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Process for preparing ultra-thin brazing fillers by chemical plating and electric plating

A technology of electroless plating and brazing filler metal, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problem of high cost, achieve the effect of low production cost and improve tensile strength

Active Publication Date: 2015-06-03
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the high cost of the existing conventional ultra-thin solder preparation method, and the thinnest solder thickness can only reach 0.050mm, and provide a process for preparing ultra-thin solder by electroless plating and electroplating , the thickness of the prepared ultra-thin solder is less than 0.035mm

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A process for preparing ultra-thin solder by electroless plating and electroplating, the preparation process comprising:

[0024] (1) Pretreatment: Select a copper foil substrate with a specification of 20×20×0.008mm, and perform degreasing, pickling and weak etching treatment on it in sequence to remove the processed deformation layer and oxide film on the surface of the copper foil substrate, Activate the copper foil substrate; weigh the treated copper foil substrate, and the weight is 0.0219g;

[0025] (2) Electroless silver plating: according to the molar ratio of silver nitrate powder: stannous sulfate powder: copper foil substrate is 5.56:0.67:4.84, according to the known molar weight of copper foil substrate in step (1), determine the silver nitrate powder in sequence and the physical quantity of stannous sulfate powder; take the container and dissolve all the silver nitrate powder taken by weighing in distilled water to form solution A, wherein, the ratio of the...

Embodiment 2

[0035] A process for preparing ultra-thin solder by electroless plating and electroplating, the preparation process comprising:

[0036] (1) Pretreatment: Select a copper foil substrate with a specification of 100×100×0.008mm, and perform degreasing, pickling and weak etching treatment on it in sequence to remove the processed deformation layer and oxide film on the surface of the copper foil substrate, Activate the copper foil substrate;

[0037] (2) Electroless silver plating: According to the molar ratio of silver nitrate powder: stannous sulfate powder: copper foil substrate is 6.60:0.09:4.10, according to the known molar weight of copper foil substrate in step (1), determine the silver nitrate powder in sequence and the physical quantity of stannous sulfate powder; take the container and dissolve all the silver nitrate powder taken by weighing in distilled water to form solution A, wherein, the ratio of the volume of distilled water added to the total weight of silver nit...

Embodiment 3

[0045] A process for preparing ultra-thin solder by electroless plating and electroplating, the preparation process comprising:

[0046] (1) Pretreatment: Select a copper foil substrate with a specification of 40×30×0.006mm, and perform degreasing, pickling and weak etching treatment on it in sequence to remove the processed deformation layer and oxide film on the surface of the copper foil substrate, Activate the copper foil substrate;

[0047] (2) Electroless silver plating: According to the molar ratio of silver nitrate powder: stannous sulfate powder: copper foil substrate is 6.11:0.378:4.375, according to the known molar weight of copper foil substrate in step (1), determine the silver nitrate powder in sequence and the physical quantity of stannous sulfate powder; take the container and dissolve all the silver nitrate powder taken by weighing in distilled water to form solution A, wherein, the ratio of the volume of distilled water added to the total weight of silver nit...

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Abstract

The invention provides a process for preparing ultra-thin brazing fillers by chemical plating and electric plating, and relates to the field of welding material preparation. The process comprises the concrete processes that a copper foil with the thickness being 0.002 to 0.010 mm is selected to be used as a base body, chemical silver plating, electric tin plating and diffusion processing are sequentially carried out, the ultra-thin brazing fillers are prepared, and the prepared brazing fillers comprise the following major chemical ingredients in percentage by mass: 60 to 72 percent of silver, 1 to 8 percent of tin and 26 to 31 percent of copper. The chemical plating and electric plating method is used, and the area and the thickness of the brazing fillers and the contents of each ingredient can be flexibly controlled. Compared with the existing fast solidification method, the process provided by the invention has the advantages that the ultra-thin brazing fillers with the width being higher than 100mm and the thickness being lower than 0.035 mm can be produced, complicated production equipment is not needed, and the production cost is lower.

Description

technical field [0001] The invention relates to the field of welding material preparation, in particular to a process for preparing ultra-thin solder by electroless plating and electroplating. Background technique [0002] When brazing small pieces or precision parts, if brazing with conventional solder, it is easy to cause the base metal to be welded to be eroded, and the welding accuracy will become more and more difficult with the increase of the number of parts to be welded. worse. When welding with ultra-thin solder, the above-mentioned problems can be avoided, ensuring that precision parts or thin small parts can obtain higher-strength joints under the premise of ensuring welding accuracy. Ultra-thin solder can be produced by rolling, but the thinner the solder, the higher the requirements for rolling equipment and the higher the production cost. In recent years, the more popular preparation methods of ultra-thin solder include rapid solidification methods, such as C...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/3006B23K35/40
Inventor 龙伟民纠永涛朱坤裴夤崔鲍丽马佳张雷沈元勋张青科高雅马力
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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