58results about How to "Good deep plating ability" patented technology

The invention discloses an electroplating solution for electroplating through holes and blind holes of circuit boards. The electroplating solution comprises the following components: 160-180g/L of copper sulfate pentahydrate, 20-50g/L of sulfuric acid, 0.05-0.07g/L of chloride ions, 0.5-1.5g/L of accelerant, 7-30g/L of inhibitor, 10-30g/L of leveling agent and the balance of water. The electroplating solution provided by the present invention is applicable to electroplate through holes and blinds holes of circuit boards, and in particular capable of realizing simultaneously hole-filling electroplating of a through hole and a blind hole in one groove of a circuit board; as a result, the electroplating steps are reduced and the production efficiency is improved.

A process for electroplating the inner and outer surfaces of steel tube with Zn is disclosed. It is characterized by that its electroplating liquid has the merits of both alkaline zincate and cyanide used for plating zinc. Its apparatus is characterized by that an auxiliary anode is additionally used inside the steel tube to be plated, that is, its hanger plays the roles of both cathode and anodes. Its advantages are high anticorrosion power of its plated layer and enough thickness of internal plated layer.

The invention relate to a leveling agent solution and a preparation method and application thereof. The leveling agent solution is obtained in the mode that a nitrogenous heterocyclic compound and a diepoxide compound are polymerized and then 1,3-propane sultone is used for an alkylation reaction. The leveling agent solution, a brightener and an inhibitor are used together, and a good electroplating effect can be obtained in electroplating of circuit board through holes.

The invention discloses a production technology of a fine bronzing plate with high precision and hardness. The production technology comprises the following steps : (1) loading materials; (2) chemical oil removal; (3) recycling washing; (4) electrolytic activation; (5) double cleaning; (6) nickel plating: carrying out chemical nickel plating by using a plating liquid containing 28 g / L nickel sulfate, 30 g / L sodium hypophosphite, 18 mL / L lactic acid (W = 85%), 13 g / L sodium acetate, 8 mg / L potassium iodate and purified water, adjusting the pH value of the plating liquid to 4.6-4.9, stirring at 85-91 DEG C for 3-5 min; (7) double cleaning; (8) drying; and (9) rolling. The invention employs electrolytic activation in advance and nickel preplating to substantially enhance firm combination degree of a nickel coating and a copper base and prolong service life of the bronzing plate.

The invention discloses a preparation method for cyanide-free 18 k gold jewelries. The preparation method comprises the steps of plate making, mold pressing, opening and reversing, alloy mold carrying, drilling, loading, degreasing, primary activation, copper bottoming, secondary activation, gloss copper 1 plating, electrolytic degreasing, ternary activation, gold water preparation, molten copperpreparation, 18 k electroforming, gloss copper 2 plating, demolding, tin bismuth copper removal, distressing, mold carrying, embedding, welding, combination, polishing, cooling, deoiling, electrolyticdegreasing, gold plating, pure water washing, drying, quality inspection, character printing, packing and delivery in sequence; and then, the cyanide-free 18 k gold jewelries are obtained. The preparation method is simple in process and easy to operate, obviously improves the jewelry quality, reduces the gold loss, and contains no cyanide-contained poisonous substance in the preparation process to achieve environmental protection and safety; the hardness and the toughness of the 18 k gold jewelries are prominently improved to preferably guarantee the stability of the jewelries in the wearingprocess; and further, electroforming liquid is excellent in stability, dispersibility and deep plating capacity, can be prepared beforehand for future use, and improves the production efficiency.

The invention discloses a dinitrodiammineplatinum ammoniacal electroplating solution for acidic platinum plating and an electroplating method adopting the dinitrodiammineplatinum ammoniacal electroplating solution. The dinitrodiammineplatinum ammoniacal electroplating solution comprises 20-30 g/L of dinitrodiammineplatinum ammoniacal which is measured by the content of platinum, 55-105 g/L of sulfanilic acid and 2-6 mg/L of calcium chloride which is measured by the content of calcium. Dinitrodiammineplatinum ammoniacal is utilized as a platinum main salt, sulfanilic acid is utilized as a complexing agent, and strontium chloride is utilized as a brightening agent, so that the obtained dinitrodiammineplatinum ammoniacal electroplating solution is relatively high in dispersion force and deep plating capability, and high in cathodic current efficiency and performance; when the dinitrodiammineplatinum ammoniacal electroplating solution is adopted for electroplating under an alkali condition, the obtained plating is low in porosity, and high in brightness and quality.

The invention discloses a metal surface zinc-nickel alloy electroplating solution. The formula of the electroplating solution comprises 20-50 g/L of zinc oxide, 10-20 g/L of nickel sulfate, 120-160 g/L of sodium hydroxide, 10-30 g/L of a complexing agent, 0.5-5 g/L of an additive and 1-5 g/L of a brightening agent, wherein the complexing agent is composed of ammonium citrate, triethanolamine and 1, 3-diamino-2-propanol according to the mass ratio of 1: (1-3): (3-5), the additive is composed of sodium phytate and hexadecyl trimethyl ammonium bromide according to the mass ratio of 1: (3-5), thebrightening agent is composed of saccharin, vanillin, 2-butyne-1, 4-diol and sodium allysulfonate according to the mass ratio of (5-10): (1-3): (3-5): 1. The electroplating solution can provide a bright zinc-nickel alloy coating with refined grains, improves the deep plating capability and dispersion performance of the coating, and is particularly suitable for electroplating of long-tube-shaped workpieces.

The present invention provides a vertical continuous electroplating hole filling line for PCB board processing. The vertical continuous electroplating hole filling line comprises a plurality of sub-lines arranged in a side-by-side manner, and is characterized in that each sub-line comprises a material feeding mechanism, a pretreatment device, a front shifting device, an electroplating pretreatment device, a multi-stage electroplating copper cylinder, a rear shifting device, a post-treatment device and a deplating device, wherein the material feeding mechanism, the pretreatment device, the front shifting device, the electroplating pretreatment device, the multi-stage electroplating copper cylinder, the rear shifting device, the post-treatment device and the deplating device are sequentially connected, the material inlet end of the material feeding mechanism is connected to an automatic plate feeding device, the material inlet end of the automatic plate feeding device is provided with a plate feeding conveying belt, and the material outlet end of the post-treatment device is sequentially connected to a central positioning machine, a corner turning machine, a horizontal plate drying machine and an automatic plate collection device. According to the present invention, with the vertical continuous electroplating hole filling line, the thickness uniformity of the plating layer at blind holes, buried holes and other hole filling positions of the high density circuit board, the deep plating ability, the hole filling ability and the bonding force are good, the shape is beautiful, the consistency of the hole wall plating layer and the plate surface plating layer is good, the operation, the maintenance and the repair are convenient, the structure is compact, the occupation space is small, the generated waste gas is less, and the environmental protection advantage is provided.

The invention discloses an alkaline P salt plating solution for electroplating platinum and an electroplating method thereof. In terms of platinum, the plating solution comprises 20-30g/L p salt, 90-110g/L ammonium nitrate, 8-12g/L potassium nitrite or sodium nitrite and 100-300mg/L sodium glutamate. The ammonium nitrate and the potassium nitrite or sodium are taken as auxiliary salts, and the sodium glutamate is taken as a brightening agent, so that the obtained plating solution has better dispersion force and deep plating cavity, high cathode current efficiency and excellent plating solution performance. A plating layer obtained by electroplating through the plating solution under an alkaline condition has low porosity, high brightness and good plating quality.

The invention discloses a compound chromium plating additive, comprising organic matter and inorganic matter, wherein the organic matter comprises 1-20 g of alkansulfonic acid and/or alkanoic disulfonic acid in 1L of a standard chromium plating liquid or 0.01-0.1 g of nitrogen-containing organic compound in 1L of the standard chromium plating liquid, the inorganic matter comprises 0.001-0.01 g of a light rare earth fluoride in1L of the standard chromium plating liquid and/or 0.01-0.1 g of one of VA family element oxide, hydroxide or sulfate/ According to the invention, the organic matter and the inorganic matter are added in the standard chromium plating liquid, thus the current efficiency is high , the coating has good brightness, the technology bright range is wide, the deep plating capability is good, the coating has high hardness, the anode has no corrosion, the technology is simple, and the cost is low.

The invention discloses a platinum electroplating solution comprising dihydrogen dinitrosulfatoplatinate and an electroplating method adopting the platinum electroplating solution. The electroplating solution comprises 4-6 g/L of dihydrogen dinitrosulfatoplatinate calculated by platinum, 100-140 g/L of water-soluble phosphate calculated by phosphate radicals, 4-8 mg/L of sodium dodecyl sulfate or dodecyl sulfate and sulfamic acid capable of adjusting the pH of the electroplating solution to be 1-2. According to the invention, dihydrogen dinitrosulfatoplatinate is used as platinum main salt, phosphate is used as brightener salt, dodecyl sulfate is used as an additive, and sulfamic acid is used for adjusting the pH of the electroplating solution to be acidic, so that the obtained electroplating solution has better dispersancy and deep plating capacity, and is high in cathode current efficiency and excellent in performance. A plating layer obtained by electroplating through the electroplating solution under alkaline conditions is low in porosity, high in brightness and good in quality.

The invention provides zinc-nickel alloy electroplating liquid. The zinc-nickel alloy electroplating liquid comprises 30-50 g/L of zinc chloride, 10-20 g/L of zinc acetate, 30-40 g/L of nickel sulfate, 100-150 g/L of sodium hydroxide, 20-40 g/L of a complexing agent, 5-10 g/L of a brightener and water. The brightener comprises sodium glycolate, sodium sulfamate, toluenesulfonamide and propargyl alcohol in a ratio of (1-2): (1-2): (3-5): (3-5); and the complexing agent comprises sodium citrate, ethylenediamine and triethanolamine in a mass ratio of (1-2): (3-5): (3-5). According to the electroplating liquid, zinc chloride, zinc acetate and nickel sulfate are used as main salt, and the brightener and the complexing agent with specific compositions are matched, so that a plating layer obtained by electroplating not only has good deep plating capability, but also has good wear resistance, high brightness and good neutral salt mist resistance.

The invention provides a PCB electroplating method and PCB electroplating equipment. The PCB electroplating method comprises the steps of S1, fixing a PCB in an electroplating tank body of the electroplating equipment, wherein a fixing assembly for fixing the PCB is arranged in the electroplating tank body of the electroplating equipment, and a first nozzle set and a second nozzle set are correspondingly arranged at the two sides of the PCB; and S2, controlling the first nozzle set and the second nozzle set to alternately execute a chemical liquid spraying operation and a chemical liquid suction operation, so that a positive pressure difference and a negative pressure difference are formed on the two sides of the PCB in the chemical liquid spraying process. According to the PCB electroplating method and the PCB electroplating equipment, the penetrability of chemical liquid flowing in holes during side spraying is improved, the good deep plating capacity is achieved, and the breakthrough that the TP value of the thickness-diameter ratio of 40: 1 is 100% can be achieved.

The invention discloses an electroplating solution for HEDP (1-hydroxyethylidene-1, 1-diphosphonic) cyanide-free copper plating and an electroplating method. The electroplating solution includes: 14-20g/L Cu2(OH)2CO3, 82123g/L HEDP, 20-40g/L citrate and 3-7g/L nitrate. The electroplating solution provided by the invention adopts HEDP as the coordination agent and citrate as the auxiliary coordination agent, so that the electroplating solution has good dispersion force and deep plating ability, high cathode current efficiency, and excellent performance. The coating obtained by electroplating of the electroplating solution under an alkaline condition has low porosity and good quality.

The invention discloses electroplate liquid and an electroplate method for cyanide-free gold plating of thallium-contained sulfite. The electroplate liquid is composed of 10-15 g/L of gold chloride in terms of gold, 78-94 g/L of sulfite in terms of sulfite radicals, 1-4 g/L of glycerinum, 0.30-0.65 g/L of organic phosphorus compounds and 0.05-0.14 g/L of thallous salt in terms of thallium. According to the electroplate liquid, the sulfite serves as main coordination agents, the glycerinum serves as stabilizers, the organic phosphorus compounds serve as electron accelerators, the thallous salt serves as brightening agents, and the gold chloride serves as main gold salt, so that the obtained electroplate liquid is good in dispersion capacity and covering capacity, cathode currents are high in efficiency, and the electroplate liquid is excellent in performance. By the adoption of the electroplate liquid, plating obtained through electroplating under the alkaline condition is low in porosity, high in brightness and good in quality.

The invention discloses a synthesis method of 1-benzylpyridinium-3-carboxylate. The 1-benzylpyridinium-3-carboxylate is obtained by performing a chemical reaction on benzyl chloride, nicotinic acid and sodium hydroxide serving as raw materials; fully dissolving the sodium hydroxide in water; adding the nicotinic acid; stirring to fully dissolve; adding a composite catalyst and a buffer; dropwise adding the benzyl chloride and continuously reacting for 1-2 hours after the dropwise adding is finished so as to obtain the 1-benzylpyridinium-3-carboxylate, wherein the composite catalyst is a mixture of K2CO3 or Na2CO3 and quaternary ammonium salt; the quaternary ammonium salt is one or more of tetrabutylammonium bromide, benzyltriethylammonium chloride, dodecyl trimethyl ammonium chloride, methyl trioctyl ammonium chloride, hexadecyl trimethyl ammonium bromide and bromogeramine; the buffer is one of sodium bicarbonate, sodium carbonate, sodium acetate and boric acid. The synthesis method has the advantages of high yield, short reaction time, low cost, high product purity, no environment pollution during production and environmental friendliness.

The invention discloses barium-salt-contained alkaline plating Pt P salt electroplating bath and an electroplating method of the electroplating bath. The electroplating bath comprises, by platinum, 20-30 g/L of P salt, 90-110 g/L of ammonium nitrate, 8-12 g/L of potassium nitrite or sodium nitrite and 6-10 mg/L of barium chloride by barium. P salt serves as platinum main salt, the ammonium nitrate and the potassium nitrite or sodium are taken as auxiliary salt, and the barium chloride serves as a brightening agent, so that the obtained electroplating bath has the good dispersion force and deep plating capacity, the current efficiency of a negative pole is high, and the performance of the plating bath is excellent. A coating obtained through electroplating of the electroplating bath under the alkaline condition is low in porosity, high in brightness and good in quality.

The invention discloses electroplate liquid and an electroplate method for cyanide-free gold plating of antimony-contained sulfite. The electroplate liquid is composed of 10-15 g/L of gold chloride in terms of gold, 78-94 g/L of sulfite in terms of sulfite radicals, 0.20-0.58 g/L of alcoholamine and 0.08-0.22 g/L of antimonous oxide. According to the electroplate liquid, the sulfite serves as main coordination agents, the alcoholamine serves as electron accelerators, the antimonous oxide serves as brightening agents, and the gold chloride serves as main gold salt, so that the obtained electroplate liquid is good in dispersion capacity and covering capacity, cathode currents are high in efficiency, and the electroplate liquid is excellent in performance. By the adoption of the electroplate liquid, plating obtained through electroplating under the alkaline condition is low in porosity, high in brightness and good in quality.

The present invention discloses an electroplating liquid and an electroplating method of biurea cyanide-free copper plating. The electroplating liquid comprises 10-23 g/L of Cu2(OH)2CO3, 30-85 g/L of biurea, 20-40 g/L of citrate, 3-7 g/L of nitrate, and 0.2-0.6 g/L of uracil. According to the electroplating liquid of the present invention, the biurea is adopted as the coordination agent, and the citrate is adopted as the auxiliary coordination agent, such that the electroplating liquid characteristics of good dispersion, good deep plating ability, high cathode current efficiency, and excellent plating liquid performance. In addition, the plating layer obtained through electroplating under the alkaline condition has characteristics of low porosity and good quality.

The invention discloses a plating solution for mercapto sulfonic acid non-cyanogen gold plating and a plating method thereof. The plating solution comprises 10-15g / L of gold trichloride calculated by gold, 35-55g / L mercapto sulfonic acid compound calculated by mercapto group, 11-17g / L citric acid and salts thereof calculated by citrate, and 50-70g / L EDTA. The plating solution uses mercapto sulfonic acid compound as the main complexing agent, uses citric acid and its salts, and EDTA as the auxiliary complexing agent, and uses gold trichloride as the main gold salt, so that the obtained plating solution has good dispersion force, deep plating capability power, high cathodic current efficiency, and excellent performance. The plating layer obtained under basic conditions by using the plating solution has the advantages of low porosity, high brightness and good plating layer quality.

The invention discloses an iodide-added thiosulfate cyanide-free gold-electroplating solution and an electroplating method. The gold-electroplating solution comprises 10-15 g/L by gold of gold trichloride, 100-140 g/L by thiosulfate radical of thiosulfate, 78-94 g/L by sulfite radical of sulfite, 30-55 g/L by iodine of iodide, 1-4 g/L of an alcohol amine compound, and 0.30-0.60 g/L by selenite radical of selenite. In the gold-electroplating solution, iodide is taken as a stabilizing agent; thiosulfate is taken as a complexant; the alcohol amine compound is taken as the electron accelerant; selenite is taken as a brightener; and gold trichloride is taken as main gold salt. Therefore, the obtained gold-electroplating solution is relatively good in dispersion and deep electroplating ability, high in cathodic current efficiency, and excellent in electroplating solution performance. Through adopting the electroplating solution in an alkaline condition, a plated layer obtained through electroplating is low in porosity, high in brightness, and excellent in plating quality.

The invention discloses a thiosulfate cyanide-free gold-plating electroplating liquid with added hydrazine hydrochloride and an electroplating method. The electroplating liquid comprises, 10-15 g/L of gold trichloride calculated based on gold, 100-140 g/L of a thiosulfate calculated based on thiosulfate radical, 78-94 g/L of a sulfite calculated based on sulfite radical, 5-15 g/L of hydrazine hydrochloride compound and 0.08-0.22 g/L of diantimony trioxide. The electroplating liquid employs the hydrazine hydrochloride compound as a stabilizing agent, employs diantimony trioxide as a brightener, employs a thiosulfate as a coordination agent and employs gold trichloride as a gold main salt, and the obtained electroplating liquid possesses relatively good dispersing force and covering power, high cathodic current efficiency and excellent performances. A plating layer obtained by employing the electroplating liquid for performing electroplating under an alkaline condition is low in porosity, high in brightness and good in plating-layer quality.

The invention relates to a electroplating solution and an electroplating method and application thereof. The electroplating solution comprises sulfuric acid, copper ions, chloride ions, a tetravalent vanadium compound, a pentavalent vanadium compound, a surfactant and an auxiliary agent. The surfactant comprises any one or a combination of at least two of polyoxyethylene and a derivative thereof, polyoxypropylene and a derivative thereof, a polyoxyethylene-polyoxypropylene copolymer and a derivative thereof or a fatty alcohol ethyoxyl compound. A plating layer formed after electroplating of the electroplating solution has the characteristics of fine plating layer crystals, high ductility and high electrical conduction performance.