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275 results about "Metallizing" patented technology

Metallizing is the general name for the technique of coating metal on the surface of objects. Metallic coatings may be decorative, protective or functional. Techniques for metallization started as early as mirror making. In 1835, Justus von Liebig discovered the process of coating a glass surface with metallic silver, making the glass mirror one of the earliest items being metallized. Plating other non-metallic objects grew rapidly with introduction of ABS plastic. Because a non-metallic object tends to be a poor electrical conductor, the object's surface must be made conductive before plating can be performed. The plastic part is first etched chemically by a suitable process, such as dipping in a hot chromic acid-sulfuric acid mixture. The etched surface is sensitized and activated by first dipping in tin(II) chloride solution, then palladium chloride solution. The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf/cm or 10 to 60 N/cm or 5 to 35 lbf/in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.

Method for processing patterns in blind slot of printed circuit board

ActiveCN103079350AMeet design and assembly performance requirementsImprove pass rateConductive material chemical/electrolytical removalCopper platingProcess patterns
The invention discloses a method for processing patterns in a blind slot of a printed circuit board. The method comprises the following steps of drilling a hole in the printed circuit board; forming an inner copper layer on the printed circuit board; milling the blind slot with controlled depth on the printed circuit board; exposing the inner copper layer at the bottom of the blind slot; carrying out electroless copper plating on the printed circuit board, wherein the electroless copper plating areas comprise the bottom and the side walls of the blind slot; plating gold on the surface of the printed circuit board, wherein the gold plating area comprises the bottom of the blind slot; using an ultraviolet ray to burn the gold on the area to be isolated at the bottom of the blind slot, and exposing the copper surface; and corroding the exposed copper on the area to be isolated at the bottom of the blind slot, so as to form a circuit pattern at the bottom of the blind slot. The method disclosed by the embodiment of the invention has the advantages that the metallizing of the side wall of the blind slot is realized, the metallic through hole and the circuit pattern are manufactured at the bottom of the blind slot, and the qualified rate of the pattern is improved.
Owner:GCI SCI & TECH

Method for carrying out full dry method composite film plating on metal surface

The invention discloses a method for carrying out full dry method composite film plating on a metal surface, and relates to a treatment method of the metal surface. The invention provides a method for carrying out full dry method composite film plating on metal surface capable of obtaining a highly bright metal appearance through only a layer of PVD (Physical Vapor Deposition) plated metal film and finish without spraying a primer. The method comprises the following steps: mechanically polishing and cleaning a metal blank; plating a metal film on the cleaned metal blank; organically spraying the obtained sample and solidifying at high temperature to obtain a product. After test, the obtained metalized metal product has the advantages of antisepsis, corrosion resistance, weather resistance, temperature resistance and colorful property, the surface is hard and smooth, and is comparable to the quality of the conventional hydroelectric plating metal product, roughening, activating and washing processes in the conventional hydroelectric plating are removed, no any harmful electroplating liquid medicine is added, in particular, toxic hexavalent chromium and cyanide are not used, meanwhile, the process has less metal consumption and few waste gas, and is completely free of wastewater discharge and low in cost, and the method is suitable for bathroom, electronics, electrical appliance and automobile industries.
Owner:NINGBO RUNNER INDAL CORP

Method for preparing monodisperse silver-coated microspheres for anisotropic conductive adhesive

The invention relates to a method for preparing monodisperse silver-coated microspheres, and belongs to the fields of silver-coated microspheres, electronic connecting materials and the like. The method comprises the following steps of: preparing monodisperse melamine formaldehyde resin (MF) microspheres by using a dispersion polymerization method; roughing, sensitizing, activating and chemically plating a nickel metal and a silver metal by taking the microspheres as mother spheres so as to obtain the monodisperse silver-coated MF microspheres. The MF mother spheres have the advantages of simple and reliable preparation process, high efficiency, controllable grain size, good monodispersibility and the like. Because the MF microspheres contain active groups such as amino acid, hydroxyl and the like, the coat is complete and high in binding force, the grain size of the silver-coated microspheres can be controlled in a range of 1.0-3.9mu m, the dispersion coefficient epsilon is 0.045-0.067, the monodispersibility is high, the decomposition temperature is about 300DEG C, and the thermal stability is high; moreover, the preparation method is simple and high-efficiency, has the advantages of industrial production, and has good application prospect in the fields of electronic connecting materials such as anisotropic conductive adhesives and the like.
Owner:NANJING INST OF TECH
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