105results about How to "Finely crafted" patented technology

The invention relates to a manufacturing method of a printed circuit board and an integrated circuit packaging substrate; based on the interconnection of electroplating pore filling and a semi-additive forming layer and a fine circuit, the method comprises the following steps: (1) a dielectric layer is manufactured on the substrate; (2) blind hole structure is manufactured on the dielectric layer; (3) after the blind hole structure is completed, a first conductive seed layer is manufactured; (4) a solid conductive via hole is manufactured by adopting the method of electroplating pore filling, and a copper layer grows and covers on the first seed layer in the process of electroplating pore filling; (5) the copper layer and the first seed layer are removed, and a solid copper cylinder in the solid conductive via hole is retained; (6) a second seed layer of semi-additive manufacturing circuit is manufactured; (7) a photosensitive thin film is glued, an anti-plating layer is formed by transferring diagram and the circuit diagram is exposed: (8) the circuit in the circuit diagram is thickened; (9) the photosensitive thin film and the exposed second seed layer are removed, the thickened circuit is retained, and a needed conductive diagram is formed; (10) all the steps from (1) to (9) are repeated on the new circuit surface, and the manufacture of fine circuits of following circuit layers and the connection of the solid conductive via holes in the layers are completed.

The invention relates to a method for making electric conduction patterns on a metal-foil-clad insulating substrate. The method comprises the steps that insulating envelope grooves are machined in the periphery of a conducting layer which needs to be reserved, and machining is conducted twice or more when excessively narrow isolated wires are encountered; a conducting layer which needs to be removed is subdivided into a plurality of strip-shaped heat-insulating small blocks, wherein one end of each small block is narrowed, the other end of each small block is widened, and the narrowed end of one metal foil layer small block and the widened end of another metal foil layer small block adjacent to the metal foil layer small block are arranged in a corresponding mode; next, laser beams are projected onto the heat-insulating small blocks obtained after subdivision, so that the small blocks are separated from the substrate material and removed. According to the method for making the electric conduction patterns on the metal foil-clad insulating substrate, by means of adjusting the projection parameters, a projection path and the projection environment of a laser, the conducting layer on the substrate material is removed, a predetermined electric conduction structure is formed, corresponding technological processes adopted for manufacturing the electric conduction structure through a chemical method, a physical method and a laser method in the prior art are replaced, the laser is directly used for forming and making the electric conduction patterns, as a result, multiple devices and materials are omitted, environmental friendliness is achieved, the process is short, the technology is simple and easy to implement, and the method is suitable for manufacturing multiple types of circuit board samples with higher accuracy in a small-batch mode and general circuit boards.