118 results about "Pulse electroplating" patented technology

The invention discloses a multilayer three-dimensional stacked circuit board and a preparation method thereof, and the method specifically comprises the steps: obtaining a substrate with a single conductive surface, and carrying out the spraying of a stress buffer layer on the conductive surface of the substrate; covering a layer of insulating material on the stress buffer layer, and forming a pattern insulating layer through photoetching; performing pulse electroplating processing on the exposed pattern of the pattern insulating layer to obtain a first circuit board; silk-screening a flexible connection layer on the pattern bonding pad layer of the first circuit board, and carrying out three-dimensional stacking processing on the flexible connection layer to obtain a second circuit board; and assembling a circuit protection layer on the second circuit board, and processing a stress release groove between the second circuit board and the circuit protection layer to obtain the multi-layer three-dimensional stacked circuit board. Through the design of the stress buffer layer and the stress release groove, interlayer stress can be reduced, circuit board breakage or cracking caused by overlarge interlayer stress is avoided, and the technical problem that large interlayer stress is generated in the circuit board preparation process in the prior art is solved.

The invention discloses a pulse electroplating detection method, a pulse electroplating device and equipment, and the method comprises the steps: synchronously collecting transient current density data of a three-pole assembly in a pulse switching time window, and calculating a time derivative of a current density ratio to obtain electrochemical stress gradient data; performing space-time correlation analysis on the stress gradient data of the continuous pulse period, and tracking a spatial propagation trajectory of stress anomaly; a key monitoring area is determined according to the propagation trajectory, and ion migration impedance sensitivity distribution is detected through micro-amplitude current modulation; performing multi-dimensional coupling analysis on the stress gradient, the propagation trajectory and the impedance sensitivity data, and identifying time sequence correlation characteristics of stress evolution and ion anomaly; and performing quantitative evaluation and grade division on the electrochemical state of the avoidance area based on the coupling correlation characteristics. According to the scheme, early recognition and predictive evaluation of the ion migration abnormity of the boundary layer of the avoidance area can be realized in the pulse electroplating process, and the electroplating quality control precision and the process stability are remarkably improved.

The invention relates to an improved photoelectric coupler packaging electroplating technology which comprises the following steps that S10, self-repairing microcapsules are dispersed into electroplating liquid, the microcapsules comprise wall materials and core materials, and the core materials comprise vinyl siloxane and chloroplatinic acid catalysts; s20, sequentially forming a nano gradient composite coating structure on the surface of the substrate, wherein the composite coating structure comprises a substrate layer, a transition layer, a main functional layer and a packaging layer; and S30, carrying out micro-area deposition by adopting a light-induced selective electroplating process, wherein the micro-area deposition comprises laser micro-area activation, pulse electroplating deposition and in-situ ultraviolet curing. According to the electroplating process, through the nanometer gradient composite coating structure, the interface stress concentration is reduced through layer-by-layer transition of the material and the thickness, the thermal cycle resistance of the coating is improved, and meanwhile the balance among conductivity, mechanical strength and thermal stability is achieved.

The invention relates to the technical field of radar circuit board preparation, in particular to a millimeter wave radar circuit board preparation method based on pulse electroplating, which comprises the following steps: carrying out pulse electroplating copper plating on a semi-finished printed circuit board, and determining whether the change trend of bubble density is consistent according to a second number proportion of bubble density curves in a plurality of areas, and determining a judgment mode for qualification of the copper plating process according to a judgment result. Acquiring the rate matching degree of the copper plating process to determine the qualification of the copper plating process, or acquiring the retention duration mean value of the bubbles for the plurality of bubble distribution areas to determine the qualification of the copper plating process; adjusting the axis included angle between the nozzle axis of the electrolyte and the axis of the blind hole or the nozzle pressure of the electrolyte according to the pulsation speed; and determining the copper distribution deviation in the blind hole, and optimizing the second preset proportion or optimizing the preset pulsation speed based on the copper distribution deviation. According to the invention, the copper plating quality in the blind hole is improved.

The invention provides a stainless steel surface composite coating strengthening method which comprises the following steps: a) sequentially carrying out chemical degreasing, ultrasonic passivation and laser texturing pretreatment on a base material to form a micro-pit array with the surface roughness Ra less than or equal to 0.2 mu m; b) applying a directional magnetic field with the magnetic field intensity of 0.5-1.5 T in the pulse electroplating process, and regulating and controlling the grain orientation of the plating layer; c) combining ultrasonic rolling and gradient nitriding processes to form a hardened layer of which the surface nitrogen content is distributed in a gradient manner; and d) optimizing a dynamic matching relationship among the magnetic field intensity, the pulse frequency and the nitriding temperature by utilizing a genetic algorithm, and realizing Pareto optimization of the coating performance. The method has the advantages that the grain orientation of the plating layer is improved, the bonding strength of the plating layer and a matrix is enhanced, the corrosion resistance is improved, the processing cost is reduced, and the surface hardness and the fracture toughness are improved.

The invention provides a gradient composite graphene electrolysis electrode plate and an in-situ preparation method thereof. The electrode plate comprises a metal conductive base material (such as titanium alloy), a porous ceramic skeleton layer (Al2O3-40% ZrO2, the porosity of which is 30 + / -5%), a chemical copper plating layer for filling pores, an electroplated nickel-ruthenium alloy catalytic layer (Ni: Ru = 9: 1) and 3-5 graphene functional layers (ID / IG is less than or equal to 0.08) grown in situ, wherein the porous ceramic skeleton layer (Al2O3-40% ZrO2) is laser-cladded on the surface of the porous ceramic skeleton layer (Al2O3-40% ZrO2). The preparation method comprises the following steps: performing laser cladding on a ceramic skeleton, wherein the power density is 300-500W / mm < 2 >, and sintering at 1600 DEG C to form metallurgical bonding; gradient plating: electroless copper plating (containing nano-diamond enhancement) and pulse electroplating of Ni Ru (duty ratio is 1: 5); and performing directional CVD growth: after reducing the catalyst layer by H2 at 1050 DEG C, introducing CH4 / H2 (the volume ratio is 1: 4) in a pulse manner, and realizing full coverage of the inner wall of the mesh by vortex air intake. The technical effects are as follows: (1) the overpotential of chlorine evolution in saturated salt water at 80 DEG C is as low as 268mV (1A / cm < 2 >); (2) strong acid environment service life gt; the time is 100 thousand hours (12 times that of the national standard); (3) the production cost is lt; and 620 / m < 2 > (90% lower than that of a traditional ruthenium-iridium coating). The problems of graphene transfer damage and special-shaped electrode covering are solved.

The invention belongs to the field of welding wire preparation, and particularly relates to a method for preparing an ODS steel welding wire based on a spray deposition and electric arc melting combined process. According to the technical scheme, the preparation method comprises the following steps: performing surface modification on Y2O3 particles and Fe powder to prepare mixed powder; an ODS alloy is smelted through a closed double-cabin smelting-injection system; during spray deposition, the preheated mixed powder is loaded; performing electric arc melting to form a nano oxide dispersed phase and strictly controlling the oxygen content of the ingot blank; the ingot blank is subjected to temperature equalization before forging, and H2 / Ar mixed gas is introduced; high-temperature rough rolling and low-temperature finish rolling are adopted for hot rolling strengthening; carrying out solid solution and two-stage aging composite heat treatment; hot drawing wire forming is matched with gradient annealing and protective atmosphere; and carrying out surface treatment through pulse copper electroplating or anti-oxidation layer spraying. According to the method, alloy components and microstructures can be accurately regulated and controlled, the problems of strengthening phase distribution and machining defects can be efficiently solved, and the strict requirements for high performance and high reliability of ODS steel welding wires in the fields of nuclear reactors, aerospace and the like are met.

The invention relates to the technical field of metal material processing, and discloses a double-sided burr nickel-plated steel strip and a preparation method thereof.The double-sided burr nickel-plated steel strip comprises a steel strip base body, the double faces of the steel strip base body are provided with three-dimensional burrs and nickel-plated layers, and each nickel-plated layer is composed of a plurality of nickel particles protruding out of the surface of the steel strip base body; the nickel particles are in any one or more of a conical shape, a pyramid shape or an irregular shape, the height of the nickel particles is 2-8 microns, and the bottom diameter of the nickel particles is 1-4 microns. And through electroplating treatment of a double-sided burr structure, the conductivity is remarkably improved, the contact resistance is effectively reduced, and the current distribution uniformity is improved. And meanwhile, the binding force between the plating layer and the substrate is enhanced by the pulse electroplating and periodic reversing electroplating technologies, the problems of interface stripping and plating layer falling are avoided, and the service life of the battery is prolonged. According to the burr structure, by increasing the surface roughness and the microscopic protrusions, the corrosion resistance of the plating layer is remarkably improved, and salt mist and moisture permeation are reduced.

The invention discloses an efficient and uniform electroplating manufacturing method of a thick copper plate. The efficient and uniform electroplating manufacturing method comprises the following steps: step 1, carrying out chemical oil removal treatment and micro-etching coarsening on a substrate; step 2, carrying out pre-impregnation treatment and manufacturing a mask; 3, a pulse electroplating device is adopted for carrying out edge auxiliary electroplating on the plate edge, and 4, plating solution closed-loop regulation and control are carried out, specifically, a regulation and control system is provided, the regulation and control system comprises a plating solution regulation and control device and an automatic compensation module, and a PLC control system controls the automatic compensation module to quantitatively supply additives according to the difference between a detection value and a required value. According to the method, the electric field intensity of the edge and the center of the substrate is balanced, the thickness uniformity of the copper layer is remarkably improved, and the thickness difference between the edge and the center is reduced; and the deposition rate stability of pulse electroplating is ensured. And meanwhile, the working efficiency is improved, the electroplating time is shortened, the energy consumption is reduced, the dosage of an electroplating additive is reduced, the service life of an electroplating solution is prolonged, the binding force of a copper layer and a substrate is improved, practicability is high, and high popularization significance is achieved.

The invention provides a pulse-direct current electrochemistry composite deposition process of a nickel-tungsten-phosphorus alloy coating, and belongs to the technical field of coating preparation, and the pulse-direct current electrochemistry composite deposition process comprises the following steps: carrying out silane coupling agent modification treatment on alpha-aluminum oxide; carrying out modification treatment on the hexagonal boron nitride nanosheet by adopting hexadecyl trimethyl ammonium bromide; carrying out polyacrylic acid modification treatment on the nano silicon dioxide; nickel salt, tungsten salt, phosphorus salt, a complexing agent, a buffering agent, a primary brightener, a secondary brightener, a wetting agent, modified aluminum oxide, modified boron nitride, modified silicon dioxide and deionized water are mixed, stirred and heated, and a composite plating solution is obtained; the substrate serves as a cathode, pulse current is applied to the substrate for pulse electroplating, then the current density of the pulse current is continuously and linearly reduced to a target value, and finally direct current electroplating is conducted under the target value; by optimizing the formula of the composite plating solution and the pulse-direct current composite electroplating process, the nickel-tungsten-phosphorus alloy composite plating layer with high hardness, low friction, high wear resistance and corrosion resistance is finally obtained.

The invention provides an electroplating method, a semiconductor device and an electroplating device. The electroplating method comprises the following steps: providing a wafer to be electroplated, wherein a plurality of connecting holes are formed in the wafer; forming a plating layer with a first thickness in the connecting hole by adopting a forward pulse electroplating process; a negative pulse electroplating process is adopted, so that the surface of the plating layer with the first thickness is dissolved, and a plating layer with a second thickness is formed in the connecting hole; and alternately circulating the positive pulse electroplating process and the negative pulse electroplating process for multiple times to form a plating layer with a third thickness in the connecting hole. Metal ions can be rapidly reduced and deposited on the surface of a cathode through the forward pulse electroplating process to form a required plating layer, and non-uniform parts on the surface of the plating layer can be dissolved by introducing reverse current into the negative pulse electroplating process, so that the surface of the plating layer is flattened, the thickness distribution of the plating layer is more uniform, and the service life of the plating layer is prolonged. And therefore, the thickness of the finally formed plating layer in the hole is uniform.

The invention relates to the technical field of semiconductor packaging and micromachining, in particular to a defect-free electroplating filling method and system for a high-aspect-ratio glass through hole. The method comprises the following steps: preparing an ultrathin and compact copper seed composite layer with strong binding force on the inner wall of a glass through hole by adopting an atomic layer deposition (ALD) technology; preparing an electroplating solution containing a specific additive system; and implementing a segmented pulse electroplating strategy, and realizing defect-free copper filling from the bottom to the top of the through hole by regulating and controlling the current density, the pulse width and the intermittent time in stages and combining a reverse pulse technology. The system integrates ALD deposition, pulse electroplating and an electroplating liquid circulation system, and high precision and high yield in the filling process are ensured. The method effectively solves the problems of insufficient seed layer coverage, limited mass transfer, cavity / suture defects and the like in the filling of the glass through hole with the high depth-diameter ratio (greater than or equal to 20: 1), and is suitable for advanced packaging and manufacturing of large-size glass substrates (such as 510mm * 515mm).

The invention belongs to the technical field of CGM sensors, and particularly relates to a CGM electrode sensor and a preparation method thereof.The preparation method comprises the following steps that three sets of stainless steel microneedle arrays are prepared from a stainless steel substrate and serve as a counter electrode, a reference electrode and a working electrode respectively; mechanically polishing the stainless steel microneedle array, and performing composite pickling activation; after surface pretreatment, a sol-gel deposition aluminum oxide layer is adopted; preparing a gold plating solution, and plating gold on the stainless steel microneedle array deposited with the aluminum oxide layer by adopting two-stage pulse electroplating; the working electrode is prepared by PMMA coating, adhesion layer construction, glucose oxidase immobilization and limiting layer construction; the counter electrode, the reference electrode and the working electrode are respectively embedded into the substrate to form the microneedle array electrode sensor with a three-electrode system. Based on a nickel-free direct gold plating process, good uniformity, strong binding force and lower cost after gold plating can be realized, so that the stability of the continuous glucose sensor in use is improved.

The utility model relates to the technical field of pulse electroplating equipment, and discloses electroplating liquid stirring equipment for pulse electroplating, which comprises an electroplating tank, a multi-dimensional stirring mechanism is arranged in the electroplating tank, and the multi-dimensional stirring mechanism comprises a displacement adjusting unit and a multi-directional stirring unit; the multidirectional stirring unit comprises a transverse axial flow device and a longitudinal axial flow device, the longitudinal axial flow device is used for driving the electroplating liquid to longitudinally flow, and the transverse axial flow device is used for driving the electroplating liquid to horizontally flow. According to the electroplating liquid stirring equipment for pulse electroplating, the multi-dimensional stirring mechanism drives electroplating liquid to flow in the horizontal direction and the vertical direction through combination of the transverse axial flow device and the longitudinal axial flow device. The direction of the transverse axial flow device is adjusted through a bottom rotary driving seat, the longitudinal axial flow device breaks through a traditional single vortex mode through vertical stirring, and three-dimensional flow is formed by driving electroplating liquid to flow in the horizontal direction and the vertical direction and adjusting the direction of the transverse axial flow device, so that the center and edge areas of an electroplating pool are covered; the flow velocity gradient difference is reduced.

This invention belongs to the field of nuclear power control rod processing technology, specifically relating to a chromium plating method and a continuous-pass chromium plating apparatus for ultra-long, ultra-fine, thin-walled cladding tubes used in nuclear power control rods. The chromium plating method includes pretreatment and chromium plating treatment. The pretreatment includes degreasing and cleaning the ultra-long, ultra-fine, thin-walled cladding tube. The chromium plating treatment is a continuous-pass chromium plating process, in which the pretreated cladding tube is continuously passed horizontally and at a uniform speed along its axial direction through at least one chromium plating tank. The cladding tube is supported by a support structure as it passes through each chromium plating tank, maintaining horizontal linear movement. Within each chromium plating tank, an annular anode surrounds the movement path of the cladding tube, and a pulsed power supply applies a cathode current to the cladding tube for pulse electroplating. This invention, by employing a uniform-speed continuous-pass chromium plating method and using an annular anode, ensures that the chromium plating time and current conditions are consistent along the entire axial length of the workpiece.

The present disclosure provides a circuit board production equipment and system capable of reducing the plating film clamping, which comprises a plating device and a dry film stripping device. The plating device comprises a first plate feeding mechanism, a plating tank and a pulse plating controller. The dry film stripping device comprises a second plate feeding mechanism, a stripping tank, a film residue filtering mechanism, a stripping liquid circulation control mechanism, a stripping monitoring sensor group, a stripping control box and a plate discharging mechanism. The pulse plating controller is used to switch the current between the on and off, and the plating parameters are controllable by setting the plating parameters. The temperature controller and the conveying rate controller are used to set the stripping temperature and the conveying rate of the stripping section, so as to fully strip the circuit board, reduce the surface tension of the dry film, quickly penetrate into the film clamping layer, soften and dissolve part of the dry film residue, and make the adhesion between the dry film and the copper layer disappear, thereby achieving the purpose of effectively removing the film clamping.

The present invention relates to the field of semiconductor device manufacturing technology, and in particular to a method for preparing a high-frequency response power transistor. First, an N-drift layer is grown on an N+ silicon substrate with a resistivity of >1000Ω·cm. An isolation trench with a depth of 12μm and a depth-to-width ratio of 5.9:1 is etched by ICP, and a SiO2 / Si3N4 composite dielectric layer is filled to expand the depletion layer to 18.5μm, thereby reducing the collector junction capacitance to 68pF and the breakdown voltage to 205V. Secondly, an interdigitated emitter is formed on the front side, and the back side is thinned to 100±2μm and then laser drilled. The through-holes are filled with pulse electroplated copper, and the copper pillar array compresses the loop inductance to 2.7nH. Finally, a Ti / Ni / Au transition layer is sputtered, and a diamond-copper composite substrate is hot-pressed and bonded. An 80nm TiC phase is formed at the interface, with a thermal conductivity of 635W / m·K and a thermal resistance reduced to 0.61K / W. The present invention optimizes capacitance, inductance, and thermal resistance, reducing switching losses by 57.8% and increasing power density to 51.2W / cm 2 , suitable for MHz-level high-frequency power systems.

The utility model discloses an anti-corrosion anti-interference double-pulse electroplating power supply, and belongs to the technical field of double-pulse electroplating power supplies. The system comprises an external power supply, an inverter circuit module, a transformer, a rectifier filter module, a pulse conversion module, an output module, a current detection module, a drive circuit module, an output end voltage acquisition module, an isolation feedback module, a pulse width modulation circuit, a control center, a drive circuit, a liquid crystal display module and an input module. Direct current or single pulse is output; after receiving a control signal generated by the control center, the driving circuit and the pulse width modulation circuit drive a corresponding switch tube to enable the main circuit to start working, at the same time, the current detection circuit and the output sampling circuit feed back the detected and collected signal to the control center in real time, the control center compares the feedback signal with a parameter set by a user, and the output sampling circuit outputs the control signal. And then the output control signal is adjusted, dynamic adjustment is carried out in this way, and it is guaranteed that the circuit outputs according to parameters set by a user.

The invention relates to the technical field of metal wire processing, and discloses a metal wire processing galvanization treatment process for aerospace engineering, which comprises the following steps: removing oil stains and oxide layers on the surface of a metal wire through multi-stage electrolytic degreasing, composite pickling rust removal, reverse water washing, micro-polishing and plasma activation; after the metal wire is subjected to rare earth enhanced plating assisting treatment, zinc-aluminum rare earth alloy pulse electroplating is adopted, dynamic filtering is matched, and an alloy plating layer is formed on the surface of the pretreated metal wire; redundant zinc liquid is removed through nitrogen-electromagnetic composite wiping, and then gradient cooling shaping is conducted; after the binding force of the alloy coating and the matrix is strengthened through low-temperature vacuum diffusion annealing, residual stress is eliminated through micro-vibration drawing; and trivalent chromium passivation and nanometer sealing are adopted to form a double protection layer. Through the synergistic effect of multi-stage pretreatment, rare earth enhanced coating formation, gradient post-treatment and dual protection, the binding force, uniformity, corrosion resistance and stability of the metal wire zinc coating for aerospace engineering are remarkably improved.

The invention discloses a method for improving copper-free holes of a circuit board, which comprises the following steps: when the hole diameter of a finished hole is 0.2-0.5 mm, the diameter of a drill bit is 0.15-0.45 mm, the rotating speed of the drill bit is 80000-120000 rpm, the feeding speed is 0.3-1.0 m / min, and the retracting speed is greater than or equal to 5 m / min; when the hole diameter of the finished hole is 0.5-1.5 mm, the diameter of a drill bit is 0.45-1.4 mm, the rotating speed of the drill bit is 20000-50000 rpm, the feeding speed is 1-3 m / min, and the retracting speed is larger than or equal to 5 m / min; copper deposition pretreatment: degumming, coarsening, cleaning, activating and washing the base material; copper deposition: copper deposition liquid medicine comprises the following components: 5-10 g / L of copper sulfate, 2-5 g / L of a reducing agent, 20-40 g / L of a complexing agent and 0.1-0.5 g / L of a stabilizer, the pH value of the copper deposition liquid medicine is 9-9.5, the temperature is 30-35 DEG C, and the reducing agent is formaldehyde; in the initial stage, the current density is 1-2 A / dm < 2 >, and the electroplating time is 5-10 min; and in the subsequent stage, the current density is 2-3 A / dm < 2 >, and the electroplating liquid is uniformly stirred by adopting mechanical stirring in the electroplating process. According to the method for improving the copper-free condition of the circuit board hole, the drilling technology, the copper deposition pretreatment technology, the copper deposition liquid medicine and the electroplating technology are optimized, the phenomenon that copper does not exist in the hole is avoided, and the conductivity of a product is improved.

The invention discloses a circuit board processing method and a circuit board. The method comprises the following steps: carrying out plasma cleaning on a copper-clad substrate and spraying a nano-scale photo-sensitive adhesive; engraving a circuit pattern by using femtosecond laser, and selectively etching a copper layer in combination with an ultrasonic-assisted acidic etching solution; through holes are formed through a CO2 laser and mechanical drilling composite process, and hole metallization is realized by adopting chemical copper plating and pulse electroplating; copper ion recovery and etching liquid regeneration are carried out on the waste etching liquid, and meanwhile, supercritical CO2 fluid is adopted for cleaning and stripping the photo-sensitive resist. Through innovative process combination, the problems of low efficiency, high pollution and insufficient precision in the prior art are solved.

The application relates to the technical field of high-speed data communication materials and high-speed interconnection structures, and discloses a composite silver foil applied to 224G and 448G high-frequency communication and a high-speed interconnection structure. The single-surface silver layer composite copper foil comprises a copper foil base tape, a first surface of the copper foil base tape is provided with a continuous and dense silver layer and constitutes a high-frequency signal transmission surface, and a second surface forms a bonding function surface; the silver layer is formed through pulse electroplating or double-pulse electroplating and is subjected to electrochemical leveling or electro-polishing treatment, so that the surface roughness Ra of the leveled silver layer is less than or equal to 0.05 mu m. The high-speed interconnection structure comprises a dielectric layer, a bonding layer and the single-surface silver layer composite copper foil, a side where the silver layer is located constitutes a high-frequency signal transmission side, and the second surface is combined with the dielectric layer through the bonding layer. The scheme can consider high-frequency low-loss transmission performance, bonding reliability with the dielectric layer and storage stability, and is suitable for 224G and 448G high-frequency data communication.

The invention discloses a high-precision electroplating grinding rod and a preparation method thereof, and belongs to the technical field of precision grinding tools. The electroplated grinding rod comprises a metal matrix and a composite coating, the composite coating comprises uniformly dispersed abrasive particles, the abrasive particle size distribution D90 / D10 is less than or equal to 1.5, the volume ratio is 15-45%, and the surface roughness Ra of the coating is less than or equal to 0.8 mu m. The preparation method comprises the steps of matrix pretreatment, grinding material ultrasonic-mechanical stirring synergistic dispersion, pulse electroplating and precise polishing. By optimizing the grinding material dispersion process and pulse electroplating parameters, the grinding material distribution uniformity is improved by more than 50%, the coating binding force is improved by 60%, the service life of a grinding rod is prolonged by two times, and the surface roughness Ra of a workpiece is reduced to be less than or equal to 0.1 mu m. The method is suitable for ultra-precision machining of high-hardness materials and has remarkable economic benefits and industrial application value.

The present invention discloses a blind via filling method using reduced graphene as a seed layer, which includes: pre-treating a drilled circuit board to remove smear and form a manganese dioxide layer on the surface of the blind via to obtain a pre-treated circuit board; forming a polyaniline layer on the surface of the manganese dioxide layer of the pre-treated circuit board to obtain a first circuit board; forming a graphene oxide layer on the surface of the polyaniline layer of the first circuit board to obtain a second circuit board; irradiating the second circuit board with ultraviolet light to reduce the graphene oxide to obtain a third circuit board; performing reverse pulse electroplating on the third circuit board, and after electroplating, completing the filling of the blind via on the circuit board. The blind via filling method of the present invention uses the conductive polymer polyaniline and graphene to construct a copper electroplating barrier layer and a seed layer, thereby improving the conductivity and filling efficiency of the blind via, and preventing the leakage of anodic glass fibers. At the same time, its preparation method has simple steps and involves fewer chemical raw materials, and is suitable for large-scale production.

The utility model discloses iron-based horizontal pulse electroplating equipment which comprises an electroplating tank and a copper dissolving tank used for dissolving pure copper particles to form electroplating liquid, and the copper dissolving tank is connected with the electroplating tank through a conveying pipeline; the electroplating bath comprises a bath body and a plurality of groups of anode boxes arranged in the bath body, each group of anode box comprises a lower frame body arranged at the bottom of the bath body, an upper frame body spaced from the lower frame body, a plating solution spraying device arranged on the lower frame body and the upper frame body, and a titanium mesh flatly laid in the lower frame body, and the titanium mesh of each group of anode boxes is respectively connected with a pulse rectifier. According to the iron-based horizontal pulse electroplating equipment provided by the utility model, the maintenance frequency can be obviously reduced, so that the cost of manpower and material resources is saved, the productivity is improved, the purpose of continuous clean production can be achieved by utilizing a Fe < 2 + > / Fe < 3 + > redox electron pair technology and only by regularly supplementing pure copper particles in the copper dissolving tank, the uniformity of electroplating copper thickness can be improved, and the deep electroplating capability of electroplating can be improved.

The invention relates to the technical field of antennas, in particular to an OBD (On-Board Diagnostic) integrated multi-band antenna manufacturing method based on an LDS (Laser Direct Structuring) process, which comprises the following steps of: carrying out injection molding on an OBD shell substrate by adopting a modified composite material containing a copper-nickel metal organic matter; cooperative processing is carried out through a 532nm and 1064nm dual-wavelength laser; treating in a chemical copper plating solution containing graphene quantum dots for 25-35 minutes; during treatment in a chemical nickel plating solution with the pH value of 8.5-9.5, pulse electroplating is synchronously carried out; local gold plating is assisted by femtosecond laser; processing an impedance gradient transition region in a nitrogen plasma environment; and S7, monitoring the components of the plating layer in real time through an online mass spectrometer, dynamically adjusting the parameters of the plating solution, and controlling the atomic ratio of Cu to Ni within the range of 3: 1 to 5: 1. Compared with the prior art, the method for manufacturing the OBD integrated multi-band antenna based on the LDS process can realize the structural integration of the antenna and the OBD shell, saves the internal space occupied by a traditional independent antenna, and facilitates the miniaturization of OBD equipment.

The utility model relates to the technical field of electroplating devices, in particular to a multilayer circuit board through hole pulse electroplating device. According to the technical scheme, the electroplating device comprises a bottom plate, a filter box, an electroplating tank, a mounting frame, a storage frame and a vibration motor, the filter box is arranged at the upper end of the bottom plate, the electroplating tank is arranged at the upper end of the filter box, a hydraulic rod is arranged above the electroplating tank, the mounting frame is arranged at the lower end of the hydraulic rod, and the storage frame is arranged below the mounting frame; guide plates are arranged at the two ends of the storage frame, springs are arranged between the guide plates and the mounting frame, and a vibration motor is arranged on the rear side of the lower end of the mounting frame. When the multi-layer circuit board through holes are subjected to pulse electroplating processing, the storage frame for storing the multi-layer circuit board is connected with the vibration structure, so that shaking is realized, and the problems that bubbles are formed in the through holes sometimes due to the fact that the through holes are small, and part of the through holes cannot be subjected to effective electroplating processing are solved.

The invention relates to a current density adjusting method, device and equipment for anode pulse electroplating. The method comprises the following steps: acquiring an anode pulse current of a current time period, and performing periodic reverse modulation on the anode pulse current based on a double-pulse current mode to obtain a reverse pulse current signal; performing closed-loop feedback adjustment processing on the anode pulse current based on the reverse pulse current signal to obtain an adjusted anode pulse current, and obtaining the anode pulse current density based on the electrical characteristics of the adjusted anode pulse current; determining a cathode potential change trend of the cathode region based on an electrical coupling relationship between the anode pulse current density and the cathode region, and performing compensation processing on a time sequence of the anode pulse current density based on the cathode potential change trend to obtain a current density adjustment strategy, and the pulse current density of the anode is kept in a preset dynamic change range in the pulse electroplating period. By adopting the method, the accurate dynamic control of the anode pulse current density can be realized.

The invention relates to the technical field of circuit board hole plating, and discloses a circuit board hole plating process, which comprises the following steps of: carrying out film pasting treatment on a circuit board after copper deposition and flash plating, exposing and developing the circuit board, placing the exposed and developed circuit board in an electrocoppering solution, covering the circuit board with the area of an anode, and enabling the anode to be parallel to the circuit board; holes are plated in a copper-iron system pulse electroplating mode, in the forward and reverse pulse electroplating process, the forward pulse time T1 is 0-100 milliseconds, the reverse pulse time T2 is not larger than 50 milliseconds, and preferably, the forward pulse time T1 is 100 milliseconds, and the reverse pulse time T2 is 10 milliseconds. In the whole technological process, the concentration difference of Fe < 3 + > exists between the hole opening of the through hole of the circuit board and the position in the through hole of the circuit board, the concentration of Fe < 3 + > is changed under the condition of positive and negative current exchange, thin copper electroplating copper at the hole opening and thick copper electroplating copper in the hole can be formed, subsequent procedure production is facilitated, quality scrapping is reduced, and the reliability of the circuit board is enhanced.

The invention relates to the technical field of copper foil processing, in particular to an ultra-thick rolled copper foil with low roughness and high peel strength and a preparation method thereof. The quaternary composite additive composed of L-ascorbic acid, nanocellulose, trisodium citrate and sodium polyaspartate is introduced into the roughening liquid and the curing liquid, gradient pulse electroplating is combined, the surface roughness Rz of the obtained copper foil is smaller than or equal to 1.2 micrometers, the peel strength is larger than or equal to 1.5 N / mm, and the electroplating liquid is free of cyanide and heavy metal pollution. Through the synergistic effect of additive molecules and process optimization, the contradiction between low roughness and high stripping resistance is solved, and the method is suitable for the high-end fields of 5G high-frequency substrates, new energy automobile battery current collectors and the like.