolysis foil.This application can obtain fine-grained copper foil by controlling pulse parameters;This application can weaken hydrogen evolution by controlling pulse parameters, thereby reducing the generation of holes;Through the method of the application, the surface of copper foil is smooth and uniform, and defects are not easy to produce.

The application discloses a manufacturing method of FR4 and PTFE mixed voltage circuit board, comprising the following steps: cutting, baking, inner layer dry film, inner layer AOI, pressing, mechanical drilling, plasma glue removal, copper deposition, pulse electroplating, single-side copper reduction, outer layer circuit, outer layer etching, outer layer AOI, solder mask, post-process, between the plasma glue removal and the copper deposition, there is a baking plate process for eliminating stress in the circuit board blank and eliminating moisture in the PTFE material again, between the outer layer AOI and the solder mask, there is a UV machine process for further eliminating moisture in the PTFE material and making the resin material shrink.

The invention discloses a multi-layer composite electroplating grinding wheel and a preparation method thereof, and belongs to the technical field of super-hard grinding tool manufacturing. The grinding wheel comprises a metal matrix, a transition coating and a composite working coating, and the transition coating is a nickel-phosphorus alloy coating and is tightly attached to the outer circumferential surface of the metal matrix; the composite working coating is divided into a coarse grinding layer and a fine grinding layer in the radial direction, the coarse grinding layer adopts 50-80 [mu] m diamond abrasive (the volume ratio is 35-45%), the fine grinding layer adopts 10-30 [mu] m diamond / cubic boron nitride mixed abrasive (the volume ratio is 20-30%), and an annular laser groove is formed in the surface of the fine grinding layer. The preparation method comprises the steps of substrate pretreatment, pulse electroplating of the transition layer, preparation of the coarse grinding layer through ultrasonic-mechanical synergistic dispersion, preparation of the fine grinding layer through parameter adjustment and laser groove machining. Coarse grinding and fine grinding are integrated, the bonding strength of a plating layer is improved by 40% or above, the surface roughness of a workpiece after fine grinding is smaller than or equal to Ra 0.1 micron, the service life of a grinding wheel is prolonged by 1.5-2 times, and the method is suitable for efficient and precise machining of hard and brittle materials.

The invention discloses a corrosion resistance enhancing method for piston rod surface treatment, and aims to solve the problems of serious pollution, poor corrosion resistance, insufficient binding force and the like in the traditional process. The method comprises the steps that firstly, a piston rod base body is mechanically polished till the roughness Ra ranges from 0.2 micrometer to 0.4 micrometer, and ultrasonic oil removal is conducted for 10 min to 15 min at the temperature of 50 DEG C to 60 DEG C through an alkaline oil removal agent; then in an ion nitriding furnace, nitrogen and hydrogen mixed gas is used for treatment for 4-6 h at the pressure of 200-300 Pa and the temperature of 480-520 DEG C, and a nitriding layer with the thickness of 0.2-0.3 mm is formed; the nitriding layer is plated with a zinc-nickel alloy layer through pulse electroplating, electroplating liquid components and pulse current parameters are accurately controlled, plating is conducted for 30-40 min, and a plating layer of 8-12 microns is obtained; and finally, sealing holes for 15-20 minutes at 80-90 DEG C by using nano silica sol, and drying at 120-150 DEG C to form the film. Through multi-layer composite treatment, the nitriding layer enhances the hardness of the matrix, the zinc-nickel alloy layer provides electrochemical protection, and the nano silica sol seals holes and isolates a medium, the corrosion resistance and the wear resistance are synergistically improved, the salt spray test time exceeds 1000 hours, meanwhile, hexavalent chromium pollution is avoided, and the coating is suitable for various severe working conditions.

The invention relates to the technical field of pulse electroplating, in particular to a circuit board pulse electroplating process and device.The device used in the electroplating process comprises a first supporting base, a second supporting base, a pulse electroplating unit, a plating solution temperature control unit and a conductive change-over switch, three alternating sliding grooves are symmetrically and evenly formed in the outer side of the electroplating bath, transmission rods are slidably connected into the alternating sliding grooves, the first supporting seats are a pair of first L-shaped supporting rods symmetrically arranged on the inner side of the electroplating bath, and the second supporting seats are second L-shaped supporting rods arranged between the two first L-shaped supporting rods. Through the meshing structure of the transmission gear and the double racks, accurate alternate lifting and supporting switching of the first L-shaped supporting rod and the second L-shaped supporting rod are achieved to enable an original shadow area to be exposed, deposition is accelerated in cooperation with high current density, and meanwhile the thickness of a plating layer is balanced through differential regulation and control of the reverse pulse proportion.