The invention relates to a cashe-on-board (COB) technology-based integrated light emitting diode (LED) packing method, which comprises the following steps that: 1. thickness of a mould and diameter of a reserved hole are adjusted; 2. the reserved hole on the mould is aligned to an LED chip which is well fixed on an aluminum circuit board, and the mould covers the aluminum circuit board; 3. after fluorescent glue is sprayed on the aluminum circuit board, the aluminum circuit board is baked, then the mould is removed after the baking so as to obtain an LED packing unit. The method has followinng beneficial effects that: the shape, position, thickness and quantity of the fluorescent flue can be adjusted by adjusting the thickness of a silicone board and the diameter of the reserved hole, so the LED integrated packing procedures can be simplified, the heat resistance and the working temperature of the LED chip can be reduced, the shape, position, thickness and quantity of the fluorescent glue can be flexible to control, the light emitting efficiency and the consistency, stability and service life of the product can be improved, the packing efficiency also can be improved, the waste can be reduced, and the product cost can be reduced. The baking temperature is set as 140 to 160 DEG C, so the packing effect is better.