Molding method of photoresist wall

Abstract

The invention provides a molding method of a photoresist wall. A flat panel is molded by using an injection-molding technology, wherein a first lug boss and a second lug boss are formed on the front side of the flat panel, and partitioned by a groove; the front side of the flat panel is glued and laminated with a first substrate, so that the first lug boss is adhered to the first substrate; the back side of the flat panel is grinded and thinned until the bottoms of the first lug boss and the second lug boss are separated; the second lug boss left on the first substrate is removed; residues on the first lug boss are removed by cleaning, so as to form a photoresist wall structure. The molding method of the photoresist wall has the advantages that the photoresist wall structure is independently molded; compared with the traditional photoresist lithography method, the photoresist wall molded by the molding method has the advantage that the probability of unqualified components caused by pollution in the photoresist wall molding process can be greatly reduced. The material for injection molding has the properties of high rigidity, low coefficient of thermal expansion (CTE), low moisture absorption and the like, the structure strength of a photomask of the photoresist wall is improved, and the reliability problems of layering, separating and the like are effectively reduced.

Description

technical field [0001] The invention relates to a method for forming a photoresist wall, which belongs to the technical field of semiconductor manufacturing. Background technique [0002] The photoresist wall photomask currently used in image sensors is made by spin-coating photoresist on a glass wafer, and forming a regularly arranged photoresist wall structure on the photoresist through exposure and development, such as figure 1 shown. The main problem of using photoresist to make the photoresist wall structure is that the photoresist material itself has small rigidity, large thermal expansion coefficient, and strong water absorption. In the subsequent baking process and reliability test, photoresist wall delamination or delamination from the glass often occurs. The phenomenon of shedding seriously affects product quality and service life. At the same time, the residue after exposure and development can easily lead to reliability problems of the sensor. As image sensors...

AI Technical Summary

Problems solved by technology

The main problem of using photoresist to make the photoresist wall structure is that the photoresist material itself has small rigidity, large thermal expansion coefficient, and strong water absorption. In the subsequent baking process and reliability test, photoresist wall delamination or delamination from the glass often occurs. The phenomenon of shedding seriously affects product quality and service life

At the same time, the residue after exposure and development can easily lead to reliability problems of the sensor

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