59 results about "Copper cylinder" patented technology

The novel titanium basket cover plate device comprises a titanium basket cover plate body, a plurality of sets of installation guide grooves are formed in the upper surface of the titanium basket cover plate body, a reinforcing guide strip is embedded in each set of installation guide groove, and the reinforcing guide strips are arranged in the installation guide grooves. According to the novel titanium basket cover plate body, the reinforcing guide strips are used for increasing support, so that a thin plate can pass through the center positions of an upper titanium basket and a lower titanium basket, the distance between the plate and the upper titanium basket and the distance between the plate and the lower titanium basket are approximately equal, it is ensured that electroplated and separated metal copper is evenly attached to a cathode plate (a PCB), and therefore the production efficiency is improved; the improved titanium basket cover plate device can more effectively control the up-and-down fluttering range of a plate in a copper cylinder and the guiding effect, so that product damage caused by collision of a spray pipe, a nozzle and the like is reduced, the rejection rate is further reduced, the plate corner of a thin plate cannot collide with a wheel and a cover plate hole position, and plate corner deformation is avoided.

The embodiment of the invention discloses a chip packaging structure and packaging method of a copper-cylinder-free wafer. The chip packaging structure comprises a plastic packaging layer and a chip packaged in the plastic packaging layer. The chip surface of the chip is provided with metal pins, and the metal pins are electrically connected with multiple layers of circuits exposed out of the plastic packaging layer; and the metal pins are electrically connected with the multiple layers of circuits through metal ball structures manufactured by a ball mounting process. According to the chip packaging structure of the copper-cylinder-free wafer provided by the invention, Buffing packaging is replaced by ball mounting, and the metal ball structure is manufactured on the metal pin of the chip through a ball mounting process before circuit manufacturing, so that the manufacturing and connection of a subsequent circuit are not influenced, the problem that a small-size chip copper cylinder cannot be manufactured by Buffing packaging can be solved, the copper-cylinder-free wafer can be stably packaged, and the production efficiency of the copper-cylinder-free wafer is improved. The ball mounting process is completed during packaging, the overall production efficiency of the wafer is improved, and the packaging cost can be reduced by combining with PLP packaging.

The invention discloses a circuit board hole copper metal heat treatment method and metal heat treatment equipment, the circuit board hole copper metal heat treatment method specifically adopts a laser beam to heat a conductive copper column so as to carry out metal heat treatment, and when the laser beam heats the conductive copper column, the metal heat treatment is carried out on the conductive copper column. The thermal field temperature of the side wall of the conductive copper column is lower than the melting point temperature of the conductive copper column, so that the conductive copper column on the circuit board can be independently heated by using the laser beam so as to carry out metal heat treatment on the conductive copper column, and the metal characteristic of the conductive copper column can be improved on the premise that the structure of the circuit board is not damaged; the conductive copper cylinder can meet the performance requirements of a high-calorific-value, high-frequency and high-speed circuit board, and particularly can improve the mechanical reliability performance such as flexibility and compactness of the conductive copper cylinder and the high-frequency and high-speed electric signal transmission performance, thereby improving the thermal stability and the electric signal transmission performance of the circuit board.

The invention discloses a semiconductor structure and a forming method thereof. The forming method comprises the following steps: providing a substrate; forming a copper column structure on the substrate, wherein the copper column structure comprises a plurality of layers of copper column sections which are sequentially stacked and connected; the forming method of the copper column structure comprises the steps that a plurality of photoetching electroplating processes are carried out on a substrate, a layer of copper column section is formed in each photoetching electroplating process, and then the thickness of a photoetching layer formed in each photoetching electroplating process can be reduced, so that the technological difficulty of forming the photoetching layer and photoetching development is reduced. And the electroplating time of each layer of copper cylinder section is effectively shortened compared with the time of electroplating the whole copper cylinder at one time, so that the phenomena of swelling, cracking and the like of the photoetching layer in the electroplating operation for a long time can be avoided. The depth-to-width ratio of the single-layer copper column section is small, the exchange efficiency of copper plating liquid medicine can be guaranteed, and then the copper nodule phenomenon is reduced. And the copper column structure is divided into multiple layers of copper column sections, so that the height limitation of electroplating the whole copper column at a time can be broken through, and the copper column structure has higher designability.

The invention belongs to the technical field of welding, and particularly relates to a copper column multi-face welding process which comprises a welding piece, the welding piece is provided with at least two opposite or adjacent tin soldering faces, a copper column is welded to any tin soldering face, and the specific welding process comprises the following steps that S100, the copper columns are placed on the tin soldering faces, and the copper columns are welded to the tin soldering faces; a to-be-welded seam is formed between the contact surfaces of the copper column and the tin soldering surface; the method aims at determining the welding sequence of all to-be-welded joints on a welding part in advance, then sorting solder wires according to the melting points from high to low, then filling the first to-be-welded joint with the solder wire with the highest melting point, then filling the second to-be-welded joint with the solder wire with the second highest melting point, and so on. In this way, it can be ensured that when the solder wire in the subsequent to-be-welded seam is heated, the solder wire in the previous to-be-welded seam cannot be molten again, and therefore the performance of the welded seam before and after welding can be effectively controlled by selecting ordered welding and adopting the solder wires with different melting points, and the welding quality is improved.

The invention discloses copper column CCD inspection equipment, and particularly relates to the field of copper column measurement, the copper column CCD inspection equipment comprises a box body, a workbench is fixedly arranged on the box body, the copper column CCD inspection equipment further comprises a transferring assembly, a measuring assembly and an anti-interference assembly, the transferring assembly is used for transferring a copper column and the measuring assembly, the measuring assembly comprises a plurality of cameras arranged on a supporting frame and the box body respectively, and the cameras are arranged on the supporting frame and the box body respectively. The measuring assembly is used for measuring the copper column, the anti-interference assembly comprises a first shielding piece and a second shielding piece, and the first shielding piece and the second shielding piece are both used for shielding the copper column. Different positions of the copper column are shielded at different time through the first shielding piece and the second shielding piece, and meanwhile the angle of a triangular prism is adjusted, so that the copper column can be accurately measured. Only the position needing to be reflected is reflected, the threaded hole, the chamfer, the long hole and the step of the copper cylinder can be rapidly measured respectively, and the measurement efficiency and accuracy of the copper cylinder are improved.

The utility model discloses a mutual inductor detection device, which relates to the mutual inductor detection technology field, and comprises a substrate, the substrate is provided with a conveying unit, a detection unit and a pickup unit, the detection unit comprises a first door frame, a first sliding driving cylinder, a second sliding driving cylinder, a first clamping driving cylinder, a second clamping driving cylinder and a third clamping driving cylinder, the first portal frame is provided with a first sliding driving cylinder, and the output end of the first sliding driving cylinder is provided with a first clamping driving cylinder; a second sliding driving cylinder is arranged below the first sliding driving cylinder, and a second clamping driving cylinder and a third clamping driving cylinder are arranged at the output end of the second sliding driving cylinder; a first electric clamping jaw is arranged at the output end of the first clamping driving cylinder; a second electric clamping jaw is arranged at the output end of the second clamping driving cylinder; a third electric clamping jaw is arranged at the output end of the third clamping driving cylinder; the copper cylinder pin detection device can replace manpower to clamp and detect two ends of a copper cylinder and pins at the same time, so that the detection efficiency is improved, and the quality is ensured.

The invention discloses a copper cylinder automatic crimping machine used for a lens, the lens comprises a lens base and a copper cylinder, the side surface of the lens base is non-uniformly provided with a plurality of crimping holes used for crimping the copper cylinder, the copper cylinder automatic crimping machine comprises a cam separation disc, the upper side surface of the cam separation disc is provided with at least one mounting part used for crimping the copper cylinder, the mounting part is provided with a containing hole for containing a copper column and a containing groove for containing a mirror base, the cam separation disc is sequentially provided with a copper column feeding position, a mirror base feeding position, a crimping position and a discharging position in the circumferential direction, and the cam separation disc can rotate so that the mounting part can be sequentially switched among the copper column feeding position, the mirror base feeding position, the crimping position and the discharging position. By introducing the cam separation disc and the related design thereof, an efficient, accurate and flexible copper column automatic crimping solution is provided, and the automatic crimping device is particularly suitable for a lens base with non-uniformly distributed crimping holes. According to the equipment, the crimping accuracy and orderliness are remarkably improved, and the strict requirements of the modern industry for efficient and high-quality production are met.

The utility model relates to the technical field of wiring mechanisms, in particular to a rapid wiring mechanism for electrical equipment, which comprises an upper shell and a lower shell, the upper shell and the lower shell are fixed through fixing bolts, adjusting bolts are in threaded connection with the side walls of the outer ends of the upper shell and the lower shell, the inner ends of the adjusting bolts are rotatably connected with pushing and pressing plates, and the pushing and pressing plates are in threaded connection with the upper shell and the lower shell. An arc-shaped groove is formed in the inner side of the pushing and pressing plate, and a plurality of positioning needles are fixedly mounted on the inner wall of the arc-shaped groove; according to the utility model, the insulating skin at one end of each wire is stripped off, and then the ends of the two wires which need to be connected together and are stripped off from the insulating skin are respectively inserted into the two guide cylinders until the adjusting bolts are respectively and alternately rotated, the adjusting bolts drive the push-press plates to move downwards, and the two copper cylinders are mutually deformed and tightly attached together. And meanwhile, the positioning pin in the arc-shaped groove is inserted into one copper cylinder, and the fixing pin is inserted into the other copper cylinder and is in contact with the electric wire, so that the two electric wires are quickly and firmly connected together.

The utility model discloses a crossed arrangement structure of anode titanium meshes in a copper cylinder, which is used in a copper cylinder in a pre-plating area, and the copper cylinder in the pre-plating area consists of a first section of copper cylinder, a second section of copper cylinder, a third section of copper cylinder and a fourth section of copper cylinder, an anode titanium mesh splicing structure is arranged in each of the first section of copper cylinder, the second section of copper cylinder, the third section of copper cylinder and the fourth section of copper cylinder, and the anode titanium mesh splicing structures in the first section of copper cylinder, the second section of copper cylinder, the third section of copper cylinder and the fourth section of copper cylinder are arranged in a crossed manner. According to the cross arrangement structure of the anode titanium meshes in the copper cylinder, the arrangement mode is simple, only space displacement is carried out, core parts do not need to be changed, the displacement size is flexible and adjustable, compared with a traditional anode titanium mesh center distribution structure, vacancies on the two sides of the edge of the copper cylinder are reduced, current distribution is more uniform, and the service life of the anode titanium meshes is prolonged. Therefore, the thickness of the pre-plating layer is more uniform, and terminal coating is prevented from being influenced; and the appearance can be improved, and deformation of the appearance after winding is prevented.

The invention relates to the technical field of photoresist materials, in particular to a super-thick dry film photoresist for copper cylinder electroplating and a preparation method of the super-thick dry film photoresist. The super-thick dry film photoresist is prepared from 38 to 48 parts of modified polyurethane acrylate, 12 to 18 parts of a first active diluent, 5 to 10 parts of a second active diluent, 5 to 10 parts of a plasticizer, 3 to 8 parts of a photoinitiator, 0.5 to 1.5 parts of a flatting agent and 0.1 to 0.3 part of a de-foaming agent, the second active diluent is trimethylolpropane triacrylate; the photoresist can form a super-thick and defect-free film layer, the adhesive force, the electroplating liquid corrosion resistance, the pattern resolution and other properties of the film layer are all improved, and the strict requirements of the copper cylinder electroplating process are met.

The utility model discloses a withstand voltage test module for a PCB (Printed Circuit Board). The withstand voltage test module comprises the PCB, the PCB comprises two external layers and a plurality of internal board layers; each built-in board layer is provided with a withstand voltage test bonding pad and a lead. The lead wire of each built-in board layer is connected with the withstand voltage test bonding pad of the built-in board layer; the leads of any two adjacent built-in board layers are staggered in the horizontal direction; a plurality of copper cylinders are arranged on the PCB; the plurality of copper cylinders are in one-to-one correspondence with the plurality of built-in plate layers; a plurality of external bonding pads are arranged on one external layer; and the plurality of external bonding pads are respectively in one-to-one correspondence with the plurality of copper cylinders. According to the utility model, the manufacturing cost can be reduced, the withstand voltage data of the corresponding layer can be detected only by connecting the withstand voltage instrument with the external bonding pad of the corresponding layer, and the test operation is facilitated; and meanwhile, the voltage resistance of the PCB can be tested, and the product is not damaged.

The utility model discloses a braided copper cylinder processing auxiliary clamping device which comprises a fixing frame, limiting rods are symmetrically and fixedly installed in the fixing frame, clamping plates are symmetrically and slidably installed in the fixing frame, and the two clamping plates can move towards each other or back to back. A copper wire at one end of the braided copper column net is placed between the first clamping grooves between the two clamping plates, or the braided copper column net is inserted into the outer side between the two clamping plates, and the end portions of the two fixing plates extrude the inner wall of the braided copper column net to fix the position of the braided copper column net. The device is used for fixing braided copper column nets of different sizes in different modes and is used for fixing and clamping the braided copper column nets during electroplating, the two clamping plates are driven to move in the opposite direction or the opposite direction through rotation, the braided copper column nets between the two clamping plates or the braided copper column nets outside the ends of the two clamping plates fall down, and the braided copper column nets are taken down. The outer ring main body of the woven copper column net cannot be touched, and the protection device is used for protecting the woven copper column net.

The utility model discloses a copper cylinder part processing and forming hardness detection device which comprises a mounting frame, a base is arranged in the mounting frame, the base is connected with the mounting frame through a rodless cylinder, a bottom mounting block is fixedly arranged at the lower end of the middle of the base, a bottom plate is arranged above the base, and the rodless cylinder is connected with the bottom mounting block. And the lower end of the bottom plate penetrates through the base and is in sliding connection with the bottom mounting block. According to the copper column part machining forming hardness detection device provided by the utility model, through the arrangement of the bottom plate, the plug pin, the spring and the bolt, when the working pressure is not large, the plug pin can be locked through the bolt, and at the moment, the bottom plate cannot be taken out, so that the work of disassembling and assembling a workpiece can be directly carried out on the bottom plate; when a large number of parts need to be detected, the bolt is loosened to unlock the bolt, at the moment, the bottom plate can be directly pulled out, and undetected parts installed on the bottom plate are directly put in, so that the working efficiency of the device can be improved, and the error probability can be reduced.

The invention belongs to the technical field of MEMS heat dissipation, and provides a circular cobweb-shaped micro-channel radiator which comprises a hollow annular radiator partition plate, an annular upper bottom plate, a circular lower bottom plate, a side wall circular water outlet, a central circular water inlet and a plurality of cobweb-shaped copper cylinder micro-arrays connected with a circular lower cover plate. The cobweb-shaped copper column array firstly partitions the micro-channel area, a cooling medium can sufficiently flow from the center position to the periphery along different paths partitioned by the copper columns, the cooling medium impacts the copper columns to achieve better heat exchange, and the pressure drop distribution condition is effectively improved under the condition that the heat dissipation capacity is improved. The design of high and dense central copper columns and low and sparse peripheral copper columns enables the circular power chip in the center of the circular lower bottom plate to be uniformly radiated, the radiating performance of the micro-channel radiator is improved, the structure of the radiator is optimized, and the micro-channel radiator has a good enterprise prospect in the radiating field of high-power devices.

The utility model relates to the technical field of VCP production equipment, and particularly discloses a novel G5 device for improving sinking, missing filling and scratching of VCP, which comprises an outer frame, a U-shaped frame is mounted at the upper end of the outer frame, and an upper grating component, a middle grating component and a lower grating component are arranged on the outer frame; the upper grille part is composed of a third transverse strip, a short transverse strip and two second vertical strips, the third transverse strip and the short transverse strip are fixed to the two second vertical strips in parallel, and one end of each second vertical strip is connected with the U-shaped frame; the upper grating component, the middle grating component and the lower grating component are matched with the outer frame, so that during use, the outer frame is mounted in a copper cylinder through the mounting mechanism, supporting force is provided for a product passing through a plate on a production line through the connecting rope and the first transverse strip, shielding to a spray pipe can be effectively reduced, the uniformity of pressure of the spray pipe is guaranteed, and the production efficiency is improved. Therefore, the quality of products produced by the production line is improved.

The utility model relates to a core bar for casting a large nuclear power copper-containing cylinder, which comprises a lower-layer horizontal framework, a middle-layer horizontal framework and an upper-layer horizontal framework, the middle parts of the lower-layer horizontal framework and the middle-layer horizontal framework as well as the middle parts of the middle-layer horizontal framework and the upper-layer horizontal framework are connected through vertical support columns, and the side parts of the middle-layer horizontal framework and the upper-layer horizontal framework are connected through side support columns; the lower-layer horizontal framework comprises two parallel lower-layer cross beams, the lower-layer cross beams are connected through lower-layer connecting beams, the lower surfaces of the lower-layer connecting beams are connected with lower stand columns, the middle-layer horizontal framework comprises three parallel middle-layer cross beams, the middle-layer cross beams are connected through middle-layer connecting beams, and the lower surfaces of the middle-layer cross beams in the middle are connected with middle-layer stand columns. The upper-layer horizontal framework comprises three parallel upper-layer cross beams, the upper-layer cross beams are connected through upper-layer connecting beams, and the upper surfaces of the upper-layer cross beams are connected with a plurality of upper stand columns. The utility model is adapted to the shape of the cylinder sand core, realizes stress balance, increases the strength of the sand core, and does not influence the deformability of a sand mold.

The utility model relates to a cable fitting grounding system conductive connecting piece, and relates to the conductive connecting piece technology field, the cable fitting grounding system conductive connecting piece comprises a connecting piece, a copper cylinder and a pressing assembly, the copper cylinder is arranged on the connecting piece, the pressing assembly comprises a fixed ring, a connecting ring, a rotating ring, an inclined plane block, an abutting column, an abutting plate and a limiting piece, the fixed ring is fixedly arranged on the copper cylinder, and the rotating ring is arranged on the connecting ring. The connecting ring is arranged on the fixed ring, the rotating ring is rotationally arranged in the connecting ring, the inclined plane block is fixedly arranged on the rotating ring, a connecting hole is formed in the connecting ring, the abutting column is slidably arranged on the rotating ring through the connecting hole, the abutting plate is arranged at the end, away from the connecting ring, of the abutting column, and a connecting groove is formed in the connecting ring; according to the utility model, the tight connection of the cable can be realized through the pressing assembly by simply shifting the limiting piece and rotating the limiting piece, the installation process is relatively simple and rapid, complicated tools and processes are not needed, and the frequency and difficulty of maintenance are reduced.

The invention discloses a compressed air ore washing vibrating screen, and relates to the technical field of screening equipment. The vibrating screen comprises a vibrating box, an inclined screen is fixed in the vibrating box, a feeding port is formed in the upper end of the vibrating box, and a discharging port is formed in the lower end of the vibrating box. When a vibrating box drives a movable block to compress air in an empty box in a reciprocating mode through a connecting block, the vibrating box can drive a friction block to rub a copper cylinder to heat compressed air in the empty box at the same time, and therefore the compressed air in the empty box is discharged into a sealing block through a first bifurcated pipe and a first connecting pipe; the closed block is arranged on the rotating pipe, then the closed block discharges compressed air into the rotating pipe and discharges the compressed air through the air spraying holes, then the compressed air sprayed out of the air spraying holes cleans mineral aggregates blocking the screen, the heated compressed air dries the wet mineral aggregates above and below the screen, and therefore the purposes of drying the mineral aggregates and cleaning blockage of the screen are achieved.

The application discloses a master operating device for a vascular interventional surgery robot, which comprises a rack, an operating rod mechanism, a force feedback output mechanism, a displacement information acquisition mechanism and a controller; the operating rod, a nonmetal sleeve, an iron cylinder and a copper cylinder of the force feedback output mechanism are coaxially and fixedly connected in sequence from inside to outside along the radial direction of the operating rod; a plurality of permanent magnets are uniformly distributed in the magnet holder in the circumferential direction; the force feedback output mechanism generates axial output resistance through the axial relative displacement of the permanent magnet and the iron cylinder, generates eddy current through the circumferential relative rotation angular velocity of the permanent magnet and the copper cylinder and the iron cylinder, and generates circumferential output resistance through the interaction of the induced magnetic field generated by the eddy current and the permanent magnetic field generated by the permanent magnet. The master operating device can realize circumferential force feedback and axial force feedback, provides a simulated interventional surgery catheter stress environment for doctors, and solves the problem that axial force and circumferential force are difficult to decouple in force feedback.

The invention belongs to the field of semiconductors, and particularly discloses an electroplating method for a wafer-level copper cylinder. In the copper cylinder electroplating process, polyvinylpyrrolidone and alkylbenzene sulfonate in the electroplating liquid cooperate with each other, the number of defects such as holes and cracks in the copper cylinder can be obviously reduced, the adhesive force of the copper cylinder is improved, and the mechanical property of the copper cylinder is improved.

The present invention discloses a structure of an ultra-wide cathode roller with high conductivity, which includes a steel shaft, a steel cylinder, a titanium cylinder, a sealing end plate, a long copper cylinder and a copper ring; a large copper support flat plate is arranged inside the sealing end plate, and a first long reinforcing rib is arranged between them. The first short copper cylinder is electrically connected to the long copper cylinder. Second short copper cylinders are evenly distributed on the inner steel shaft and are electrically connected to the first short copper cylinder. Copper support rib plates are arranged on the second short copper cylinders and are connected to the steel cylinder through conductive reinforcing arc plates. Second long reinforcing ribs are arranged on the copper support rib plates. Copper wires are evenly distributed on the steel cylinder, and then the titanium cylinder is assembled by interference fit; the large copper support flat plate provides a stable current for the cathode roller surface and enhances the rigidity of the cathode roller. When there is a connection hidden danger between it and the long copper cylinder, the copper support rib plate combined with the second short copper cylinder and the conductive reinforcing arc plate can provide a compensating current, and can provide sufficient support again to ensure the current stability and rigidity of the cathode roller.

The invention discloses a dual-function switchable terahertz absorber based on vanadium dioxide and embedded copper cylinder control, which comprises M * N dual-function switchable terahertz absorption units based on vanadium dioxide and embedded copper cylinder control, and the M * N dual-function switchable terahertz absorption units based on vanadium dioxide and embedded copper cylinder control are in M * N two-dimensional distribution, wherein M and N are positive integers; the difunctional switchable terahertz absorption unit based on vanadium dioxide and embedded copper cylinder control comprises a bottom plate, a connecting hole dielectric layer, a vanadium dioxide resonance layer, a blind hole dielectric layer and a metal ring which are sequentially arranged from bottom to top, the base plate, the connecting hole dielectric layer, the vanadium dioxide resonance layer and the blind hole dielectric layer are sequentially connected in series through the copper column array. The terahertz absorber can realize switching of two functions of broadband high absorption and double-frequency absorption in a wide frequency range. The invention further discloses a preparation method of the terahertz absorber.

A new energy automobile alternating current charging converter comprises a main shell and a gun nozzle installed at the lower end of the main shell, the upper end of the main shell is provided with a first connecting end, the lower end of the gun nozzle is provided with a second connecting end, a positioning rim and a positioning frame located below the positioning rim are arranged in the main shell, and an installation end is arranged on the positioning frame. The first switching end of the first control switching column and the first switching end of the second control switching column are installed on the positioning rim, a control module is arranged below the positioning rim, and the control module is provided with a first input end, a second input end, a first output end and a second output end. The lower ends of the first switching ends of the first control switching column and the second control switching column are connected to the first input end and the second input end respectively, and the second switching ends of the first control switching column and the second control switching column are installed on the installation ends respectively and connected to the first output end and the second output end respectively. A product binding post interface is in clamp-shaped contact through groove milling, and a converter conductor is a copper cylinder.

The utility model provides a bubble discharging device for a vertical plating line, which is arranged in a last-stage copper dissolving tank of the vertical plating line and comprises a flow guide component and a filter component, the flow guide assembly is provided with a flow guide plate which is obliquely arranged, so that the copper dissolving liquid in the previous-stage copper dissolving tank is obliquely and downwards guided into the last-stage copper dissolving tank; the filtering assembly is arranged between the flow guide assembly and the input port of the circulating pump, and the filtering assembly is provided with a first filtering net for blocking bubbles of the copper dissolving liquid, so that the copper dissolving liquid after the bubbles are filtered enters a copper cylinder through the circulating pump. The vertical electroplating line bubble discharging device is simple in structure and capable of effectively reducing bubbles in the copper dissolving tank from entering the copper cylinder, so that the reliability of subsequent electroplating quality is ensured.

The invention discloses a bridging packaging interconnection method, which comprises the following steps of S1, preparing a dipping interface, coating nano-particle slurry or depositing solid nano-particles on the surface of a dipping substrate to obtain the dipping interface containing a nano-particle layer, and the thickness of the nano-particle layer is less than 1 [mu] m; s2, the dipping body and the substrate are cleaned up and then pretreated; s3, sucking the dipping body with the copper cylinder end by a suction head of the bonding machine, immersing the copper cylinder end into the dipping interface for dipping, and then lifting up; s4, introducing protective gas, aligning the copper column end on the dipping body to a corresponding welding area on the substrate through an optical system of a bonding machine, and applying corresponding pressure, ultrasound and temperature to carry out bonding; and S5, cooling at room temperature after bonding to obtain the super-fine pitch bridging packaging structure. According to the invention, the problems that super-fine pitch interconnection between a silicon bridge and a chip cannot be realized and the requirement of high-density packaging cannot be met in the fields of chiplet and heterogeneous integration are solved.

The invention discloses a copper cylinder surface metallization and bonding process based on current-assisted thermocompression bonding, and belongs to the technical field of semiconductor packaging. Comprising the following steps that a nickel layer (2.0 + / -0.3 mu m) and a gold layer (3.0 + / -0.4 mu m, Ra is smaller than or equal to 0.8 mu m) are sequentially electroplated on the surface of a copper cylinder, and then low-temperature bonding of the high-roughness gold layer is achieved under the synergistic effect of applied pulse current (the peak current is 1.2-2.1 A, the duty ratio is 25%-50%, and the frequency is 2 KHz) and gradient pressure (0-200 MPa) in the air environment. Through current-induced Joule heat and interface atom diffusion, the bonding deformation is remarkably reduced, the shearing strength is improved, meanwhile, chip thermal damage caused by a traditional high-temperature process is avoided, the method is suitable for high-density advanced packaging, through precise electroplating control (the total thickness error of a nickel / gold layer is smaller than or equal to 1 micron) and polishing-free design, the chemical mechanical polishing (CMP) procedure is reduced, and the production cost is reduced. And the process period is shortened by 40%.

The invention discloses a copper cylinder electroplating system. The system comprises an electroplating bath; the electroplating mechanism comprises two groups of spraying units which are parallel and opposite to each other and extend along the length direction of the electroplating bath, and anode units which are correspondingly arranged on the backs of the spraying units; the cathode hanging tool comprises a frame body, a first conductive clamping assembly, a second conductive clamping assembly and an electricity taking carbon brush, the first conductive clamping assembly is arranged on the upper portion of the frame body, the second conductive clamping assembly is arranged on the lower portion of the frame body, and the electricity taking carbon brush is arranged on the side portion of the frame body. The second conductive clamping assembly is electrically connected with the first conductive clamping assembly and the second conductive clamping assembly through cables; each conductive groove is used for accommodating the power-taking carbon brush of the corresponding cathode hanger and providing cathode current for the power-taking carbon brush; according to the invention, the problems that the hanger used by the traditional electroplating bath cannot adapt to the quick remodeling requirements of PCBs with different sizes, and the uniformity of the plating layer of the PCB is influenced due to current interruption easily caused by fluctuation of contact resistance can be solved.

The invention discloses a PCB copper filling device and method, and the device comprises a copper cylinder, the top of which is provided with an electroplating bath for copper filling; and the floating table is arranged in the electroplating bath, one side of the floating table is concaved inwards to form a containing opening used for containing a PCB, and the interior of the containing opening is connected with a bubble removing assembly. The invention relates to the field of PCBs. According to the copper filling device and method for the PCB, through the arranged bubble removing assembly, the PCB can horizontally sink into the electrolytic bath, the outer wall of the PCB is infiltrated by electrolyte, the electrolyte climbs along the hole walls of the micropores, air in the micropores is squeezed out, the bubble removing effect is achieved, and the copper filling efficiency is improved. And meanwhile, the pressure generated when the PCB is in contact with the copper-containing electrolyte is used for driving the vibration table to move upwards, so that the vibration block vibrates, the PCB vibrates in the upward moving process, the liquid tension on the surface of the PCB is changed, the stress condition of bubbles is changed, the effect of removing the bubbles through vibration is achieved, and the bubble removing effect is further improved.

The clamping-free injection molding binding post comprises a binding post plastic seat and a dustproof cover, an installation structure is arranged on the upper surface of the binding post plastic seat, the installation structure comprises a first dissolving glue groove and a second dissolving glue groove, and the first dissolving glue groove and the second dissolving glue groove are formed in the upper surface of the binding post plastic seat. According to the clamping-piece-free injection molding binding post, the binding post plastic base, the fixing rubber ring and the binding post copper cylinder I are used in cooperation, a traditional integrated clamping piece injection molding structure is divided into the binding post plastic base, the fixing rubber ring and the binding post copper cylinder I, the whole product is fused together through ultrasonic riveting design, assembling is convenient and fast, cost and machining procedures are saved, and the clamping piece-free injection molding binding post is convenient to use. The service life is prolonged, the product is integrally designed to be attractive and cannot be disassembled, and safety and reliability during use are guaranteed.