125 results about "Silver copper" patented technology

The invention discloses a beneficiation method for tin-silver symbiotic polymetallic ore and application of the beneficiation method, and relates to the technical field of mineral separation. Comprising the steps that after tin-silver symbiotic polymetallic ore is ground, undersize minerals are obtained through a high-frequency screen, silver-copper flotation is conducted on the undersize minerals, and silver-copper concentrate and silver-copper tailings are obtained; the silver-copper tailings are subjected to lead-zinc-sulfur flotation, and lead concentrate and zinc-sulfur tailings are obtained; and the zinc-sulfur tailings are subjected to zinc-sulfur flotation, and zinc-sulfur concentrate and tin-sulfur tailings are obtained. The concentration of ore pulp in the ore grinding process is controlled, it is guaranteed that cassiterite and sulfide minerals are fully dissociated, then a first inhibitor is added in the lead-zinc-sulfur flotation process, the valuable metal recovery efficiency can be enhanced by optimizing the flotation process and collaboratively innovating a reagent formula according to the complex characteristics of tin-silver symbiotic polymetallic ore, and the recovery rate of the tin-silver symbiotic polymetallic ore is increased. The contents of silver, copper and tin in the tailings are obviously reduced, and efficient utilization of resources and reduction of solid wastes are realized.

The invention discloses a short-process preparation method of a palladium-silver-copper alloy wire with high palladium content, which comprises the following steps: 1) smelting, blowing out, refining and casting silver, copper and palladium to obtain a palladium-silver-copper master alloy ingot; 2) continuously casting the palladium-silver-copper master alloy ingot into a palladium-silver-copper alloy rod; (3) the palladium-silver-copper alloy rod is continuously rolled, and the total deformation of the palladium-silver-copper alloy rod is controlled to range from 60% to 80% till a palladium-silver-copper alloy thick wire is obtained; and 4) carrying out continuous annealing and drawing on the palladium-silver-copper alloy thick wire to obtain the palladium-silver-copper alloy wire with the diameter of 0.1-0.8 mm. By the adoption of the method, the palladium-silver-copper alloy rod with the good machining performance can be prepared, alloy wires with the tensile strength higher than 1200 MPa and the Vickers hardness larger than 350 HV can be continuously produced in batches, the cleanliness and splatability of the alloy wires both meet the first-level / A-level requirements, and meanwhile the production period is only 30% of that of a traditional technology.

The present invention provides a method for preparing an AgCuTi active solder, relating to the technical field of brazing materials. The preparation method comprises the following steps: pretreating a titanium foil, sequentially electroplating the surface with silver and copper, and diffusing the electroplated titanium foil in a vacuum environment at 600-700°C for 24 hours to obtain the AgCuTi solder. The method provided by the present invention can easily and conveniently prepare sheet- and strip-shaped AgCuTi active solders, and the active solders are less susceptible to the presence of CuTi intermetallic compounds while exhibiting good performance.

The invention discloses a metalized diamond particle, a diamond / gallium-based liquid metal composite material and a preparation method thereof, and belongs to the field of composite thermal interface materials. The metallized diamond particle comprises a diamond particle, the surface of the diamond particle is coated with an immiscible alloy layer, the immiscible alloy layer contains a diffusion barrier component and a reaction wetting component, and the content of the diffusion barrier component in the immiscible alloy layer is not higher than 15 at% of the total content of the diffusion barrier component and the reaction wetting component; wherein the diffusion barrier component is one or more of tungsten, molybdenum and tantalum, and the reaction wetting component is one or more of silver and copper. The metallized diamond particles and the gallium-based liquid metal are combined to form the composite material, so that the diamond / gallium-based liquid metal composite material has more excellent thermal conductivity.

The invention relates to silver-copper-titanium active soldering paste with a high recovery coefficient and a preparation method and application of the silver-copper-titanium active soldering paste, and belongs to the technical field of heterogeneous material connection and semiconductor packaging. The silver-copper-titanium active soldering paste is composed of, by mass, 70%-90% of brazing filler metal powder and 10%-30% of scaling powder. The brazing filler metal powder is mixed powder composed of silver-copper-based powder, titanium-containing powder and other metal powder. The soldering flux is composed of, by mass, 40%-70% of a solvent, 20%-40% of rosin, 5%-20% of an active agent, 1%-15% of a thixotropic agent, 1%-10% of an interface modifier and 1%-10% of a corrosion inhibitor, and the thixotropic agent is composed of a short-range agent and a long-range agent according to the mass ratio of 1: (1-4). The recovery coefficient of the obtained soldering paste is close to 1, and the soldering paste has excellent printability, sagging resistance and storage stability and has wide application prospects in the fields of semiconductor packaging, power electronic devices, aerospace and the like.

The invention provides low-temperature sintered silver-copper slurry, a perovskite laminated cell and a preparation method, and belongs to the technical field of crystalline silicon cells. The low-temperature sintered silver-copper paste comprises the following components in parts by mass: 15-30 parts of silver powder; 63-77 parts by mass of silver coated copper powder; the surface of the silver-coated copper powder is coated with acrylic acid and an oleylamine coating agent; 3-15 parts by mass of a resin; 0.2 to 2.8 parts by mass of a curing agent; 0.05 to 0.5 part by mass of a leveling agent; and 0.05 to 0.5 part by mass of a dispersant. The present disclosure achieves low temperature (llt; in addition, the silver-coated copper powder and the silver powder are mixed, the silver powder is replaced with low cost, the material cost is reduced, meanwhile, the silver-coated copper powder forms a three-dimensional conductive network at the low temperature of less than 120 DEG C through metal bonding of a silver shell and contact between particles, and the high conductivity of the electrode is ensured.

A process for producing a silver concentrate from metallurgical residues, in particular from residues containing copper, iron, lead, silicon, silver and antimony and optionally containing elements such as arsenic and bismuth, comprising: (i) copper leaching of the metallurgical residues with a first acid solution in order to obtain a first leach solution rich in copper and iron and optionally in arsenic and a first leached sludge having a reduced copper and iron content and optionally a reduced arsenic content and being rich in lead, germanium, silver and silicon, (ii) leaching of the first leached sludge, wherein the first leached sludge is treated with a first solution of a carboxylate in order to obtain a second leached sludge lacking lead and a second leach solution rich in lead, (iii) alkaline leaching of the second leached sludge, wherein a base is added in order to form an alkaline leach solution in order to obtain a third leached sludge having a reduced silicon content and a third leach solution rich in silicon and optionally in arsenic, (iv) hydrochloric acid leaching of the third leached sludge, wherein an acid solution is used in a chloride environment in order to obtain a fourth leached sludge for final disposal and a fourth leach solution rich in silver, copper, lead and iron and optionally in arsenic, (v) precipitation of silver from the fourth leach solution rich in silver, copper and iron and optionally in arsenic with a neutralizing slurry in order to produce a fifth solution rich in chlorides and a first precipitated solid rich in iron, copper, lead and silver and optionally in arsenic, (vi) leaching of the first precipitated solid rich in iron, copper, lead and silver and optionally in arsenic with a sulfuric acid solution in order to produce a sixth leach solution rich in copper, iron and optionally in arsenic and a first silver and lead concentrate, and (vii) leaching of the first silver concentrate with a second carboxylate solution in order to produce a seventh leach solution and a second silver concentrate.

The invention relates to a high-hardness and high-strength palladium-silver-copper-nickel quaternary alloy rod for a probe and a preparation method thereof, and the palladium-silver-copper-nickel quaternary alloy rod comprises the following elements in percentage by mass: 30-38% of Pd, 40-46% of Cu, 10-20% of Ag and 8-15% of Ni. The sum of the mass of Ag and Ni is 18-30%, and the sum of the mass of Pd and Ni is 41-50%; the hardness of the palladium-silver-copper-nickel quaternary alloy bar subjected to heat treatment is larger than 300 HV, and the strength is larger than 1000 MPa. According to the invention, nickel with low cost is used as an important strengthening element and cooperates with silver and copper to realize strengthening in an alloy matrix with low palladium content, and an efficient quality-improving forming process is matched, so that the balance of high hardness and high strength of the alloy is realized on the premise of controllable cost, and the harsh demand of a test probe can be met.

The present application belongs to the technical field of preparation of fuse material for fuses, and particularly relates to a fused brazing type silver-copper composite strip and a preparation method thereof. The preparation method of the fused brazing type silver-copper composite strip comprises uniformly processing a preset number of cuboid blind holes along the length direction of a block-shaped copper plate, leaving a pure copper area at both ends of the cuboid blind holes; preheating the processed block-shaped copper plate, then pouring molten silver into the blind hole groove of the preheated block-shaped copper plate for fused brazing; and taking the pure copper area as a rolling auxiliary traction section for rolling treatment. The above-mentioned preparation method of the silver-copper composite strip has low requirements for the preparation equipment and low production cost, and can effectively realize the effective preparation of the multi-interface silver-copper composite strip, so that the size of the composite strip is no longer limited by hot rolling means, and the silver-copper strip obtained by the fused brazing method has high bonding strength, good strength stability, high straightness and high yield.

The invention discloses an ultralow dielectric constant LTCC (Low Temperature Co-Fired Ceramic) material and a preparation method thereof, the ultralow dielectric constant LTCC material is formed by compounding a glass phase and a ceramic filler phase, the glass phase comprises Li2O, La2O3, SiO2, ZrO2, P2O5, MgF2 and Al2O3; the ceramic filler phase comprises BaB2O4 and a conditioning agent, and the conditioning agent is at least one of Al2O3, SiO2 or cordierite; according to the invention, the Li-La-Si system glass and the BaB2O4 filler are compounded according to a specific proportion, so that co-firing with a silver / copper electrode at a low temperature is realized, and the composite material has excellent thermal stability and environmental friendliness, and meets the requirements of high-frequency communication applications such as 5G millimeter waves and the like on high-performance substrate materials.

The invention relates to a high-wear-resistance coating for a diamond straight-shank end mill and a preparation method of the high-wear-resistance coating, and belongs to the technical field of wear-resistance coatings. According to the high-wear-resistance coating for the straight-shank end mill of the diamond and the preparation method of the high-wear-resistance coating for the straight-shank end mill of the diamond, the thickening agent is self-made, after the thickening agent, titanium powder, silicon powder and silver-copper alloy powder are made into brazing filler metal, the straight-shank end mill base body of the diamond is brazed, and the high-wear-resistance coating for the straight-shank end mill of the diamond is obtained; an alkyl hydrophobic long chain improves the wetting effect of the brazing filler metal on the surface of a base body by reducing surface tension, in addition, azo bonds in the long chain are preferentially broken in the brazing process and decomposed into small molecule compounds, then the small molecule compounds are gradually and completely decomposed, metal powder in the brazing filler metal can be directly combined with the surface of the base body, and a firm alloy coating is formed; the wear resistance and the comprehensive service life of the diamond straight-shank end mill are improved.

The invention discloses a medium-temperature silver flower wire solder and a preparation method thereof, the medium-temperature silver flower wire solder comprises 17-19.5% of copper, 0.01-2% of zinc, 0.01-1.4% of indium, 0.01-0.5% of germanium, 0.01-0.4% of tin, 0.01-0.3% of rare earth and the balance silver and inevitable impurity elements, and the rare earth is one or more of cerium, yttrium, lanthanum, neodymium and gadolinium. According to the welding flux, silver, copper, zinc, indium, germanium, tin, rare earth and the like serve as main alloy elements, the component proportion of the main alloy elements is optimized and adjusted, the alloy formula is optimized, and the medium-temperature-grade silver welding flux which is excellent in comprehensive performance and can well meet the welding requirement of the silver wire jewelry is prepared.

This invention relates to a high-hardness, high-strength palladium-silver-copper-nickel quaternary alloy rod for probes and its preparation method. The elemental composition of the palladium-silver-copper-nickel quaternary alloy rod, by mass percentage, is: Pd 30-38%, Cu 40-46%, Ag 10-20%, Ni 8-15%; the sum of the mass of Ag and Ni is 18-30%, and the sum of the mass of Pd and Ni is 41-50%. The heat-treated palladium-silver-copper-nickel quaternary alloy rod has a hardness greater than 300 HV and a strength greater than 1000 MPa. The invention utilizes relatively low-cost nickel as a key strengthening element, synergistically strengthening it with silver and copper in an alloy matrix with a low palladium content. Combined with an efficient and high-quality forming process, a balance between high hardness and high strength is achieved in the alloy while maintaining controllable costs, meeting the stringent requirements of testing probes.

The invention discloses a preparation method and application of a silver-copper gas transmitting and dispersing electrode. The preparation method comprises the following steps: S1, preparing a copper-based gas transmitting and dispersing electrode; and S2, preparing a silver-copper gas transmitting and dispersing electrode: obtaining the silver-copper gas transmitting and dispersing electrode. The silver-copper gas transmitting and dispersing electrode is applied to electrocatalytic carbon dioxide reduction reaction. According to the invention, silver nanoparticles are loaded on the surface of the copper-based gas transmitting and dispersing electrode through a proper method, and when the electrode is applied to an electro-catalysis carbon dioxide reduction reaction, CO generation on the surface of the electrode can be effectively improved, so that the CO coverage of nearby copper sites is improved; meanwhile, concentrated seawater is used as a cathode electrolyte, a high cation environment is provided, and a supply balance relation formed by metal cations and H < + > is realized under an acidic condition, so that an excessive HER process under the acidic condition is avoided, precipitation of calcium and magnesium ions is inhibited, and the overall economic benefit can be improved.

The invention discloses a high-temperature-oxidation-resistant low-silver-content AgCuGa noble metal dual-phase alloy material, and belongs to the technical field of silver-copper brazing filler metal alloy preparation. The key point of the silver content AgCuGa noble metal dual-phase alloy material is 60% lt; cu + Ga is smaller than or equal to 65%, and the Ga / Cu ratio is larger than or equal to 0.224. In cooperation with the preparation method, the material is mainly composed of an Ag-rich phase and a Cu-rich phase, Ga is mainly in the Cu-rich phase, the Ag-rich phase only contains a very small amount of Ga element, Ga atoms of the Ga element in the Cu-rich phase are rapidly and autonomously distributed at a high temperature, a Ga2O3-rich continuous compact nano oxide layer is formed on the surface, the oxide film effectively inhibits O atom internal diffusion, the volume ratio of the metal Ga to the Ga2O3 is remarkably reduced, and the material is suitable for large-scale production. And a complete and compact high-protective oxidation film is formed, excellent oxidation resistance is achieved in 700 DEG C air, and the shear strength of a brazed joint is superior to that of Ag-28Cu alloy vacuum brazing under the protection of low-flow inert gas.

The utility model provides a kind of high-performance conductive foam, it is related to the field of isolation shielding.The utility model includes foam main body, the outer surface of foam main body is connected with elastic conductive intermediate layer, elastic conductive intermediate layer is the composite material of carbon nanotube and graphene, the outer surface of elastic conductive intermediate layer is connected with metal plating, metal plating is silver copper alloy material quality, the outer surface of metal plating is connected with conductive macromolecular fiber layer.The beneficial effects of the utility model include: first, replace traditional conductive layer carbon coating by the cooperation of elastic conductive intermediate layer, metal plating and conductive macromolecular fiber layer, so as to avoid the easy cracking or falling off of conductive layer, conductive macromolecular fiber layer has greater flexibility, further avoids the problem of cracking and falling off, as described above, this kind of high-performance conductive foam is by using macromolecular fiber and optimizing its flexibility, not only improves its durability and reliability, very practical.

The invention discloses silver-copper paste based on a double-closed curing agent and a printed radio frequency identification tag. The silver-copper paste comprises silver powder, silver-coated copper powder, polyurethane resin and a blocked isocyanate curing agent, the blocked isocyanate curing agent comprises a low-temperature deblocking curing agent and a high-temperature deblocking curing agent, the deblocking temperature of the low-temperature deblocking curing agent is R1, the deblocking temperature of the high-temperature deblocking curing agent is R2, R1 and R2 meet the condition that R1 is larger than 70 DEG C, smaller than 140 DEG C and smaller than 140 DEG C, and R1 is larger than or equal to R1 and smaller than or equal to R2. R2-R1 is more than 20 DEG C and less than 50 DEG C; after the silver-copper paste is printed into the antenna, low-temperature curing is carried out at the temperature T1, and the low-temperature deblocking curing agent is activated; then carrying out flattening treatment; then carrying out high-temperature curing at the temperature T2, and activating a high-temperature deblocking curing agent; t1 and T2 satisfy R1 < = T1 < R2 < = T2. According to the invention, the negative effect of a compression roller process on a silver copper paste printed antenna is effectively solved, and the formation of a high-conductivity, stable and consistent conductive antenna is ensured.

The invention provides a silver-copper alloy-copper penetrating type composite belt and a preparation method thereof. The silver-copper alloy-copper penetrating type composite belt comprises a copper base body and a silver-copper alloy penetrating body arranged in the copper base body in a penetrating mode, the copper content in the silver-copper alloy penetrating body is 20 wt%-40 wt%, and a diffusion layer of 0.5-2.0 micrometers is formed between the copper base body and the silver-copper alloy penetrating body. The core technical problems that an existing silver-copper composite fusing material is poor in thermal shock stability, low in breaking consistency and unstable in interface bonding structure are solved. The invention further provides a preparation method of the silver-copper alloy-copper penetrating type composite belt.

The utility model relates to the technical field of winding devices, and discloses a silver-copper alloy strip winding device capable of synchronously cleaning ash, which comprises a conveying roller, a flushing assembly, a blowing assembly, a scraping and brushing assembly, a wiping assembly and a winding assembly are sequentially arranged at the discharge end of the conveying roller, a plurality of injection pipes are arranged on the flushing assembly, and the blowing assembly and the scraping and brushing assembly are arranged on the winding assembly. An injection opening of the injection pipe is obliquely arranged towards the winding assembly and one side of a preset strip, the injection assembly comprises two injection pipes, the two injection pipes are arranged on the upper side and the lower side of the strip respectively, the injection direction of the injection pipes is the same as that of the injection opening, and the scraping and brushing assembly and the wiping assembly are both attached to the two surfaces of the strip at the same time. According to the device, the problem that the surface is scratched due to the fact that particles are prone to being left is solved, the surface particles are removed in cooperation with washing and scraping brushing, and the finished product quality is guaranteed while the cleaning effect is improved.

This application discloses a silver-copper paste and a printed RFID tag based on a dual-sealing curing agent. The silver-copper paste comprises silver powder, silver-coated copper powder, polyurethane resin, and a sealing isocyanate curing agent. The sealing isocyanate curing agent includes a low-temperature unsealing curing agent and a high-temperature unsealing curing agent. The unsealing temperature of the low-temperature unsealing curing agent is R1, and the unsealing temperature of the high-temperature unsealing curing agent is R2. R1 and R2 satisfy 70℃ < R1 < R2 < 140℃, and 20℃ < R2 - R1 < 50℃. After the silver-copper paste is printed into an antenna, it undergoes low-temperature curing at temperature T1 to activate the low-temperature unsealing curing agent; then it undergoes flattening treatment; and finally, it undergoes high-temperature curing at temperature T2 to activate the high-temperature unsealing curing agent. T1 and T2 satisfy R1 ≤ T1 < R2 ≤ T2. This application effectively solves the negative effects of the pressure roller process on the printed antenna of the silver-copper paste, ensuring the formation of a high-conductivity, stable, and consistent conductive antenna.

The invention discloses a conductive reinforced phase material and an in-situ preparation method thereof, and belongs to the technical field of core electric contact materials for switches. The reinforced phase material is Ti3AlC2-coated Al2O3 and is composed of an inner layer and an outer layer in the coaxial direction, the inner layer is of a hollow cylindrical structure, the component of the inner layer is Ti3AlC2, and the outer layer is an Al2O3 coating layer generated on the surface of the inner layer in situ. The in-situ preparation method comprises the following steps: by taking a carbon nanotube as a template and eutectic molten salt as a carrier, preparing the conductive reinforced phase material with the double-layer concentric cylindrical composite structure through vacuum freeze drying, molten salt shielding reaction and high-temperature and high-pressure oxidation treatment. Compared with an original MAX-phase powder reinforced metal-based electric contact composite material and a commercial metal-based electric contact composite material, the novel material is compounded with conductive metal powder such as silver and copper, the electric conduction and heat conduction performance and the arc erosion resistance of the electric contact composite material can be remarkably enhanced, and the potential of replacing a traditional electric contact material is huge.

The present application provides a kind of light wear-resistant bacteriostatic medical coating, including titanium transition layer, and diamond-like carbon film layer in the surface of titanium transition layer, silver and copper are contained in the diamond-like carbon film layer;And the preparation method of light wear-resistant bacteriostatic medical coating, including S1: raw material preparation and pretreatment;S2: Ar ion etching;S3: Ti transition layer deposition;S4: Ag, Cu co-doped deposition;S5: cooling, breaking vacuum.This technical solution has broad-spectrum bacteriostatic effect, and high bacteriostatic rate, reaches high-efficiency sterilization under lower total metal content, reduces endoscope related cross infection problem;Meanwhile, the coating has strong chemical inertness, dense structure without pore, resists multiple disinfection methods, titanium transition layer and silver copper doped structure do not dissolve, do not fail, avoid the problem that traditional antibacterial coating rapidly degrades, fails, falls off after repeated disinfection, meanwhile, the corrosion of disinfection medium to internal metal matrix is isolated, the performance of instrument is stable.

The invention discloses a stainless steel oxygen-free copper embedded T / R shell and a preparation method thereof. The shell comprises a 316L stainless steel shell body, a TU1 oxygen-free copper substrate, a radio frequency connector, a stress gradient slow release ring and a low-frequency connector. The preparation method comprises the following steps: cleaning and annealing each component; the weldability is enhanced by pre-plating nickel; the shell, the substrate and the stress slow release ring are assembled through silver-copper brazing; after nickel / gold electroplating, a plating layer on the sealing and welding surface is removed through laser; and installing the radio frequency / low frequency connector to the kovar ring through gold-tin brazing. Through gradient material design and a step-by-step brazing process, the problem of sealing failure caused by thermal expansion coefficient mismatch is solved, and the high-power heat dissipation performance and the airtight reliability are remarkably improved.

The invention discloses a flexible sensor based on a nanowire array and a one-step electrochemical synthesis process thereof, and relates to the technical field of nano materials and sensors, and the one-step electrochemical synthesis process comprises the following steps: preparing an electrolyte containing silver nitrate, copper sulfate and a supporting electrolyte, the silver nitrate and the copper sulfate having a specific molar ratio; selecting a proper flexible substrate; a three-electrode system is adopted, and silver ions and copper ions in the solution are subjected to electrochemical reduction reaction on the surface of the flexible substrate to sequentially achieve silver core formation and copper atom deposition, so that a silver-copper core-shell nanowire array structure is constructed; metal electrodes are deposited at the two ends of the nanowire array through magnetron sputtering or electron beam evaporation and the like, and a flexible packaging material is adopted to package the sensor so as to ensure the stability and reliability of the sensor. Through the electrochemical synthesis process, the problems that a traditional multi-step preparation method is high in production cost, low in nanowire size and distribution control precision and poor in product consistency are solved, high-quality preparation of nanowires and integrated construction of the sensor are achieved, the production cost is reduced, and the production efficiency is improved. And the application of the system in the fields of wearable equipment, biomedical monitoring, intelligent robots and the like is expanded.

The present application relates to the technical field of noble metal sputtering target material, and provides a kind of superfine grain silver copper alloy containing nano precipitated phase and its preparation method and application.The superfine grain silver copper alloy provided by the present application includes copper 0.1-3wt% and the balance Ag, and its phase composition includes silver-rich matrix phase and copper-rich nano precipitated phase dispersed in the silver-rich matrix phase, the average grain size of silver-rich matrix phase is 100-1000nm, and the average grain size of copper-rich nano precipitated phase is 10-50nm.The present application adopts microalloying method, combines large deformation plastic processing and lower annealing temperature, and prepares superfine grain silver copper alloy with excellent performance and submicron grain size, and the silver copper alloy of the present application is used as target material, which is beneficial to improve the sputtering rate and obtain silver copper alloy film with uniform thickness.

A multilayer composite thermally-conductive sheet, a preparation method therefor and use thereof are provided. The multilayer composite thermally-conductive sheet includes a metal foil, two transition layers provided on two opposite side surfaces of the metal foil, and two low-temperature alloy layers respectively provided on surfaces of the transition layers facing away from the metal foil, wherein the metal foil is made from at least one of silver, copper, zinc, and platinum, the transition layers are made from either indium or tin, the transition layers have a thickness of 5-13 μm; and a melting point of the low-temperature alloy layers is 30-300° C.

The invention belongs to the technical field of electronic packaging, and particularly relates to a high-heat-dissipation titanium-aluminum composite structure metal shell and a preparation method thereof. The method comprises the following steps that S1, a titanium alloy and an aluminum alloy are milled into a titanium alloy part and an aluminum alloy part correspondingly, then the aluminum alloy part is assembled in a heat dissipation through groove of the titanium alloy part through a compounding technology, finally, milling, a nickel plating technology and a gold plating technology are sequentially conducted, and a chassis of a titanium-aluminum composite structure is manufactured; s2, ceramic beads and leads are assembled and welded through silver-copper solder, and then nickel plating and gold plating are conducted in sequence to obtain a connecting assembly; and S3, the connecting assembly is welded to the through hole in the side wall of the chassis through gold-tin solder, and the metal shell is formed. The chassis of the metal shell is of a local titanium / aluminum composite structure, directional heat dissipation is achieved through aluminum alloy, meanwhile, a part of linear expansion coefficient is sacrificed, and the local heat dissipation capacity of the metal shell is improved.

Disclosed is a catalyst for producing a multicarbon product from CO2, comprising a copper (Cu) substrate having at least one silver copper (AgCu) single-atom alloy (SAA), and silver (Ag) nanoparticles (NPs) on the Cu substrate or on the AgCu SAA, wherein the AgCu SAA comprises at least one single Ag atom dispersed into a surface of the Cu substrate, and the Ag nanoparticles comprise Ag-Ag bonds between the Ag nanoparticles.

The invention discloses a pretreatment-free diamond / alloy composite heat sink material and a forming process thereof. According to the material, diamond powder and alloy active brazing filler metal are mixed according to the mass ratio of 1: 1 to form precursor powder, and the precursor powder and specific organic carriers (containing terpilenol, ethyl cellulose and the like) are prepared into slurry according to the mass ratio of 5: 1; a graphite paper customized mold is used for forming, after drying and pre-curing at the temperature of 85 DEG C, heat preservation is conducted for 15 minutes in a 3 * 10 <-3 > Pa vacuum environment at the brazing temperature (the silver-copper-titanium temperature is 850 DEG C, and the copper-tin-titanium temperature is 900 DEG C), and sintering is completed at a time. Diamond interface bonding is achieved by directly utilizing the active brazing filler metal, and traditional surface metallization or etching and other treatment procedures are omitted; slurry forming supports flexible customization of complex structures (such as tubular structures and columnar structures), and the problems that a traditional diamond composite material sintering technology is poor in machining flexibility, complex in technology and low in efficiency are solved. The actual measurement thermal conductivity of the diamond / silver-copper-titanium composite heat sink material obtained through subsequent actual preparation verification is 345.7 W / mK, the process energy consumption is reduced by more than 40%, and the diamond / silver-copper-titanium composite heat sink material is suitable for the field of heat dissipation of high-power electronic devices.