Vertical continuous electroplating hole filling line

Abstract

The present invention provides a vertical continuous electroplating hole filling line for PCB board processing. The vertical continuous electroplating hole filling line comprises a plurality of sub-lines arranged in a side-by-side manner, and is characterized in that each sub-line comprises a material feeding mechanism, a pretreatment device, a front shifting device, an electroplating pretreatment device, a multi-stage electroplating copper cylinder, a rear shifting device, a post-treatment device and a deplating device, wherein the material feeding mechanism, the pretreatment device, the front shifting device, the electroplating pretreatment device, the multi-stage electroplating copper cylinder, the rear shifting device, the post-treatment device and the deplating device are sequentially connected, the material inlet end of the material feeding mechanism is connected to an automatic plate feeding device, the material inlet end of the automatic plate feeding device is provided with a plate feeding conveying belt, and the material outlet end of the post-treatment device is sequentially connected to a central positioning machine, a corner turning machine, a horizontal plate drying machine and an automatic plate collection device. According to the present invention, with the vertical continuous electroplating hole filling line, the thickness uniformity of the plating layer at blind holes, buried holes and other hole filling positions of the high density circuit board, the deep plating ability, the hole filling ability and the bonding force are good, the shape is beautiful, the consistency of the hole wall plating layer and the plate surface plating layer is good, the operation, the maintenance and the repair are convenient, the structure is compact, the occupation space is small, the generated waste gas is less, and the environmental protection advantage is provided.

Description

technical field [0001] The invention relates to the electroplating technology of circuit boards, in particular to a vertical continuous electroplating hole filling line applied to high-density circuit boards / laminated multilayer boards. Background technique [0002] In the electroplating of high-density interconnection boards, in order to achieve high-density requirements, as the number of board layers continues to increase, the holes continue to shrink, and the thickness-to-diameter ratio of the holes is also increasing. At present, these micro-holes are generally smaller than 0.15 mm, or even smaller than 30-50 μm. Electroplating in such tiny holes with a high thickness-to-diameter ratio is quite different from the hole plating of conventional printed circuit boards. When the hole depth of the non-through hole is deep or the thickness-to-diameter ratio is large, if horizontal electroplating is used, the non-through hole located on the lower surface of the high-density inte...

AI Technical Summary

Problems solved by technology

When the hole depth of the non-through hole is deep or the thickness-to-diameter ratio is large, if horizontal electroplating is used, the non-through hole located on the lower surface of the high-density interconnection board is difficult to drive away the gas in the hole, and the plating solution is difficult to enter the hole. Therefore, the existing The problems

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