31 results about "Copper cylinder" patented technology

The invention discloses a semiconductor structure and a forming method thereof. The forming method comprises the following steps: providing a substrate; forming a copper column structure on the substrate, wherein the copper column structure comprises a plurality of layers of copper column sections which are sequentially stacked and connected; the forming method of the copper column structure comprises the steps that a plurality of photoetching electroplating processes are carried out on a substrate, a layer of copper column section is formed in each photoetching electroplating process, and then the thickness of a photoetching layer formed in each photoetching electroplating process can be reduced, so that the technological difficulty of forming the photoetching layer and photoetching development is reduced. And the electroplating time of each layer of copper cylinder section is effectively shortened compared with the time of electroplating the whole copper cylinder at one time, so that the phenomena of swelling, cracking and the like of the photoetching layer in the electroplating operation for a long time can be avoided. The depth-to-width ratio of the single-layer copper column section is small, the exchange efficiency of copper plating liquid medicine can be guaranteed, and then the copper nodule phenomenon is reduced. And the copper column structure is divided into multiple layers of copper column sections, so that the height limitation of electroplating the whole copper column at a time can be broken through, and the copper column structure has higher designability.

The invention discloses a copper cylinder automatic crimping machine used for a lens, the lens comprises a lens base and a copper cylinder, the side surface of the lens base is non-uniformly provided with a plurality of crimping holes used for crimping the copper cylinder, the copper cylinder automatic crimping machine comprises a cam separation disc, the upper side surface of the cam separation disc is provided with at least one mounting part used for crimping the copper cylinder, the mounting part is provided with a containing hole for containing a copper column and a containing groove for containing a mirror base, the cam separation disc is sequentially provided with a copper column feeding position, a mirror base feeding position, a crimping position and a discharging position in the circumferential direction, and the cam separation disc can rotate so that the mounting part can be sequentially switched among the copper column feeding position, the mirror base feeding position, the crimping position and the discharging position. By introducing the cam separation disc and the related design thereof, an efficient, accurate and flexible copper column automatic crimping solution is provided, and the automatic crimping device is particularly suitable for a lens base with non-uniformly distributed crimping holes. According to the equipment, the crimping accuracy and orderliness are remarkably improved, and the strict requirements of the modern industry for efficient and high-quality production are met.

The utility model relates to the technical field of wiring mechanisms, in particular to a rapid wiring mechanism for electrical equipment, which comprises an upper shell and a lower shell, the upper shell and the lower shell are fixed through fixing bolts, adjusting bolts are in threaded connection with the side walls of the outer ends of the upper shell and the lower shell, the inner ends of the adjusting bolts are rotatably connected with pushing and pressing plates, and the pushing and pressing plates are in threaded connection with the upper shell and the lower shell. An arc-shaped groove is formed in the inner side of the pushing and pressing plate, and a plurality of positioning needles are fixedly mounted on the inner wall of the arc-shaped groove; according to the utility model, the insulating skin at one end of each wire is stripped off, and then the ends of the two wires which need to be connected together and are stripped off from the insulating skin are respectively inserted into the two guide cylinders until the adjusting bolts are respectively and alternately rotated, the adjusting bolts drive the push-press plates to move downwards, and the two copper cylinders are mutually deformed and tightly attached together. And meanwhile, the positioning pin in the arc-shaped groove is inserted into one copper cylinder, and the fixing pin is inserted into the other copper cylinder and is in contact with the electric wire, so that the two electric wires are quickly and firmly connected together.

The utility model discloses a crossed arrangement structure of anode titanium meshes in a copper cylinder, which is used in a copper cylinder in a pre-plating area, and the copper cylinder in the pre-plating area consists of a first section of copper cylinder, a second section of copper cylinder, a third section of copper cylinder and a fourth section of copper cylinder, an anode titanium mesh splicing structure is arranged in each of the first section of copper cylinder, the second section of copper cylinder, the third section of copper cylinder and the fourth section of copper cylinder, and the anode titanium mesh splicing structures in the first section of copper cylinder, the second section of copper cylinder, the third section of copper cylinder and the fourth section of copper cylinder are arranged in a crossed manner. According to the cross arrangement structure of the anode titanium meshes in the copper cylinder, the arrangement mode is simple, only space displacement is carried out, core parts do not need to be changed, the displacement size is flexible and adjustable, compared with a traditional anode titanium mesh center distribution structure, vacancies on the two sides of the edge of the copper cylinder are reduced, current distribution is more uniform, and the service life of the anode titanium meshes is prolonged. Therefore, the thickness of the pre-plating layer is more uniform, and terminal coating is prevented from being influenced; and the appearance can be improved, and deformation of the appearance after winding is prevented.

The invention relates to the technical field of photoresist materials, in particular to a super-thick dry film photoresist for copper cylinder electroplating and a preparation method of the super-thick dry film photoresist. The super-thick dry film photoresist is prepared from 38 to 48 parts of modified polyurethane acrylate, 12 to 18 parts of a first active diluent, 5 to 10 parts of a second active diluent, 5 to 10 parts of a plasticizer, 3 to 8 parts of a photoinitiator, 0.5 to 1.5 parts of a flatting agent and 0.1 to 0.3 part of a de-foaming agent, the second active diluent is trimethylolpropane triacrylate; the photoresist can form a super-thick and defect-free film layer, the adhesive force, the electroplating liquid corrosion resistance, the pattern resolution and other properties of the film layer are all improved, and the strict requirements of the copper cylinder electroplating process are met.

The utility model discloses a copper cylinder part processing and forming hardness detection device which comprises a mounting frame, a base is arranged in the mounting frame, the base is connected with the mounting frame through a rodless cylinder, a bottom mounting block is fixedly arranged at the lower end of the middle of the base, a bottom plate is arranged above the base, and the rodless cylinder is connected with the bottom mounting block. And the lower end of the bottom plate penetrates through the base and is in sliding connection with the bottom mounting block. According to the copper column part machining forming hardness detection device provided by the utility model, through the arrangement of the bottom plate, the plug pin, the spring and the bolt, when the working pressure is not large, the plug pin can be locked through the bolt, and at the moment, the bottom plate cannot be taken out, so that the work of disassembling and assembling a workpiece can be directly carried out on the bottom plate; when a large number of parts need to be detected, the bolt is loosened to unlock the bolt, at the moment, the bottom plate can be directly pulled out, and undetected parts installed on the bottom plate are directly put in, so that the working efficiency of the device can be improved, and the error probability can be reduced.

The invention belongs to the technical field of MEMS heat dissipation, and provides a circular cobweb-shaped micro-channel radiator which comprises a hollow annular radiator partition plate, an annular upper bottom plate, a circular lower bottom plate, a side wall circular water outlet, a central circular water inlet and a plurality of cobweb-shaped copper cylinder micro-arrays connected with a circular lower cover plate. The cobweb-shaped copper column array firstly partitions the micro-channel area, a cooling medium can sufficiently flow from the center position to the periphery along different paths partitioned by the copper columns, the cooling medium impacts the copper columns to achieve better heat exchange, and the pressure drop distribution condition is effectively improved under the condition that the heat dissipation capacity is improved. The design of high and dense central copper columns and low and sparse peripheral copper columns enables the circular power chip in the center of the circular lower bottom plate to be uniformly radiated, the radiating performance of the micro-channel radiator is improved, the structure of the radiator is optimized, and the micro-channel radiator has a good enterprise prospect in the radiating field of high-power devices.

The application discloses a master operating device for a vascular interventional surgery robot, which comprises a rack, an operating rod mechanism, a force feedback output mechanism, a displacement information acquisition mechanism and a controller; the operating rod, a nonmetal sleeve, an iron cylinder and a copper cylinder of the force feedback output mechanism are coaxially and fixedly connected in sequence from inside to outside along the radial direction of the operating rod; a plurality of permanent magnets are uniformly distributed in the magnet holder in the circumferential direction; the force feedback output mechanism generates axial output resistance through the axial relative displacement of the permanent magnet and the iron cylinder, generates eddy current through the circumferential relative rotation angular velocity of the permanent magnet and the copper cylinder and the iron cylinder, and generates circumferential output resistance through the interaction of the induced magnetic field generated by the eddy current and the permanent magnetic field generated by the permanent magnet. The master operating device can realize circumferential force feedback and axial force feedback, provides a simulated interventional surgery catheter stress environment for doctors, and solves the problem that axial force and circumferential force are difficult to decouple in force feedback.

The invention discloses a dual-function switchable terahertz absorber based on vanadium dioxide and embedded copper cylinder control, which comprises M * N dual-function switchable terahertz absorption units based on vanadium dioxide and embedded copper cylinder control, and the M * N dual-function switchable terahertz absorption units based on vanadium dioxide and embedded copper cylinder control are in M * N two-dimensional distribution, wherein M and N are positive integers; the difunctional switchable terahertz absorption unit based on vanadium dioxide and embedded copper cylinder control comprises a bottom plate, a connecting hole dielectric layer, a vanadium dioxide resonance layer, a blind hole dielectric layer and a metal ring which are sequentially arranged from bottom to top, the base plate, the connecting hole dielectric layer, the vanadium dioxide resonance layer and the blind hole dielectric layer are sequentially connected in series through the copper column array. The terahertz absorber can realize switching of two functions of broadband high absorption and double-frequency absorption in a wide frequency range. The invention further discloses a preparation method of the terahertz absorber.

A new energy automobile alternating current charging converter comprises a main shell and a gun nozzle installed at the lower end of the main shell, the upper end of the main shell is provided with a first connecting end, the lower end of the gun nozzle is provided with a second connecting end, a positioning rim and a positioning frame located below the positioning rim are arranged in the main shell, and an installation end is arranged on the positioning frame. The first switching end of the first control switching column and the first switching end of the second control switching column are installed on the positioning rim, a control module is arranged below the positioning rim, and the control module is provided with a first input end, a second input end, a first output end and a second output end. The lower ends of the first switching ends of the first control switching column and the second control switching column are connected to the first input end and the second input end respectively, and the second switching ends of the first control switching column and the second control switching column are installed on the installation ends respectively and connected to the first output end and the second output end respectively. A product binding post interface is in clamp-shaped contact through groove milling, and a converter conductor is a copper cylinder.

The utility model provides a bubble discharging device for a vertical plating line, which is arranged in a last-stage copper dissolving tank of the vertical plating line and comprises a flow guide component and a filter component, the flow guide assembly is provided with a flow guide plate which is obliquely arranged, so that the copper dissolving liquid in the previous-stage copper dissolving tank is obliquely and downwards guided into the last-stage copper dissolving tank; the filtering assembly is arranged between the flow guide assembly and the input port of the circulating pump, and the filtering assembly is provided with a first filtering net for blocking bubbles of the copper dissolving liquid, so that the copper dissolving liquid after the bubbles are filtered enters a copper cylinder through the circulating pump. The vertical electroplating line bubble discharging device is simple in structure and capable of effectively reducing bubbles in the copper dissolving tank from entering the copper cylinder, so that the reliability of subsequent electroplating quality is ensured.

The invention discloses a copper cylinder surface metallization and bonding process based on current-assisted thermocompression bonding, and belongs to the technical field of semiconductor packaging. Comprising the following steps that a nickel layer (2.0 + / -0.3 mu m) and a gold layer (3.0 + / -0.4 mu m, Ra is smaller than or equal to 0.8 mu m) are sequentially electroplated on the surface of a copper cylinder, and then low-temperature bonding of the high-roughness gold layer is achieved under the synergistic effect of applied pulse current (the peak current is 1.2-2.1 A, the duty ratio is 25%-50%, and the frequency is 2 KHz) and gradient pressure (0-200 MPa) in the air environment. Through current-induced Joule heat and interface atom diffusion, the bonding deformation is remarkably reduced, the shearing strength is improved, meanwhile, chip thermal damage caused by a traditional high-temperature process is avoided, the method is suitable for high-density advanced packaging, through precise electroplating control (the total thickness error of a nickel / gold layer is smaller than or equal to 1 micron) and polishing-free design, the chemical mechanical polishing (CMP) procedure is reduced, and the production cost is reduced. And the process period is shortened by 40%.

The invention discloses a copper cylinder electroplating system. The system comprises an electroplating bath; the electroplating mechanism comprises two groups of spraying units which are parallel and opposite to each other and extend along the length direction of the electroplating bath, and anode units which are correspondingly arranged on the backs of the spraying units; the cathode hanging tool comprises a frame body, a first conductive clamping assembly, a second conductive clamping assembly and an electricity taking carbon brush, the first conductive clamping assembly is arranged on the upper portion of the frame body, the second conductive clamping assembly is arranged on the lower portion of the frame body, and the electricity taking carbon brush is arranged on the side portion of the frame body. The second conductive clamping assembly is electrically connected with the first conductive clamping assembly and the second conductive clamping assembly through cables; each conductive groove is used for accommodating the power-taking carbon brush of the corresponding cathode hanger and providing cathode current for the power-taking carbon brush; according to the invention, the problems that the hanger used by the traditional electroplating bath cannot adapt to the quick remodeling requirements of PCBs with different sizes, and the uniformity of the plating layer of the PCB is influenced due to current interruption easily caused by fluctuation of contact resistance can be solved.

The invention discloses a device for improving conductivity of clamps of horizontal pulse electroplating equipment, and belongs to the technical field of horizontal electroplating equipment.The device comprises a rotary table, a plurality of clamp bodies and a dust recycling mechanism, the clamp bodies are installed on the periphery of the rotary table, and a sliding block is installed on each clamp body; a copper cylinder guide rail used in cooperation with the sliding block is arranged on one side of the rotary disc, a corrosion-resistant heat-shrinkable sleeve is selected as a protective sleeve, physical isolation protection can be conducted on a wire, dust recycling mechanisms are installed at the two ends of the copper cylinder guide rail, dust in the copper cylinder guide rail is brought into the positions of the dust recycling mechanisms through the sliding block, and the dust recycling efficiency is improved. Collection and cleaning are carried out through the dust recovery mechanism, so that no obvious dust exists in the copper cylinder guide rail, the sliding block and the copper cylinder guide rail are in good contact, the current stability of the clamp body is guaranteed, meanwhile, the service time of the sliding block and the copper cylinder guide rail is prolonged, and the good effect of improving the conductivity of the horizontal pulse electroplating equipment clamp is achieved.

The application relates to the technical field of hydraulic devices, in particular to a stable pressure relief structure of a hydraulic pump station, which comprises a valve body, the lower end of the valve body is provided with a liquid inlet, one side of the valve body is provided with a liquid outlet, the inner side of the lower end of the valve body is fixedly connected with a valve seat, the upper end of the valve body is rotationally connected with a threaded pipe, the upper end of the threaded pipe is fixedly connected with a rotating disc, the upper side of the rotating disc is fixedly connected with an air pump, the lower end of the threaded pipe is rotationally connected with a connecting plate, the lower side of the connecting plate is fixedly connected with a top plate, the lower side of the top plate is fixedly connected with a curved capsule, the lower end of the curved capsule is fixedly connected with a bottom plate, the lower side of the bottom plate is fixedly connected with a valve core, the lower end of the valve core is fixedly connected with a hemispherical shell, the inner side of the valve body is fixedly connected with a magnetic isolation plate, the magnetic isolation plate is fixedly connected with an electromagnetic coil group, and the magnetic isolation plate is fixedly connected with a magnetic conducting plate; the curved capsule 6 with adjustable initial pressure, initial rigidity and rigidity change coefficient and the multilayer Halbach array electromagnetic coil group 7 and the coaxial copper cylinder are adopted, so that the stable pressure relief structure of the hydraulic pump station with the advantages of fast response speed, strong pressure relief stability and good dynamic adjustment capacity is provided.

The invention belongs to the technical field of integrated circuit packaging, and particularly relates to a radio frequency chip wafer level fan-out type packaging method and a radio frequency chip wafer level fan-out type packaging structure. Comprising the following steps: completing wafer reconstruction through temporary bonding, chip mounting and plastic packaging; a copper cylinder sacrificial layer is manufactured on a bonding pad of a chip; a cavity structure is formed by photoetching, grinding and leveling the surface of the chip, so that the radio frequency performance is improved, and steps formed between the chip and the molding compound are eliminated; forming a bonding pad lead-out structure through a dry film laying and rewiring process; through a laser drilling and hole filling process, heat dissipation of the back surface of the chip is realized. The radio frequency performance is improved through the cavity structure, the heat dissipation of the chip is improved through the laser drilling and hole filling technology, and the method for eliminating the step between the chip and the resin matrix is provided.

The invention relates to the technical field of towed linear array element structure design, in particular to a vector hydrophone attitude stabilizing device. The invention discloses an array element attitude stabilizing device for a vector towed linear array. According to the technical scheme, an array element frame structure is formed by array element supporting rods, an array element front supporting seat and an array element rear supporting seat; the vector hydrophone is installed in the suspension frame through the suspension spring. The suspension frame is mounted below the array element front supporting seat; the electric slip ring is embedded into the lower end face of the array element front supporting seat, is connected with an external cable on one hand and is connected with the suspension frame on the other hand, and a balancing weight is arranged between the electric slip ring and the suspension frame; a red copper cylinder is arranged in the center of the array element rear supporting seat, and a permanent magnet damping roller is arranged in the red copper cylinder; and the permanent magnet damping roller is coaxially connected with the suspension frame. When the array element rotates or shakes, the vector hydrophone can restore to the initial position under the action of the permanent magnet damping roller, the balancing weight and the electric slip ring, and finally the effect of stable attitude of the array element is achieved.

The invention provides a conductive roller for 3D porous copper foil etching and a using method thereof.The conductive roller comprises a conductive roller body, a power transmission assembly, a conductive shoe pole assembly and insulating cylinders, the conductive roller body comprises a core shaft, the two ends of the core shaft are sleeved with the insulating cylinders, the insulating cylinders are sleeved with the power transmission assembly, and the power transmission assembly is in conductive connection with the conductive shoe pole assembly through friction; the middle section of the mandrel is sleeved with a copper cylinder, copper blocking rings are arranged between the two ends of the copper cylinder and the mandrel, an even number of copper rings are coaxially and evenly arranged between the middle section of the copper cylinder and the mandrel at intervals, and the mandrel is sleeved with the copper blocking rings and the copper rings. The power transmission assemblies located at the two ends of the core shaft penetrate through the copper blocking rings through a plurality of copper wires with the same length and are connected with the copper rings close to the side, and the four quadrants of each copper ring are each connected with a wire. The problem that in the 3D porous copper foil production process, due to the fact that the current density distribution of the conductive roller is not uniform, the pore size consistency and distribution uniformity of the porous copper foil are poor is effectively solved.

The utility model relates to a welding protection device technical field, specifically disclose a kind of inert gas device for protecting longitudinal weld forming, comprising: accommodating groove, one end of accommodating groove is fixedly installed with air inlet pipe, the inner end of accommodating groove is fixedly installed with corrosion-resistant air pipe, and the one end of air inlet pipe is fixedly connected with the one end of corrosion-resistant air pipe by passing through the lateral wall of accommodating groove;The inner end of accommodating groove is installed with hole copper plate, and hole copper plate is located at the upper end of corrosion-resistant air pipe, the utility model is according to the length of need welding stainless steel cylinder, rotating the accommodating groove of appropriate length, and accommodating groove is placed in the inner end of copper cylinder, and is fixed by U type card, guarantee the upper end port of accommodating groove is located below weld, welding can be carried out, can realize the uniform, stable output of inert gas, all-round, accurate protection is carried out to weld area, effectively improve the quality and forming effect of weld, simultaneously have simple structure, convenient operation, cost is relatively lower.

The invention relates to the technical field of wireless communication, and provides a packaging substrate copper column structure and a manufacturing method thereof, and the manufacturing method comprises the following steps: S1, completing the manufacturing of a circuit substrate through employing an mSAP technology; s2, selecting the upper surface of the circuit substrate or the lower surface of the circuit substrate as a to-be-grown copper cylinder surface, and performing copper cylinder growth manufacturing on the to-be-grown copper cylinder surface; s3, manufacturing a first solder mask layer and a second solder mask layer on the upper surface and the lower surface of the circuit substrate; s4, performing an electrical test on the appearance substrate; s5, the first solder mask layer and the second solder mask layer are etched, the copper columns and the areas, corresponding to the copper columns, of the circuit substrate are exposed, and the exposed areas of the copper columns and the exposed areas of the circuit substrate are coated with a first protection layer and a second protection layer respectively; and S6, after the circuit substrate is cleaned, appearance inspection is carried out, marking of a non-functional area is carried out, and a packaging substrate copper column structure is obtained. The packaging substrate copper column structure is good in heat dissipation effect and low in loss.

The invention provides a copper cylinder electroplating monitoring method and system based on thick photoresist dry film photoresist, and the method comprises the steps: obtaining photoresist data, dynamically adjusting the incident angle, polarization state and wavelength of a light source according to a multi-angle polarization light source array in combination with the photoresist data, and carrying out the irradiation of a deep hole array of the thick photoresist dry film photoresist. The method comprises the following steps: acquiring a dynamic light scattering image at an orifice of a deep hole array, performing image processing on the dynamic light scattering image, acquiring a meniscus characteristic parameter, acquiring a growth morphology parameter through a pre-established contrast database in combination with an extended Kalman filtering algorithm, and performing abnormality judgment on copper column growth according to the growth morphology parameter and the meniscus characteristic parameter. Obtaining an abnormal result, and performing process regulation and control through the abnormal result; the invention provides the copper cylinder electroplating monitoring method which is high in precision, strong in real-time performance and adaptive to the thick photoresist dry film deep hole structure, so that the accuracy of copper cylinder electroplating monitoring of the thick photoresist dry film photoresist is improved.

The invention discloses a BTTRZ corrugated copper sheath mineral insulated fireproof cable production line which comprises a cable core pay-off machine, a copper strip winding disc, a traction machine, an embossing machine, an extruding machine and a take-up machine, and the cable core pay-off machine, the traction machine, the embossing machine and the extruding machine are sequentially arranged in the direction from the copper strip winding disc to the take-up machine. A copper pipe cable core forming device used for pressing a copper strip into a copper pipe is arranged between the copper strip winding disc and the traction machine. The copper pipe cable core forming device comprises a supporting table, a copper strip trimming unit, a copper strip pipe forming unit and a copper pipe welding and coating unit, wherein the copper strip trimming unit, the copper strip pipe forming unit and the copper pipe welding and coating unit are sequentially arranged on the supporting table from the copper strip winding disc to the moving direction of the cable dragged by the dragger. A copper strip wire winding disc is arranged between the copper strip winding disc and the copper pipe cable core forming device. According to the invention, a copper strip can be quickly trimmed and rolled to form a copper pipe, a cable core is wrapped in the copper pipe to be welded to form a copper cylinder sheath, the forming of the copper pipe can be accurately and stably controlled, and the production quality of a cable is improved.

This utility model discloses a novel copper cylinder for TGV and ceramic filling electroplating, relating to the field of copper cylinder technology. It includes a copper cylinder body, with a left-right oscillating motor on one side and an eccentric wheel assembly at the output end of the oscillating motor. Two rows of side spray pipes are symmetrically arranged within the copper cylinder body, with the nozzles of the two rows of side spray pipes installed alternately. A hanger for suspending workpieces is provided between the two rows of side spray pipes. The two ends of the hanger are fixed to the middle position of the copper cylinder body via hanger guide grooves. This utility model, based on a traditional copper cylinder, changes the original left-right oscillating cathode flat plate and hanger to a fixed installation, and changes the side spray pipes to left-right oscillation, keeping the relative position of the hanger and anode unchanged, thereby forming a more uniform electroplating layer and improving electroplating uniformity.

The invention discloses a preparation method of a prefabricated copper column interconnection array module, and relates to the field of semiconductor packaging. The preparation method of the prefabricated copper column interconnection array module comprises the following steps of copper column prefabrication, module assembly, braid mounting and reflow soldering and base removal. According to the preparation method of the prefabricated copper column interconnection array module, the scheme of prefabricating solid copper columns and high-precision array implantation of a column implanting machine is adopted, the column implanting position and the angle of the copper columns are calibrated by means of a visual positioning system, the array precision error is smaller than or equal to + / -5 microns, the high-density interconnection requirement is met, and the production efficiency is improved. Liquid metal of gallium-indium alloy is filled in the axial micro-channel inside the prefabricated solid copper cylinder, the heat dissipation efficiency of the chip can be improved through the high thermal conductivity of the liquid metal, the problem of thermal failure of the high-power chip is solved, a circulation mechanism for axial micro-channel position precision detection, smoothness detection and rework calibration is established, and out-of-tolerance parts can be removed in time and process parameters can be compensated.

The application discloses a kind of based on magnetic field deflection arc tail flame's droplet temperature measurement device in wire arc additive manufacturing, it is related to electric arc additive manufacturing technical field.Wire feeding mechanism feeds welding wire, forms droplet under the action of arc;Electromagnet applies additional magnetic field, to produce arc tail flame deflection angle makes arc and metal droplet falling into calorimeter separate;Metal droplet drops into calorimeter, calorimeter monitors the temperature change of copper cylinder, calculates the temperature of droplet reaching calorimeter surface, utilizes infrared thermal imager to detect the temperature loss of droplet, and this part of temperature loss is compensated to the droplet temperature measured by solid copper calorimeter, obtains the relatively accurate temperature value of droplet itself.The application separates arc tail flame and droplet trajectory, to avoid arc tail flame heating solid calorimeter and interfering with the measurement of droplet temperature, to improve the precision of droplet temperature measurement, which has important theoretical significance and value to the temperature measurement and forming mechanism research of additive manufacturing.

The utility model discloses a kind of wear-resistant liquid silica gel rollers, it is related to silica gel roller technical field, including main shaft, edge attachment mechanism and scraper mechanism, the copper cylinder is installed in the one end of main shaft, the outer end of copper cylinder is installed with adhesive layer, the outer end of adhesive layer is installed with PVC plastic layer, the outer end of PVC plastic layer is installed with silica gel layer, the outer end of silica gel layer is installed with wear layer.The utility model is installed in the main shaft, copper cylinder, PVC plastic layer and wear layer by being set, main shaft is installed in the position needing work, surface wear layer is placed in the outer end of silica gel layer, material and silica gel layer material are same, texture is slightly hard, prevent silica gel layer abrasion under the condition that device work is not affected, and heat is generated in the high-speed working process of device, the copper cylinder set in the outer end of its main shaft has very good heat absorption and heat conduction function, and PVC plastic layer plays the buffering action while being impacted in silica gel layer, and the compression resistance of device is improved.

This invention provides a copper-containing titanium nitride modified layer on the surface of a titanium-containing substrate, its preparation method, and its application. The method for preparing the copper-containing titanium nitride modified layer on the surface of the titanium-containing substrate includes: Step 1: Pre-treating the surface of a titanium-containing substrate; Step 2: Placing the pre-treated titanium-containing substrate and a copper cylinder into a vacuum chamber, and then evacuating to a vacuum level of not less than 8 × 10⁻⁶. ‑4 Pa; Step 3: Fill the vacuum chamber with nitriding gas; Step 4: Apply bias voltage to the titanium-containing substrate and copper cylinder after the treatment in Step 3 to ionize the nitriding gas, control the discharge current, and after nitriding for a period of time, obtain a copper-containing titanium nitride modified layer. This invention, in a high vacuum environment, uses a copper cylinder to introduce copper and nitrogen elements onto the surface of the titanium-containing substrate by bombarding with a nitrogen ion beam. Simultaneously, the heat generated by the bombardment assists the diffusion of copper and nitrogen elements into the interior of the titanium substrate, forming a copper-containing titanium nitride modified layer on the surface of the titanium substrate to improve its hardness and antibacterial properties.

The utility model discloses a rubber runway with a good heat dissipation effect, which belongs to the technical field of runways and comprises a concrete base layer, a gravel layer is mounted above the concrete base layer, a water absorption layer is mounted above the gravel layer, a partition plate component is mounted above the water absorption layer, and a diaphragm layer is mounted above the partition plate component. A buffer assembly is installed above the diaphragm layer, a rubber surface layer is installed above the buffer assembly, a plurality of heat dissipation and purification devices are installed on the inner side of the rubber surface layer, and a water conduction device is installed on the side, close to the gravel layer, of the water absorption layer; according to the runway, the heat dissipation and purification device is arranged, heat dissipation can be conducted on the interior of the runway through cooperation of a heat conduction copper cylinder and a heat dissipation net when needed, and therefore the possibility that the runway is damaged due to heat accumulation is reduced, peculiar smells around the runway can be purified through activated carbon when needed, and the runway is environmentally friendly. And the working capability of the runway is further improved.

The application discloses a copper-filling device for PCB (Printed Circuit Board) and a method thereof. The device comprises a copper cylinder, the top of which is provided with an electroplating groove for copper filling; a floating platform is arranged in the electroplating groove, and a placing opening for placing the PCB is formed in one side of the floating platform; and a bubble-removing assembly is connected to the placing opening. The application relates to the field of PCB. The copper-filling device for PCB and the method thereof can make the PCB horizontally sink into the electrolytic tank, so that the electrolyte can infiltrate the outer wall of the PCB and climb along the pore wall of the micropore to squeeze out the air in the micropore, thereby achieving the effect of removing bubbles. Meanwhile, the pressure generated when the PCB is in contact with the copper-containing electrolyte can drive the vibration platform to move upwards, so that the vibration block can vibrate, the PCB can vibrate during the upward movement, the liquid tension on the surface of the PCB can be changed, the stress condition of the bubbles can be changed, the effect of shaking off the bubbles can be achieved, and the bubble-removing effect can be further improved.

The invention discloses a mass transfer method of a copper column plated with a solder layer, which comprises the following steps of: preparing a pre-implanted plate, namely arranging a release layer on a metal carrier plate, arranging a dry film layer above the release layer, forming a through hole in the dry film layer, arranging a gold layer at the bottom of the through hole, arranging a copper column on the gold layer, and arranging a solder layer on the copper column, and removing the dry film layer. During reflow soldering, the solder layer is combined with the substrate bonding pad, the release layer separates the metal carrier plate from the copper columns, and one-time accurate transfer of the copper column array is achieved. The invention belongs to the field of mass transfer methods for copper columns plated with solder layers, and particularly relates to a mass transfer method for copper columns plated with solder layers. According to the invention, the copper column is difficult to mount in the center of the solder paste and cannot be transferred in a large amount.