LED phase-change heat radiating substrate and preparation method thereof

Abstract

The invention discloses an LED phase-change heat radiating substrate and a preparation method thereof. The substrate comprises an upper cover plate (1), a nano wick (2), a lower cover plate (3), and liquid refrigerant filling the inside of the substrate. The nano wick (2) is sintered on the inner sides of the upper cover plate (1) and the lower cover plate (3). The upper cover plate (1) and the lower cover plate (3) are spliced together by welding. A sealed cavity is formed inside after welding. The cavity is vacuum-pumped and filled with the liquid refrigerant. The preparation method comprises the following steps: (1) preparing plates; (2) preparing a nano wick; (3) welding the plates; and (4) pouring refrigerant and carrying out packaging. The substrate is based on the principle of phase-change heat transfer. The refrigerant absorbs heat efficiently and quickly through phase change, and the heat reflux is uniformly distributed under capillary force of the nano wick after condensation. The LED phase-change heat radiating substrate has more excellent heat transfer performance, and has the characteristics of strong heat transfer ability, low weight, and small thickness.

Description

technical field [0001] The invention relates to the technical field of LED heat dissipation substrate preparation, in particular to an LED phase-change heat dissipation substrate and a preparation method thereof. Background technique [0002] With the development of LED semiconductor lighting technology, the three advantages of LED energy saving, environmental protection and long life make it gradually replace the traditional light source to become a new generation of green light source, which penetrates into people's daily life. LED light sources have been widely used in lighting, display and other fields, such as automobile headlights, miner's lamps, projectors, flat display backlights and other new fields. [0003] With the expansion and application of LED technology in different application fields, adapting to various extreme environments has become one of the requirements for the further development of LED technology, so higher requirements are put forward for the perfo...

AI Technical Summary

Problems solved by technology

The performance of LED is closely related to the working temperature. The increase of temperature will not only reduce the luminous efficiency, but also affect the service life.

With the development of semiconductor devices in the direction of small size and high power, high-power LEDs have become the demand for light sources in many new fields. However, due to their small heat dissipation space, they have caused a fatal problem of high heat flux density. Therefore, the application of thermal control to high-power LEDs have a significant impact on the further development of

[0004] In the LED packaging process, the substrates currently used mainly include ceramic substrates, glass substrates, metal substrates, etc. Among them, metal substrates have the best heat transfer capacity, mainly copper and aluminum, which have the disadvantages of large volume and high quality, while high-power LEDs The heat flux density of the module has also exceeded the heat transfer limit of ordinary copper or aluminum materials, and the traditional method of increasing the specific surface area for heat dissipation is no longer suitable for the development of high-power LED packaging technology.

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