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57results about How to "Flexible thickness control" patented technology

Composite white light LED and preparation method

The invention discloses a composite white light LED which comprises a substrate, an LED chip and a transparent casing. The bottom of the LED chip is fixed to the surface of the substrate. The upper part of the substrate is sleeved by a transparent shell. The upper part of the LED chip is covered with phosphor colloid. The inner surface of the transparent shell is attached with a quantum dot film. An air gap is between the quantum dot film and the phosphor colloid. The invention also discloses a preparation method of the composite white light LED. Since the air gap is between the phosphor colloid and a quantum dot shell, the air gap can prevent the absorption effect between quantum dot emitting light and fluorescent powder emitting light, the quantum dot film and a fluorescent powder layer are curved surface topographies, the removal of light energy is facilitated, and thus the light emitting efficiency of the composite white light LED is improved significantly. The operation method is simple, the cost is low, the thicknesses, topographies and compositions of the phosphor colloid and the quantum dot film can be flexibly controlled, thus the composite white light LED with high color performance is obtained, and the composite white light LED is suitable for mass production.
Owner:TIANJIN ZHONGHUAN QUANTUM TECH CO LTD

Epoxy resin fiber reinforced concrete for repair and preparation method thereof

ActiveCN104193222AEasy to makeThinner savingEpoxyBasalt fiber
The invention relates to an epoxy resin fiber reinforced concrete for repair and preparation and application methods thereof. The epoxy resin fiber reinforced concrete is prepared from the following raw materials in percentage by weight: 55-70% of refined quartz sands, 33-17% of epoxy resin, 11-9% of curing agent and 1-4% of basalt fiber chopped strands. The preparation method comprises the following the following steps: by using the refined quartz sands as aggregates and epoxy resin as a gel material, adding the basalt fiber chopped strands; and mixing according to an appointed proportion. The product provided by the invention is extremely high in viscosity, can be well combined with defected concrete of a base layer and is not easy to peel and bulge. The strength can reach the strength grade of concrete C50. The concrete is simple to manufacture, can be prepared on site and needs not to be heated on site. Epoxy resin needs not to be diluted, and the construction steps are saved and the concrete is convenient to use while no diluents are introduced. The product is short in curing time, and comes into use in 24 hours after repair. The concrete is strong in adaptability, can be suitable for repairing defects of thick and thin layers of a terrace at the same time and can be used for repairing various defects of terrace such as pits formed by collision or high-low difference due to differential settlement of the concrete terrace.
Owner:北京金港建设股份有限公司 +1

Method for preparing PVDF (Polyvinylidene Fluoride) lithium ion battery diaphragm by electrostatic spinning

The invention discloses a method for preparing a PVDF (Polyvinylidene Fluoride) lithium ion battery diaphragm by electrostatic spinning. The method comprises the following steps: firstly, preparing polyvinylidene fluoride glacial acetic acid solution with the concentration of 17-20 percent by weight; secondly, stirring the polyvinylidene fluoride glacial acetic acid solution to be uniform; thirdly, completely cooling the polyvinylidene fluoride glacial acetic acid solution at room temperature of 25DEG C to obtain spinning solution; fourthly, taking a proper amount of spinning solution by using an injector, placing the injector on an injection pump, connecting a needle head, clamping an anode of a high voltage static generator on the needle head, enabling a cathode of the high voltage static generator to be connected with a receiving screen, and laying tin foil paper on rollers; fifthly, setting the spinning speed, adjusting the spinning voltage and the spinning distance and then performing static spinning; after the spinning is ended, taking off the tin foil paper from the rollers to obtain the lithium ion battery diaphragm. The method disclosed by the invention has the advantages of simple process, low energy consumption, low production cost and high performances of products; the pore size and the film thickness can be flexibly controlled, the improvement on both the ionic transparency of the diaphragm and the cycle performance of the battery is facilitated, and a good marker prospect is obtained.
Owner:SICHUAN UNIVERSITY OF SCIENCE AND ENGINEERING

Method for manufacturing long-term efficient anti-reflection micro-nano structure on copper surface and application

ActiveCN112959005AHas anti-reflective propertiesLong-term high-efficiency anti-reflection function characteristicsVacuum evaporation coatingSputtering coatingSputteringNano structuring
The invention belongs to the technical field of high heat conduction media, and discloses a method for manufacturing a long-term efficient anti-reflection micro-nano structure on a copper surface. The method comprises the following steps: polishing red copper and/or a copper elementary substance sample; placing the polished sample on a laser processing platform, performing preset path scanning on the sample by using pulse laser to obtain a sample surface with a micro-nano composite structure, and packaging the sample into a vacuum bag; and placing the obtained sample in a sample furnace of magnetron sputtering equipment, and growing a layer of silicon dioxide protective film on the surface of the micro-nano structure to obtain the long-term efficient anti-reflection micro-nano structure. According to the method, the micro-nano structure with the anti-reflection characteristic is prepared on the copper surface, and then a layer of inert film is grown on the surface of the micro-nano structure for protection through a film coating method, so that the micro-nano structure has the long-term efficient anti-reflection function characteristic; and the thickness of the silicon dioxide protection layer is flexibly controlled by controlling the coating time of magnetron sputtering, the strength performance of the protection layer is improved, and the problem of failure of the anti-reflection structure on the copper surface is effectively solved.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Carbon-ceramic brake disc with wear-resistant and anti-oxidation coating and preparation method of carbon-ceramic brake disc

The invention discloses a carbon-ceramic brake disc with a wear-resistant and anti-oxidation coating and a preparation method of the carbon-ceramic brake disc. The preparation method comprises the following steps that grooving treatment is conducted on the upper surface and the lower surface of a carbon/carbon composite material disc body, then coating slurry is brushed in a groove in the upper surface till the groove in the upper surface is filled with the coating slurry, and then the carbon/carbon composite material disc body is turned over, the groove in the lower surface is coated with the coating slurry till the groove in the lower surface is filled with the coating slurry, thus the carbon/carbon composite material disc body containing the coating slurry is obtained, curing, carbonization and ceramization treatment are sequentially conducted, and the carbon-ceramic brake disc is obtained. The preparation process of the wear-resistant and oxidation-resistant coating is simple, large-scale industrial mass production is easy to realize, the coating is bright and smooth in appearance, the bonding strength between the coating and the disc body is high, the size precision is easy to accurately control, and the problem that the size is easy to control inaccurately when the ceramic brake disc is subjected to machining treatment can be effectively solved.
Owner:HUNAN SHIXIN NEW MATERIALS CO LTD

Cache-on-board (COB) technology-based integrated light emitting diode (LED) packing method

The invention relates to a cashe-on-board (COB) technology-based integrated light emitting diode (LED) packing method, which comprises the following steps that: 1. thickness of a mould and diameter of a reserved hole are adjusted; 2. the reserved hole on the mould is aligned to an LED chip which is well fixed on an aluminum circuit board, and the mould covers the aluminum circuit board; 3. after fluorescent glue is sprayed on the aluminum circuit board, the aluminum circuit board is baked, then the mould is removed after the baking so as to obtain an LED packing unit. The method has followinng beneficial effects that: the shape, position, thickness and quantity of the fluorescent flue can be adjusted by adjusting the thickness of a silicone board and the diameter of the reserved hole, so the LED integrated packing procedures can be simplified, the heat resistance and the working temperature of the LED chip can be reduced, the shape, position, thickness and quantity of the fluorescent glue can be flexible to control, the light emitting efficiency and the consistency, stability and service life of the product can be improved, the packing efficiency also can be improved, the waste can be reduced, and the product cost can be reduced. The baking temperature is set as 140 to 160 DEG C, so the packing effect is better.
Owner:秦会斌 +6

Preparation method of titanium dioxide based self-cleaning glass

The invention relates to a preparation method of titanium dioxide based self-cleaning glass, aiming at solving the problems in the preparation process of the self-cleaning glass that because the technology is complex, the requirement for manpower and material resources is high and the coating efficiency is low, large-area popularization is hard to realize. According to the preparation method disclosed by the invention, a simple sol-gel method is adopted for preparing TiO2 (B) crystal phase containing nano particle sol with uniform size and relatively small grains, glass is dipped into the sol,then the glass is drawn out from the TiO2 sol at the speed of 0.5cm/s-1.0cm/s, and a sample is subjected to annealing treatment at the temperature of 300-600 DEG C, thus obtaining the TiO2 based self-cleaning glass with large area and uniform membrane. The TiO2 based self-cleaning glass disclosed by the invention has relatively good organic matter catalytic degradation activity, and is very suitable for being popularized in the fields of external glass walls of buildings, windshields of automobiles and the like. The method disclosed by the invention is low in requirement for equipment, greatly reduces the production cost and is high in production efficiency, and membrane thickness can be flexibly mastered. The prepared glass has relatively high transmittance and is suitable for being applied to daily production and life.
Owner:NORTHEAST NORMAL UNIVERSITY

Multi-step printed circuit board differential through hole processing method and printed circuit board thereof

The invention discloses a multi-step printed circuit board differential through hole processing method and a printed circuit board thereof. The problem that multi-through hole copper differentiation and a uniform copper printed circuit board are difficultly processed in the prior art is solved. According to the technical points, a first large through hole is processed in a laminate, and hole copper with the thickness of h10 is formed on the hole wall; an isolation structure is arranged around the opening of the first large through hole, so that the hole copper of the first large through hole and the surface copper of the laminate are insulated and isolated; copper reduction is carried out on the surface copper of the laminate, and then a second intermediate through hole and a third small through hole are processed; hole copper with the thickness of h20 and h30 is formed on the hole walls of the second intermediate through hole and the third small through hole; after the third small through hole is covered and plated, the hole copper of the second intermediate through hole is thickened to h21; an isolation dry film is removed for electroless copper plating, and the hole copper of the first large through hole, the second intermediate through hole and the third small through hole is thickened to the required thicknesses H1, H2 and H3 respectively; and before the third electrolesscopper plating, H1-h10=H2-h21=H3-h30. The method provided by the invention can be used for printed circuit board fabrication.
Owner:BOMIN ELECTRONICS CO LTD

Molding method of photoresist wall

The invention provides a molding method of a photoresist wall. A flat panel is molded by using an injection-molding technology, wherein a first lug boss and a second lug boss are formed on the front side of the flat panel, and partitioned by a groove; the front side of the flat panel is glued and laminated with a first substrate, so that the first lug boss is adhered to the first substrate; the back side of the flat panel is grinded and thinned until the bottoms of the first lug boss and the second lug boss are separated; the second lug boss left on the first substrate is removed; residues on the first lug boss are removed by cleaning, so as to form a photoresist wall structure. The molding method of the photoresist wall has the advantages that the photoresist wall structure is independently molded; compared with the traditional photoresist lithography method, the photoresist wall molded by the molding method has the advantage that the probability of unqualified components caused by pollution in the photoresist wall molding process can be greatly reduced. The material for injection molding has the properties of high rigidity, low coefficient of thermal expansion (CTE), low moisture absorption and the like, the structure strength of a photomask of the photoresist wall is improved, and the reliability problems of layering, separating and the like are effectively reduced.
Owner:北京中科微知识产权服务有限公司

Structure and fabrication method of vertical junction-free gate-ring mosfet device

The invention provides a structure and a manufacturing method of a vertical junctionless gate-all-round MOSFET (metal oxide semiconductor field effect transistor) device. The structure comprises a bottom-layer n-type silicon wafer substrate 101, wherein a drain region 111 is positioned at the lowest end of the device; a drain expansion region 106, a channel region 107 and a source region 108 grow on the substrate 101 epitaxially; a gate oxide layer 109 surrounds the whole channel region 107; and a polysilicon gate 110 is deposited on the gate oxide layer 109. Doping types and concentrations of the drain expansion region 106, the channel region 107, the source region 108 and the drain region 111 are the same; the doping types are n plus doping; the doping concentrations are 1*10<19>-8*10<19>cm<-3>; the doping type of the polysilicon gate 110 is p plus doping; and the doping concentration of the polysilicon gate 110 is 5*10<19>cm<-3>. The structure of the vertical junctionless gate-all-round MOSFET device can effectively inhibit action of a short channel effect. The invention also provides the manufacturing method of the vertical junctionless gate-all-round MOSFET device, which can simplify the technological process and allow the length of a gate and the thickness of a silicon region to be controlled flexibly.
Owner:HARBIN ENG UNIV

Device for feeding glass mixture material

The invention relates to a device for feeding a glass mixture material. The device comprises a bracket, wherein the bracket is arranged at a feeding hole of a melting furnace; a push device for feeding materials is arranged on the bracket; an upper-layer feeding device and a lower-layer feeding device are connected with the bracket at the upper side of the push device; the upper-layer feeding device and the lower-layer feeding device are of a same structure and both comprise storage cabins; a feeding hole is formed in the upper side of the storage cabin; a discharge hopper corresponding to the push device is arranged on the lower side of the storage cabin; and a valve is arranged between the storage cabin and the discharge hopper. The device has the advantages that the device can be applied to a conventional glass production line, with the combination of a mixture material preheating technique, the energy consumption of the melting furnace can be effectively reduced, by adopting a layered feeding mode, an upper layer is uniformly covered by a high-moisture mixture material which is not liable to generate dust, then flying dust and flying loss of a lower-layer mixture material can be effectively prevented, corrosion of the melting furnace by the flying dust can be effectively alleviated, the thickness of material layers are flexibly controlled according to relative heights of hoppers, and the device is applicable to multiple operation working conditions.
Owner:(CNBM) BENGBU DESIGN & RES INST FOR GLASS IND CO LTD

Ultrasonic sensor, piezoelectric composite ceramic chip and preparation method of blank of piezoelectric composite ceramic chip

The invention relates to a sensor, in particular to an ultrasonic sensor, a piezoelectric composite ceramic piece and a preparation method of a blank of the piezoelectric composite ceramic piece, and the preparation method comprises the following steps: S1, arranging two division bars on one surface of the piezoelectric ceramic piece at an interval; s2, the area between the two parting strips is filled with a polymer to form a polymer phase, and the polymer phase is flush with the tops of the parting strips; s3, another piezoelectric ceramic piece is attached to the top of the polymer phase, and the parting strip is located between the two corresponding adjacent piezoelectric ceramic pieces; and S4, superposing the piezoelectric ceramic pieces layer by layer to form a piezoelectric composite ceramic piece blank. According to the preparation method of the piezoelectric composite ceramic piece blank, the distance between the adjacent piezoelectric ceramic pieces is only controlled by the thickness of the parting strips and is not limited by the defects of a traditional cutting-pouring method, and the minimum thickness can be achieved. The number of bubbles in the piezoelectric composite ceramic piece blank is smaller, the manufactured piezoelectric composite ceramic piece blank is higher in quality, and the performance of an ultrasonic sensor product is better.
Owner:CHENGDU HUITONG WEST ELECTRONIC CO LTD

A dampening water application method based on ultrasonic atomization and its system and application

The invention discloses a fountain solution application method and system based on ultrasonic atomization as well as an application. The method comprises the following steps that 1) an ultrasonic atomization device is arranged below a form damping roller, and a fountain solution is added into the ultrasonic atomization device; 2) the ultrasonic atomization device is started at the same time and used for conducting ultrasonic atomization on the fountain solution on the form damping roller under the ultrasonic condition of 0.1-100 MHz, so that a water film is formed on the form damping roller; and 3) the form damping roller is started, so that the fountain solution is made to be continuously and uniformly conveyed to a forme from the form damping roller in the form of the water film. According to the fountain solution application method and system based on ultrasonic atomization as well as the application, the ultrasonic atomization mode is adopted to carry out application of the fountain solution, the surface tension of the fountain solution can be greatly reduced, the water film can be stably and uniformly formed on the surface of the form damping roller in an attached mode, the use amount of surface active substances including alcohol in the fountain solution can be greatly reduced, even no surface active substances need to be added for realizing high-quality printing, and high efficiency and environmental friendliness are achieved.
Owner:KUNMING UNIV OF SCI & TECH

Magnetic adsorption cavity type solar particle heat absorber

The invention discloses a magnetic adsorption cavity type solar particle heat absorber which comprises magnetic solid particles, a cavity frame, three particle conveying devices, a heat preservation cover and the like. Openings are formed in the four sides of the cavity frame. The particle conveying device comprises a conveyor, a particle distributor, a flow control valve, a particle thickness controller, a magnetic force generating device, a particle collector and the like. The magnetic force generating device is continuously arranged in parallel along the lower sides of the horizontal section and the vertical section of the conveying belt, and the particle collector is arranged at the tail end of the magnetic force generating device; one opening of the cavity frame allows sunlight to enter, the other three openings are respectively and completely blocked by vertical sections of conveying belts in the three particle conveying devices, and the conveying belts convey solid particles to the opening to absorb high-density sunlight energy. Magnetic solid particles are adsorbed to the conveying belt through a magnetic field of the magnetic force generating device, the conveying speed of the magnetic solid particles is flexibly controlled through the conveying belt, solar energy on the left side, the right side and the rear side in the cavity is absorbed, and the light-heat efficiency and the service reliability of the magnetic solid particles are effectively improved.
Owner:HUNAN UNIV OF SCI & TECH
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