Magnetically controlled sputtering process of making printed circuit board

A printed circuit board, magnetron sputtering technology, applied in the direction of printed circuit, printed circuit manufacturing, and the formation of electrical connection of printed components, can solve problems such as connection conduction, improve efficiency, reduce pollution, and avoid uneven coating. Effect
CN1527656AInactive Publication Date: 2004-09-08曹波 +2
1 Cites 27 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
曹波
Publication Date
2004-09-08
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The present invention provides one kind of magnetically controlled sputtering process of making printed circuit board. The process includes the following steps: drilling holes on the single layer base material; magnetically controlled sputtering the bottom dielectric and metal layer on the drilled single layer base material; magnetically controlled sputtering conducting copper layer on the single layer base material; drilling holes on multilayer board; magnetically controlled sputtering bottom dielectric and metal layer on the drilled multilayer board; magnetically controlled sputtering conducting copper layer on the drilled multilayer board; and repeating the foregoing steps until reaching the required layer number of the printed circuit board. The present invention combines unique hole forming method and sputtering method and has raised copper-plating and hole-metallizing efficiency, raised reliability and high fine circuit making capacity.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a process method for manufacturing a printed circuit board by using a magnetron sputtering method. Background technique

[0002] With the miniaturization, high-speed and digitalization of electronic products, PCB products must also develop in the direction of ultra-thin, high-density and miniaturization. High density refers to increasing the component loading and wiring density per unit area of ​​printed circuit boards. The measures taken are thin lines, small holes and multiple layers of circuit boards. The width and spacing of wires tend to be less than 0.1mm (such as 3mil line width and line spacing), and the via hole diameter is less than φ0.2mm. Multilayer boards with more than 10 layers will be used in large quantities, and there will be a large number of blind holes and buried holes, and hole metallization Etching and etching are two key steps in the p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More