176 results about "Silver copper" patented technology

The invention relates to a preparation method of silver-coated copper powder for the electronic industry, in particular to a preparation method of silver-coated copper powder for low-temperature slurry, which comprises the following steps: (1) alkali washing; (2) pickling; (3) organic modification; and (4) chemical silver plating is conducted, filtering, cleaning and drying are conducted after chemical silver plating is completed, and the silver-plated copper powder is obtained. Copper powder replacement is inhibited through surface organic modification, so that the copper powder does not participate in the reaction or does not participate in the reaction slightly, on one hand, copper powder raw material waste caused by the replacement reaction can be reduced, and on the other hand, batch instability caused by the morphology and specific surface area difference of the copper powder can be reduced. The silver-coated copper powder prepared by the method has excellent conductivity, high temperature resistance and silver-copper interlayer binding force, and can meet shearing acting forces such as high temperature and extrusion in the preparation and use process of low-temperature slurry.

The invention discloses a method for separating and recycling a silver-copper composite material through selective interface oxidation. The method comprises the following steps that the material is crushed and sheared, and a crushed material is obtained; the crushed material is pretreated and then fed into an oxidation fluidized bed, an internal oxidation reaction is conducted in a gas phase at the temperature of 400-700 DEG C and the oxygen pressure of 0.2-0.6 MPa, the reaction time is 20-60 h, and a high-temperature material is obtained; quenching the high-temperature material to generate stress cracks on an oxidation interface to obtain a cooled material; and stripping the cooled material under the mechanical action to obtain a recycled copper material and a recycled silver material, oxidizing the electrical contact material or leftover materials of the electrical contact material in the oxygen atmosphere to oxidize an interface between the silver-copper composite materials to form an oxidation film, separating the two materials of the silver-copper composite materials under the quenching and mechanical actions, and then, obtaining the recycled copper material and the recycled silver material. The method is high in recovery rate, high in recovery purity and environment-friendly.

A method of reducing carbon dioxide, with a catalyst including silver, copper, and melamine, where the catalyst includes 1-20 wt. % silver based on a weight of the copper, where particles of the catalyst have a polygonal shape and an average size of 0.5-3 μm, and where the copper and the silver form a complex with the melamine.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention discloses a beneficiation method for tin-silver symbiotic polymetallic ore and application of the beneficiation method, and relates to the technical field of mineral separation. Comprising the steps that after tin-silver symbiotic polymetallic ore is ground, undersize minerals are obtained through a high-frequency screen, silver-copper flotation is conducted on the undersize minerals, and silver-copper concentrate and silver-copper tailings are obtained; the silver-copper tailings are subjected to lead-zinc-sulfur flotation, and lead concentrate and zinc-sulfur tailings are obtained; and the zinc-sulfur tailings are subjected to zinc-sulfur flotation, and zinc-sulfur concentrate and tin-sulfur tailings are obtained. The concentration of ore pulp in the ore grinding process is controlled, it is guaranteed that cassiterite and sulfide minerals are fully dissociated, then a first inhibitor is added in the lead-zinc-sulfur flotation process, the valuable metal recovery efficiency can be enhanced by optimizing the flotation process and collaboratively innovating a reagent formula according to the complex characteristics of tin-silver symbiotic polymetallic ore, and the recovery rate of the tin-silver symbiotic polymetallic ore is increased. The contents of silver, copper and tin in the tailings are obviously reduced, and efficient utilization of resources and reduction of solid wastes are realized.

The invention discloses a short-process preparation method of a palladium-silver-copper alloy wire with high palladium content, which comprises the following steps: 1) smelting, blowing out, refining and casting silver, copper and palladium to obtain a palladium-silver-copper master alloy ingot; 2) continuously casting the palladium-silver-copper master alloy ingot into a palladium-silver-copper alloy rod; (3) the palladium-silver-copper alloy rod is continuously rolled, and the total deformation of the palladium-silver-copper alloy rod is controlled to range from 60% to 80% till a palladium-silver-copper alloy thick wire is obtained; and 4) carrying out continuous annealing and drawing on the palladium-silver-copper alloy thick wire to obtain the palladium-silver-copper alloy wire with the diameter of 0.1-0.8 mm. By the adoption of the method, the palladium-silver-copper alloy rod with the good machining performance can be prepared, alloy wires with the tensile strength higher than 1200 MPa and the Vickers hardness larger than 350 HV can be continuously produced in batches, the cleanliness and splatability of the alloy wires both meet the first-level / A-level requirements, and meanwhile the production period is only 30% of that of a traditional technology.

The present invention provides a method for preparing an AgCuTi active solder, relating to the technical field of brazing materials. The preparation method comprises the following steps: pretreating a titanium foil, sequentially electroplating the surface with silver and copper, and diffusing the electroplated titanium foil in a vacuum environment at 600-700°C for 24 hours to obtain the AgCuTi solder. The method provided by the present invention can easily and conveniently prepare sheet- and strip-shaped AgCuTi active solders, and the active solders are less susceptible to the presence of CuTi intermetallic compounds while exhibiting good performance.

The invention discloses a copper-silver alloy and a preparation method thereof.The preparation method comprises the following steps that silver alloying is conducted, specifically, a silver raw material and rare earth elements are added into a vacuum induction furnace to be mixed, and a silver alloy melt is obtained after heating and melting are conducted in the vacuum atmosphere; copper alloying is conducted, specifically, electrolytic copper is added into a non-vacuum induction furnace to be smelted, phosphorus and rare earth elements are added for alloying after heating melting, and a copper alloy melt is obtained; horizontal continuous casting: respectively carrying out horizontal continuous casting on the silver alloy melt and the copper alloy melt to obtain a silver alloy plate and a copper alloy plate; the multiple layers of silver alloy plates and the multiple layers of copper alloy plates are alternately stacked in a silver-copper-silver-... mode and placed in hot extrusion equipment to be subjected to hot extrusion, and a composite plate is formed; and cold drawing is conducted, specifically, the composite board is subjected to cold drawing to obtain the copper-silver alloy, the copper-silver alloy can be used as an electric contact material, the preparation method is low in cost, and the prepared copper-silver alloy has high conductivity, high hardness and arc erosion resistance.

The invention discloses a metalized diamond particle, a diamond / gallium-based liquid metal composite material and a preparation method thereof, and belongs to the field of composite thermal interface materials. The metallized diamond particle comprises a diamond particle, the surface of the diamond particle is coated with an immiscible alloy layer, the immiscible alloy layer contains a diffusion barrier component and a reaction wetting component, and the content of the diffusion barrier component in the immiscible alloy layer is not higher than 15 at% of the total content of the diffusion barrier component and the reaction wetting component; wherein the diffusion barrier component is one or more of tungsten, molybdenum and tantalum, and the reaction wetting component is one or more of silver and copper. The metallized diamond particles and the gallium-based liquid metal are combined to form the composite material, so that the diamond / gallium-based liquid metal composite material has more excellent thermal conductivity.

The present invention discloses a method for adsorbing radioactive iodide ions in radioactive wastewater, which includes the following process: adding silver copper oxide to the radioactive wastewater, and the iodide ions in the radioactive wastewater react with the silver copper oxide, so that the concentration of iodide ions in the radioactive wastewater is reduced. The adsorption of radioactive iodide ions in radioactive wastewater by the silver copper oxide of the present invention belongs to chemical adsorption, which has the characteristics of fast adsorption speed, high adsorption efficiency and adsorption capacity, the adsorbed product is not easy to desorb, is easy to solidify and dispose, is convenient for recycling, is convenient to use and is not easily affected by interfering ions and pH. The silver copper oxide has a strong selective adsorption effect on iodide ions in the wastewater environment of long half-life radioactive element iodine, and can effectively improve the radioactive pollution of iodine in the water environment, and solve the main problems of spent fuel reprocessing and radioactive water pollution.

The invention relates to silver-copper-titanium active soldering paste with a high recovery coefficient and a preparation method and application of the silver-copper-titanium active soldering paste, and belongs to the technical field of heterogeneous material connection and semiconductor packaging. The silver-copper-titanium active soldering paste is composed of, by mass, 70%-90% of brazing filler metal powder and 10%-30% of scaling powder. The brazing filler metal powder is mixed powder composed of silver-copper-based powder, titanium-containing powder and other metal powder. The soldering flux is composed of, by mass, 40%-70% of a solvent, 20%-40% of rosin, 5%-20% of an active agent, 1%-15% of a thixotropic agent, 1%-10% of an interface modifier and 1%-10% of a corrosion inhibitor, and the thixotropic agent is composed of a short-range agent and a long-range agent according to the mass ratio of 1: (1-4). The recovery coefficient of the obtained soldering paste is close to 1, and the soldering paste has excellent printability, sagging resistance and storage stability and has wide application prospects in the fields of semiconductor packaging, power electronic devices, aerospace and the like.

The invention provides low-temperature sintered silver-copper slurry, a perovskite laminated cell and a preparation method, and belongs to the technical field of crystalline silicon cells. The low-temperature sintered silver-copper paste comprises the following components in parts by mass: 15-30 parts of silver powder; 63-77 parts by mass of silver coated copper powder; the surface of the silver-coated copper powder is coated with acrylic acid and an oleylamine coating agent; 3-15 parts by mass of a resin; 0.2 to 2.8 parts by mass of a curing agent; 0.05 to 0.5 part by mass of a leveling agent; and 0.05 to 0.5 part by mass of a dispersant. The present disclosure achieves low temperature (llt; in addition, the silver-coated copper powder and the silver powder are mixed, the silver powder is replaced with low cost, the material cost is reduced, meanwhile, the silver-coated copper powder forms a three-dimensional conductive network at the low temperature of less than 120 DEG C through metal bonding of a silver shell and contact between particles, and the high conductivity of the electrode is ensured.

The invention relates to a precise welding method for dense welding seams of a complex structure, and relates to the technical field of heat exchange equipment manufacturing. The process comprises the steps of welding of the interior of a core body, surface treatment of a brazing seam and welding of an end socket. The inner part of the core body adopts BNi-2 brazing filler metal to perform vacuum brazing welding on the assembled core body, the surface treatment of the welding seam is that local anodic oxidation treatment is performed on a brazing seam area after welding, a NiO protective layer is selectively generated, and the welding of the end socket is that silver-copper-titanium active brazing filler metal is pre-arranged in a connecting area of the core body and the end socket. And the lower melting point can prevent a brazing seam in the core body from melting. By selecting brazing filler metal components, welding parameters and a post-treatment process, the problems that in traditional brazing, interface brittle phases, pore defects, weld joints are prone to corrosion and the like are solved, the sealing performance of joints is remarkably improved, and the method is suitable for manufacturing of high-performance heat exchangers in the fields of aviation, chemical engineering and the like.

The present invention relates to the technical field of nanowire electromagnetic shielding film preparation, and discloses a composite nanowire staggered interconnected electromagnetic shielding film and a preparation process. The S coordinating atoms in a cationic coordination monomer form Cu-S coordination bonds with nano-copper wires, which are adsorbed on the surface of the nano-copper wires to obtain positively charged copper nanowires. The S coordinating atoms in an anionic coordination monomer form Ag-S coordination bonds with nano-silver wires, which are adsorbed on the surface of the nano-silver wires to obtain negatively charged silver nanowires. The amount of positively charged substances on the copper nanowires is greater than the amount of negatively charged substances on the silver nanowires. The silver nanowires and nano-copper wires are electrostatically self-assembled by electrostatic adsorption force to obtain positively charged silver-copper composite nanowires with a staggered interconnected distribution. The silver nanowires are spontaneously deposited on a negatively charged flexible substrate under the action of electrostatic adsorption to obtain a composite nanowire staggered interconnected electromagnetic shielding film. The electromagnetic shielding film exhibits excellent photoelectric properties.

A process for producing a silver concentrate from metallurgical residues, in particular from residues containing copper, iron, lead, silicon, silver and antimony and optionally containing elements such as arsenic and bismuth, comprising: (i) copper leaching of the metallurgical residues with a first acid solution in order to obtain a first leach solution rich in copper and iron and optionally in arsenic and a first leached sludge having a reduced copper and iron content and optionally a reduced arsenic content and being rich in lead, germanium, silver and silicon, (ii) leaching of the first leached sludge, wherein the first leached sludge is treated with a first solution of a carboxylate in order to obtain a second leached sludge lacking lead and a second leach solution rich in lead, (iii) alkaline leaching of the second leached sludge, wherein a base is added in order to form an alkaline leach solution in order to obtain a third leached sludge having a reduced silicon content and a third leach solution rich in silicon and optionally in arsenic, (iv) hydrochloric acid leaching of the third leached sludge, wherein an acid solution is used in a chloride environment in order to obtain a fourth leached sludge for final disposal and a fourth leach solution rich in silver, copper, lead and iron and optionally in arsenic, (v) precipitation of silver from the fourth leach solution rich in silver, copper and iron and optionally in arsenic with a neutralizing slurry in order to produce a fifth solution rich in chlorides and a first precipitated solid rich in iron, copper, lead and silver and optionally in arsenic, (vi) leaching of the first precipitated solid rich in iron, copper, lead and silver and optionally in arsenic with a sulfuric acid solution in order to produce a sixth leach solution rich in copper, iron and optionally in arsenic and a first silver and lead concentrate, and (vii) leaching of the first silver concentrate with a second carboxylate solution in order to produce a seventh leach solution and a second silver concentrate.

The invention relates to a high-hardness and high-strength palladium-silver-copper-nickel quaternary alloy rod for a probe and a preparation method thereof, and the palladium-silver-copper-nickel quaternary alloy rod comprises the following elements in percentage by mass: 30-38% of Pd, 40-46% of Cu, 10-20% of Ag and 8-15% of Ni. The sum of the mass of Ag and Ni is 18-30%, and the sum of the mass of Pd and Ni is 41-50%; the hardness of the palladium-silver-copper-nickel quaternary alloy bar subjected to heat treatment is larger than 300 HV, and the strength is larger than 1000 MPa. According to the invention, nickel with low cost is used as an important strengthening element and cooperates with silver and copper to realize strengthening in an alloy matrix with low palladium content, and an efficient quality-improving forming process is matched, so that the balance of high hardness and high strength of the alloy is realized on the premise of controllable cost, and the harsh demand of a test probe can be met.

The present application discloses a copper-silver alloy and a preparation method thereof, which comprises the following steps: silver alloying: adding a silver raw material and a rare earth element into a vacuum induction furnace for mixing, heating and melting in a vacuum atmosphere to obtain a silver alloy melt; copper alloying: adding electrolytic copper into a non-vacuum induction furnace for smelting, heating and melting, and then adding phosphorus and rare earth elements for alloying to obtain a copper alloy melt; horizontal continuous casting: horizontally continuous casting the above-mentioned silver alloy melt and copper alloy melt respectively to obtain silver and copper alloy plates; hot extrusion molding: alternately stacking multiple layers of silver alloy plates and copper alloy plates in a "silver-copper-silver-..." manner, placing them in a hot extrusion device for hot extrusion to form a composite plate; cold drawing: cold drawing the composite plate into a material to obtain a copper-silver alloy, which can be used as an electrical contact material. The preparation method is low in cost, and the obtained copper-silver alloy has high conductivity, high hardness and resistance to arc erosion.

The present invention discloses a plurality of silver-copper lateral composite strips for high-voltage fuses and a preparation method thereof. The method comprises: regulating the properties of the pure copper and pure silver composite components through microalloying to improve the oxidation resistance of the pure copper and to make the deformation properties of the silver and copper components more similar; preparing the microalloyed copper and pure silver into copper bars and silver bars through continuous casting, vacuum melting, and rolling; then slotting the copper bars and coating the composite interface with the silver alloy bars with an organic additive to prepare a composite blank; initial rolling on a two-roll mill to bring the bonding interface into close contact; then sintering in a protective atmosphere to form an interface layer; and finally, subjecting the sintered composite blank to intermediate rolling, diffusion annealing, rolling, pre-finish heat treatment, and finish rolling to prepare a plurality of silver-copper lateral composite strips; and slotting the copper bars along their length. The method employs an organic additive to treat the silver-copper composite interface, thereby resolving the problem of easy oxidation at the composite interface. The silver-copper composite interface is securely bonded, while requiring minimal equipment and being suitable for mass production.

The present application belongs to the technical field of preparation of fuse material for fuses, and particularly relates to a fused brazing type silver-copper composite strip and a preparation method thereof. The preparation method of the fused brazing type silver-copper composite strip comprises uniformly processing a preset number of cuboid blind holes along the length direction of a block-shaped copper plate, leaving a pure copper area at both ends of the cuboid blind holes; preheating the processed block-shaped copper plate, then pouring molten silver into the blind hole groove of the preheated block-shaped copper plate for fused brazing; and taking the pure copper area as a rolling auxiliary traction section for rolling treatment. The above-mentioned preparation method of the silver-copper composite strip has low requirements for the preparation equipment and low production cost, and can effectively realize the effective preparation of the multi-interface silver-copper composite strip, so that the size of the composite strip is no longer limited by hot rolling means, and the silver-copper strip obtained by the fused brazing method has high bonding strength, good strength stability, high straightness and high yield.

The invention discloses an ultralow dielectric constant LTCC (Low Temperature Co-Fired Ceramic) material and a preparation method thereof, the ultralow dielectric constant LTCC material is formed by compounding a glass phase and a ceramic filler phase, the glass phase comprises Li2O, La2O3, SiO2, ZrO2, P2O5, MgF2 and Al2O3; the ceramic filler phase comprises BaB2O4 and a conditioning agent, and the conditioning agent is at least one of Al2O3, SiO2 or cordierite; according to the invention, the Li-La-Si system glass and the BaB2O4 filler are compounded according to a specific proportion, so that co-firing with a silver / copper electrode at a low temperature is realized, and the composite material has excellent thermal stability and environmental friendliness, and meets the requirements of high-frequency communication applications such as 5G millimeter waves and the like on high-performance substrate materials.

The invention relates to a high-wear-resistance coating for a diamond straight-shank end mill and a preparation method of the high-wear-resistance coating, and belongs to the technical field of wear-resistance coatings. According to the high-wear-resistance coating for the straight-shank end mill of the diamond and the preparation method of the high-wear-resistance coating for the straight-shank end mill of the diamond, the thickening agent is self-made, after the thickening agent, titanium powder, silicon powder and silver-copper alloy powder are made into brazing filler metal, the straight-shank end mill base body of the diamond is brazed, and the high-wear-resistance coating for the straight-shank end mill of the diamond is obtained; an alkyl hydrophobic long chain improves the wetting effect of the brazing filler metal on the surface of a base body by reducing surface tension, in addition, azo bonds in the long chain are preferentially broken in the brazing process and decomposed into small molecule compounds, then the small molecule compounds are gradually and completely decomposed, metal powder in the brazing filler metal can be directly combined with the surface of the base body, and a firm alloy coating is formed; the wear resistance and the comprehensive service life of the diamond straight-shank end mill are improved.

The invention discloses a medium-temperature silver flower wire solder and a preparation method thereof, the medium-temperature silver flower wire solder comprises 17-19.5% of copper, 0.01-2% of zinc, 0.01-1.4% of indium, 0.01-0.5% of germanium, 0.01-0.4% of tin, 0.01-0.3% of rare earth and the balance silver and inevitable impurity elements, and the rare earth is one or more of cerium, yttrium, lanthanum, neodymium and gadolinium. According to the welding flux, silver, copper, zinc, indium, germanium, tin, rare earth and the like serve as main alloy elements, the component proportion of the main alloy elements is optimized and adjusted, the alloy formula is optimized, and the medium-temperature-grade silver welding flux which is excellent in comprehensive performance and can well meet the welding requirement of the silver wire jewelry is prepared.

The invention belongs to the technical field of packaging interface materials for electronic power devices, and particularly discloses a silver-copper composite conductive paste capable of being sintered at a low temperature, and a preparation method and use thereof. A first purpose of the invention is to provide a silver-copper composite conductive paste capable of being sintered at a low temperature, comprising, by weight, the following components: 20-80% of micro-copper particles; 10-60% of nano-silver sheets; 1-20% of nano-silver particles; and 10% of an organic carrier. The silver-copper composite conductive paste capable of being sintered at a low temperature provided by the invention adopts silver and copper of different sizes and morphologies, large-sized sliver sheets and micro-copper particles are used as skeletons, and small nano-silver particles are used for filling, such that gaps are reduced, and the performance is improved.

An electric circuit board includes an insulating substrate, a metal plate, and a brazing material with which the insulating substrate and the metal plate are joined together. The metal plate has a side surface over which recessed portions are scattered. The side surface of the metal plate has lines in regions around the recessed portions. The metal plate is made of copper or a copper alloy. The brazing material has a side surface that is continuous with the side surface of the metal plate. The brazing material is a silver-copper brazing alloy. A ratio of copper on the side surface of the brazing material is higher than a copper component ratio of the silver-copper brazing alloy.

This invention relates to a high-hardness, high-strength palladium-silver-copper-nickel quaternary alloy rod for probes and its preparation method. The elemental composition of the palladium-silver-copper-nickel quaternary alloy rod, by mass percentage, is: Pd 30-38%, Cu 40-46%, Ag 10-20%, Ni 8-15%; the sum of the mass of Ag and Ni is 18-30%, and the sum of the mass of Pd and Ni is 41-50%. The heat-treated palladium-silver-copper-nickel quaternary alloy rod has a hardness greater than 300 HV and a strength greater than 1000 MPa. The invention utilizes relatively low-cost nickel as a key strengthening element, synergistically strengthening it with silver and copper in an alloy matrix with a low palladium content. Combined with an efficient and high-quality forming process, a balance between high hardness and high strength is achieved in the alloy while maintaining controllable costs, meeting the stringent requirements of testing probes.

The invention discloses a preparation method and application of a silver-copper gas transmitting and dispersing electrode. The preparation method comprises the following steps: S1, preparing a copper-based gas transmitting and dispersing electrode; and S2, preparing a silver-copper gas transmitting and dispersing electrode: obtaining the silver-copper gas transmitting and dispersing electrode. The silver-copper gas transmitting and dispersing electrode is applied to electrocatalytic carbon dioxide reduction reaction. According to the invention, silver nanoparticles are loaded on the surface of the copper-based gas transmitting and dispersing electrode through a proper method, and when the electrode is applied to an electro-catalysis carbon dioxide reduction reaction, CO generation on the surface of the electrode can be effectively improved, so that the CO coverage of nearby copper sites is improved; meanwhile, concentrated seawater is used as a cathode electrolyte, a high cation environment is provided, and a supply balance relation formed by metal cations and H < + > is realized under an acidic condition, so that an excessive HER process under the acidic condition is avoided, precipitation of calcium and magnesium ions is inhibited, and the overall economic benefit can be improved.

The invention provides a high-temperature-resistant working sealing silver copper paste for a power chip, which comprises the following components in parts by mass: 45-80 parts of silver-coated copper powder, 0-60 parts of a sinterable conductive filler, 0.8-4.5 parts of a high-temperature adhesive, 0.2-0.32 part of a curing agent, 6-9 parts of an organic solvent and 0-3.1 parts of an auxiliary agent, the sinterable conductive filler is used for enhancing conductivity and sintering performance, and the sinterable conductive filler is silver powder or tin alloy powder or indium alloy powder or mixed sinterable powder composed of one or two of the conductor powder. According to the low-silver-content silver-copper paste, the silver-copper paste contains the conductive powder which can be sintered at the low temperature according to a certain proportion, so that the conductive powder which can be sintered at the low temperature and the silver layer on the surface of the silver-coated copper powder are sintered together, and the silver layer on the surface of the silver-coated copper powder can be covered; the silver sealing glue not only has the characteristics of high thermal conductivity, good high-temperature reliability, good fatigue resistance and high melting point of pure silver sealing glue, but also can reduce the cost and improve the cost performance.

The invention discloses a high-temperature-oxidation-resistant low-silver-content AgCuGa noble metal dual-phase alloy material, and belongs to the technical field of silver-copper brazing filler metal alloy preparation. The key point of the silver content AgCuGa noble metal dual-phase alloy material is 60% lt; cu + Ga is smaller than or equal to 65%, and the Ga / Cu ratio is larger than or equal to 0.224. In cooperation with the preparation method, the material is mainly composed of an Ag-rich phase and a Cu-rich phase, Ga is mainly in the Cu-rich phase, the Ag-rich phase only contains a very small amount of Ga element, Ga atoms of the Ga element in the Cu-rich phase are rapidly and autonomously distributed at a high temperature, a Ga2O3-rich continuous compact nano oxide layer is formed on the surface, the oxide film effectively inhibits O atom internal diffusion, the volume ratio of the metal Ga to the Ga2O3 is remarkably reduced, and the material is suitable for large-scale production. And a complete and compact high-protective oxidation film is formed, excellent oxidation resistance is achieved in 700 DEG C air, and the shear strength of a brazed joint is superior to that of Ag-28Cu alloy vacuum brazing under the protection of low-flow inert gas.

The utility model provides a kind of high-performance conductive foam, it is related to the field of isolation shielding.The utility model includes foam main body, the outer surface of foam main body is connected with elastic conductive intermediate layer, elastic conductive intermediate layer is the composite material of carbon nanotube and graphene, the outer surface of elastic conductive intermediate layer is connected with metal plating, metal plating is silver copper alloy material quality, the outer surface of metal plating is connected with conductive macromolecular fiber layer.The beneficial effects of the utility model include: first, replace traditional conductive layer carbon coating by the cooperation of elastic conductive intermediate layer, metal plating and conductive macromolecular fiber layer, so as to avoid the easy cracking or falling off of conductive layer, conductive macromolecular fiber layer has greater flexibility, further avoids the problem of cracking and falling off, as described above, this kind of high-performance conductive foam is by using macromolecular fiber and optimizing its flexibility, not only improves its durability and reliability, very practical.

The invention discloses silver-copper paste based on a double-closed curing agent and a printed radio frequency identification tag. The silver-copper paste comprises silver powder, silver-coated copper powder, polyurethane resin and a blocked isocyanate curing agent, the blocked isocyanate curing agent comprises a low-temperature deblocking curing agent and a high-temperature deblocking curing agent, the deblocking temperature of the low-temperature deblocking curing agent is R1, the deblocking temperature of the high-temperature deblocking curing agent is R2, R1 and R2 meet the condition that R1 is larger than 70 DEG C, smaller than 140 DEG C and smaller than 140 DEG C, and R1 is larger than or equal to R1 and smaller than or equal to R2. R2-R1 is more than 20 DEG C and less than 50 DEG C; after the silver-copper paste is printed into the antenna, low-temperature curing is carried out at the temperature T1, and the low-temperature deblocking curing agent is activated; then carrying out flattening treatment; then carrying out high-temperature curing at the temperature T2, and activating a high-temperature deblocking curing agent; t1 and T2 satisfy R1 < = T1 < R2 < = T2. According to the invention, the negative effect of a compression roller process on a silver copper paste printed antenna is effectively solved, and the formation of a high-conductivity, stable and consistent conductive antenna is ensured.