298 results about "Silver copper" patented technology

An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material, which includes aluminum (Al), copper (Cu), and a second active metal element, but does not contain silver. Based on a total weight of the second metal composite material being 100 parts by weight, an aluminum content is not less than 40 parts by weight.

The invention provides a diamond / copper multi-layer composite material capable of being subjected to high-temperature silver-copper welding, a preparation method of the diamond / copper multi-layer composite material and a heat dissipation device comprising the diamond / copper multi-layer composite material capable of being subjected to high-temperature silver-copper welding. The diamond / copper multilayer composite material capable of being subjected to high-temperature silver-copper welding is of a sandwich structure, a middle layer is made of a diamond / copper composite material, and an upper layer and a lower layer are respectively made of any one of tungsten copper, molybdenum copper and copper / molybdenum copper / copper (CPC material). The surface of the diamond / copper multilayer composite material is covered with the metal alloy material, so that the diamond / copper multilayer composite material has remarkably improved strength and lower thermal expansion coefficient at high temperature, and can be welded with ceramic at high temperature, so that a silver-copper solder can be used for replacing a gold-tin solder, and the application cost of the diamond / copper multilayer composite material is reduced.

The invention relates to low-temperature conductive silver copper paste and a preparation method and application thereof in the technical field of solar heterojunction cells. The low-temperature conductive silver copper paste comprises the following components in parts by weight: 1-96 parts of silver powder; 1-96 parts of silver coated copper powder; 0.1 to 5 parts of resin; 0.1-5 parts of a curing agent; 1-10 parts of an organic solvent; wherein the resin comprises epoxy resin and acrylic resin, and the mass ratio of the epoxy resin to the acrylic resin is 1: (0.1-1.6). According to the low-temperature conductive silver-copper paste provided by the invention, through reasonable matching of the resin, the surface wettability of powder particles can be effectively improved, the wettability of the paste is improved, the long-term printability is guaranteed, the printability is enhanced, meanwhile, the double-sided rate is excellent, the reliability is excellent, the aspect ratio is excellent, the photoelectric conversion efficiency is excellent, and the overall performance is excellent through production line verification. And meanwhile, the preparation method of the low-temperature conductive silver-copper paste is simple to operate, free of special requirements on equipment, easy to industrialize and wide in application prospect.

The invention relates to a preparation method of silver-coated copper powder for the electronic industry, in particular to a preparation method of silver-coated copper powder for low-temperature slurry, which comprises the following steps: (1) alkali washing; (2) pickling; (3) organic modification; and (4) chemical silver plating is conducted, filtering, cleaning and drying are conducted after chemical silver plating is completed, and the silver-plated copper powder is obtained. Copper powder replacement is inhibited through surface organic modification, so that the copper powder does not participate in the reaction or does not participate in the reaction slightly, on one hand, copper powder raw material waste caused by the replacement reaction can be reduced, and on the other hand, batch instability caused by the morphology and specific surface area difference of the copper powder can be reduced. The silver-coated copper powder prepared by the method has excellent conductivity, high temperature resistance and silver-copper interlayer binding force, and can meet shearing acting forces such as high temperature and extrusion in the preparation and use process of low-temperature slurry.

The invention discloses a method for separating and recycling a silver-copper composite material through selective interface oxidation. The method comprises the following steps that the material is crushed and sheared, and a crushed material is obtained; the crushed material is pretreated and then fed into an oxidation fluidized bed, an internal oxidation reaction is conducted in a gas phase at the temperature of 400-700 DEG C and the oxygen pressure of 0.2-0.6 MPa, the reaction time is 20-60 h, and a high-temperature material is obtained; quenching the high-temperature material to generate stress cracks on an oxidation interface to obtain a cooled material; and stripping the cooled material under the mechanical action to obtain a recycled copper material and a recycled silver material, oxidizing the electrical contact material or leftover materials of the electrical contact material in the oxygen atmosphere to oxidize an interface between the silver-copper composite materials to form an oxidation film, separating the two materials of the silver-copper composite materials under the quenching and mechanical actions, and then, obtaining the recycled copper material and the recycled silver material. The method is high in recovery rate, high in recovery purity and environment-friendly.

The invention belongs to the technical field of copper electrolytic refining, and particularly relates to an electrolyte for preparing high-purity copper through electrolytic refining of a high-silver copper plate and a preparation method. The electrolyte for preparing the high-purity copper through electrolytic refining of the high-silver copper plate comprises an electrolytic mother solution and an additive, the electrolytic mother solution comprises CuSO4 and H2SO4, the additive is amino-functionalized imidazole ionic liquid, the amino-functionalized imidazole ionic liquid is 1-aminoalkyl-3-methylimidazole halide salt, and the electrolyte is prepared from an electrolyte solution and a solvent. And the mass concentration of the additive in the electrolyte is 0.01-0.08 g / L. According to the method, a specific type of ionic liquid additive is added into the electrolysis mother liquor, so that the flocculation effect on fine suspended anode mud generated in the electrolysis process can be achieved, the ionic liquid additive can react with Ag < + > to generate precipitates, then the content of Ag and other impurities in cathode copper is reduced, the purity of the cathode copper is greatly improved, and the surface quality of the cathode copper is improved.

A method of reducing carbon dioxide, with a catalyst including silver, copper, and melamine, where the catalyst includes 1-20 wt. % silver based on a weight of the copper, where particles of the catalyst have a polygonal shape and an average size of 0.5-3 μm, and where the copper and the silver form a complex with the melamine.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention discloses a beneficiation method for tin-silver symbiotic polymetallic ore and application of the beneficiation method, and relates to the technical field of mineral separation. Comprising the steps that after tin-silver symbiotic polymetallic ore is ground, undersize minerals are obtained through a high-frequency screen, silver-copper flotation is conducted on the undersize minerals, and silver-copper concentrate and silver-copper tailings are obtained; the silver-copper tailings are subjected to lead-zinc-sulfur flotation, and lead concentrate and zinc-sulfur tailings are obtained; and the zinc-sulfur tailings are subjected to zinc-sulfur flotation, and zinc-sulfur concentrate and tin-sulfur tailings are obtained. The concentration of ore pulp in the ore grinding process is controlled, it is guaranteed that cassiterite and sulfide minerals are fully dissociated, then a first inhibitor is added in the lead-zinc-sulfur flotation process, the valuable metal recovery efficiency can be enhanced by optimizing the flotation process and collaboratively innovating a reagent formula according to the complex characteristics of tin-silver symbiotic polymetallic ore, and the recovery rate of the tin-silver symbiotic polymetallic ore is increased. The contents of silver, copper and tin in the tailings are obviously reduced, and efficient utilization of resources and reduction of solid wastes are realized.

The invention provides a preparation method of a through-type silver-copper composite material used as a melt, and the preparation method comprises the following steps: carrying out multi-pass slotting treatment on the surface of a coiled copper strip along the length direction, and forming a plurality of grooves penetrating through the width direction of the copper strip on the surface of the copper strip; special-shaped machining is conducted on the two side faces of the groove; silver strips are positioned in the multiple grooves correspondingly, and continuous cold compounding is conducted through a special-shaped roller set; carrying out heat treatment on the material obtained by cold compounding; performing multi-pass cold rolling-annealing on the material subjected to heat treatment to obtain a composite material strip; and the composite material strip is brushed, so that the silver layer with the preset width is exposed from the bottom of the groove, and the through type silver-copper composite material used as the melt is formed. The composite interface bonding strength of the silver-copper composite material can be enhanced, and the production efficiency of the silver-copper composite material and the quality stability of the fuse melt are improved.

The invention discloses a short-process preparation method of a palladium-silver-copper alloy wire with high palladium content, which comprises the following steps: 1) smelting, blowing out, refining and casting silver, copper and palladium to obtain a palladium-silver-copper master alloy ingot; 2) continuously casting the palladium-silver-copper master alloy ingot into a palladium-silver-copper alloy rod; (3) the palladium-silver-copper alloy rod is continuously rolled, and the total deformation of the palladium-silver-copper alloy rod is controlled to range from 60% to 80% till a palladium-silver-copper alloy thick wire is obtained; and 4) carrying out continuous annealing and drawing on the palladium-silver-copper alloy thick wire to obtain the palladium-silver-copper alloy wire with the diameter of 0.1-0.8 mm. By the adoption of the method, the palladium-silver-copper alloy rod with the good machining performance can be prepared, alloy wires with the tensile strength higher than 1200 MPa and the Vickers hardness larger than 350 HV can be continuously produced in batches, the cleanliness and splatability of the alloy wires both meet the first-level / A-level requirements, and meanwhile the production period is only 30% of that of a traditional technology.

The present invention provides a method for preparing an AgCuTi active solder, relating to the technical field of brazing materials. The preparation method comprises the following steps: pretreating a titanium foil, sequentially electroplating the surface with silver and copper, and diffusing the electroplated titanium foil in a vacuum environment at 600-700°C for 24 hours to obtain the AgCuTi solder. The method provided by the present invention can easily and conveniently prepare sheet- and strip-shaped AgCuTi active solders, and the active solders are less susceptible to the presence of CuTi intermetallic compounds while exhibiting good performance.

The invention discloses a copper-silver alloy and a preparation method thereof.The preparation method comprises the following steps that silver alloying is conducted, specifically, a silver raw material and rare earth elements are added into a vacuum induction furnace to be mixed, and a silver alloy melt is obtained after heating and melting are conducted in the vacuum atmosphere; copper alloying is conducted, specifically, electrolytic copper is added into a non-vacuum induction furnace to be smelted, phosphorus and rare earth elements are added for alloying after heating melting, and a copper alloy melt is obtained; horizontal continuous casting: respectively carrying out horizontal continuous casting on the silver alloy melt and the copper alloy melt to obtain a silver alloy plate and a copper alloy plate; the multiple layers of silver alloy plates and the multiple layers of copper alloy plates are alternately stacked in a silver-copper-silver-... mode and placed in hot extrusion equipment to be subjected to hot extrusion, and a composite plate is formed; and cold drawing is conducted, specifically, the composite board is subjected to cold drawing to obtain the copper-silver alloy, the copper-silver alloy can be used as an electric contact material, the preparation method is low in cost, and the prepared copper-silver alloy has high conductivity, high hardness and arc erosion resistance.

The invention discloses a metalized diamond particle, a diamond / gallium-based liquid metal composite material and a preparation method thereof, and belongs to the field of composite thermal interface materials. The metallized diamond particle comprises a diamond particle, the surface of the diamond particle is coated with an immiscible alloy layer, the immiscible alloy layer contains a diffusion barrier component and a reaction wetting component, and the content of the diffusion barrier component in the immiscible alloy layer is not higher than 15 at% of the total content of the diffusion barrier component and the reaction wetting component; wherein the diffusion barrier component is one or more of tungsten, molybdenum and tantalum, and the reaction wetting component is one or more of silver and copper. The metallized diamond particles and the gallium-based liquid metal are combined to form the composite material, so that the diamond / gallium-based liquid metal composite material has more excellent thermal conductivity.

The present invention discloses a method for adsorbing radioactive iodide ions in radioactive wastewater, which includes the following process: adding silver copper oxide to the radioactive wastewater, and the iodide ions in the radioactive wastewater react with the silver copper oxide, so that the concentration of iodide ions in the radioactive wastewater is reduced. The adsorption of radioactive iodide ions in radioactive wastewater by the silver copper oxide of the present invention belongs to chemical adsorption, which has the characteristics of fast adsorption speed, high adsorption efficiency and adsorption capacity, the adsorbed product is not easy to desorb, is easy to solidify and dispose, is convenient for recycling, is convenient to use and is not easily affected by interfering ions and pH. The silver copper oxide has a strong selective adsorption effect on iodide ions in the wastewater environment of long half-life radioactive element iodine, and can effectively improve the radioactive pollution of iodine in the water environment, and solve the main problems of spent fuel reprocessing and radioactive water pollution.

The invention relates to silver-copper-titanium active soldering paste with a high recovery coefficient and a preparation method and application of the silver-copper-titanium active soldering paste, and belongs to the technical field of heterogeneous material connection and semiconductor packaging. The silver-copper-titanium active soldering paste is composed of, by mass, 70%-90% of brazing filler metal powder and 10%-30% of scaling powder. The brazing filler metal powder is mixed powder composed of silver-copper-based powder, titanium-containing powder and other metal powder. The soldering flux is composed of, by mass, 40%-70% of a solvent, 20%-40% of rosin, 5%-20% of an active agent, 1%-15% of a thixotropic agent, 1%-10% of an interface modifier and 1%-10% of a corrosion inhibitor, and the thixotropic agent is composed of a short-range agent and a long-range agent according to the mass ratio of 1: (1-4). The recovery coefficient of the obtained soldering paste is close to 1, and the soldering paste has excellent printability, sagging resistance and storage stability and has wide application prospects in the fields of semiconductor packaging, power electronic devices, aerospace and the like.

An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material. The second metal composite material includes a low melting point metal element (e.g., Sn), copper (Cu), and a second active metal element, but does not include silver. A melting point of the low melting metal element is between 130° C. and 350° C.

The invention provides low-temperature sintered silver-copper slurry, a perovskite laminated cell and a preparation method, and belongs to the technical field of crystalline silicon cells. The low-temperature sintered silver-copper paste comprises the following components in parts by mass: 15-30 parts of silver powder; 63-77 parts by mass of silver coated copper powder; the surface of the silver-coated copper powder is coated with acrylic acid and an oleylamine coating agent; 3-15 parts by mass of a resin; 0.2 to 2.8 parts by mass of a curing agent; 0.05 to 0.5 part by mass of a leveling agent; and 0.05 to 0.5 part by mass of a dispersant. The present disclosure achieves low temperature (llt; in addition, the silver-coated copper powder and the silver powder are mixed, the silver powder is replaced with low cost, the material cost is reduced, meanwhile, the silver-coated copper powder forms a three-dimensional conductive network at the low temperature of less than 120 DEG C through metal bonding of a silver shell and contact between particles, and the high conductivity of the electrode is ensured.

The invention provides a photovoltaic module metal material recovery process based on low-temperature green chemical treatment. According to the technology, a low-toxicity green chemical solvent is used, metal materials (such as silver and copper) in the waste photovoltaic module are dissolved, separated and reduced under the low-temperature condition, high-purity metal is recycled, and energy consumption and environmental pollution are effectively reduced. The method comprises the following steps: immersing a metal part of the waste photovoltaic module into a green chemical solvent, dissolving the metal at low temperature, and extracting the metal through filtration and reduction reaction; the recycled metal is high in purity and high in recycling rate, and meanwhile silicon wafers and glass parts can be effectively treated through physical and chemical methods. The technology has the advantages of high metal recovery efficiency, low environmental influence and low energy consumption, and is suitable for recovery treatment of waste photovoltaic modules.

The invention belongs to the technical field of metallurgy, and relates to a method for improving the recovery rate of silver and copper by using wet antimony leaching high-salt waste liquid, which comprises the following steps: (1) first-grade silver-copper-containing gold concentrate ore blending; (2) secondary high-salt waste liquid output; (3) carrying out third-stage wet-process size mixing; (4) four-stage sulfating roasting; (5) five-stage acid leaching copper leaching; and (6) gold and silver are leached through six-stage cyanidation. According to the method, comprehensive recovery of the silver-copper-containing gold concentrate and high-value utilization of the high-salinity wastewater are achieved in the mode that the silver-copper-containing gold concentrate and the wet-process antimony leaching high-salinity waste liquid are mixed and subjected to high-temperature sulfating roasting, no wastewater or dangerous solid waste is generated, and the environment-friendly requirement is met; the equipment is simple in structure, stable in operation and high in adaptability, the influence of circulating wet antimony immersion of the high-salinity wastewater on the system is effectively solved, and convenience is provided for subsequent production; and the process production cost is low, the number of users is small, and the cost is effectively reduced.

The invention relates to the field of welding materials, in particular to high-temperature-resistant antioxidant solder paste and a preparation method thereof. The high-temperature-resistant antioxidant solder paste comprises the following raw materials: a tin-silver-copper alloy, temperature-resistant copolymer resin, an antioxidant, a thixotropic agent, a corrosion inhibitor, a dispersing agent, a functional compound and the like. The finally prepared solder paste material not only can maintain excellent high temperature resistance and oxidation resistance, but also can maintain good corrosion resistance, water resistance, toughness and the like at the same time, so that performance contradictions of the solder paste material are eliminated while the problems of temperature resistance and oxidation resistance of an existing solder paste material are solved, and the service life of the solder paste material is prolonged. Therefore, the solder paste meets the comprehensive performance requirements of existing electronic products and other fields on solder paste materials, and has wide application potential.

The invention relates to a precise welding method for dense welding seams of a complex structure, and relates to the technical field of heat exchange equipment manufacturing. The process comprises the steps of welding of the interior of a core body, surface treatment of a brazing seam and welding of an end socket. The inner part of the core body adopts BNi-2 brazing filler metal to perform vacuum brazing welding on the assembled core body, the surface treatment of the welding seam is that local anodic oxidation treatment is performed on a brazing seam area after welding, a NiO protective layer is selectively generated, and the welding of the end socket is that silver-copper-titanium active brazing filler metal is pre-arranged in a connecting area of the core body and the end socket. And the lower melting point can prevent a brazing seam in the core body from melting. By selecting brazing filler metal components, welding parameters and a post-treatment process, the problems that in traditional brazing, interface brittle phases, pore defects, weld joints are prone to corrosion and the like are solved, the sealing performance of joints is remarkably improved, and the method is suitable for manufacturing of high-performance heat exchangers in the fields of aviation, chemical engineering and the like.

The present invention relates to the technical field of nanowire electromagnetic shielding film preparation, and discloses a composite nanowire staggered interconnected electromagnetic shielding film and a preparation process. The S coordinating atoms in a cationic coordination monomer form Cu-S coordination bonds with nano-copper wires, which are adsorbed on the surface of the nano-copper wires to obtain positively charged copper nanowires. The S coordinating atoms in an anionic coordination monomer form Ag-S coordination bonds with nano-silver wires, which are adsorbed on the surface of the nano-silver wires to obtain negatively charged silver nanowires. The amount of positively charged substances on the copper nanowires is greater than the amount of negatively charged substances on the silver nanowires. The silver nanowires and nano-copper wires are electrostatically self-assembled by electrostatic adsorption force to obtain positively charged silver-copper composite nanowires with a staggered interconnected distribution. The silver nanowires are spontaneously deposited on a negatively charged flexible substrate under the action of electrostatic adsorption to obtain a composite nanowire staggered interconnected electromagnetic shielding film. The electromagnetic shielding film exhibits excellent photoelectric properties.

The invention belongs to the technical field of electrical contact structures, and particularly relates to a composite functional electrical contact and a 3D forming preparation method thereof.The composite functional electrical contact comprises a rivet-shaped copper layer body, the end face of the head of the copper layer body is concaved downwards to form a pot-bottom-shaped cavity, the edge of the pot bottom is right flush with the upper end of the copper layer body in height, and the pot-bottom-shaped cavity is filled with an inner pure silver layer; a silver metal oxide layer is arranged outside the inner pure silver layer, a silver tungsten carbide layer is arranged outside the silver metal oxide layer, and an outer pure silver layer is arranged outside the silver tungsten carbide layer. Innovative design is carried out from the angle of a contact structure, multi-layer composite design is carried out on a silver layer of a traditional silver-copper composite rivet, all layers of materials are tightly combined into a whole, and the comprehensive excellent performance of high impact resistance, long electrical life, low surface contact resistance and low loop impedance is achieved, so that the electrical performance stability of a magnetic latching relay is improved, and the service life of the magnetic latching relay is prolonged. And the electrical performance reliability of the electrical appliance is improved.

The invention provides a preparation method for metallizing an electrode on the surface of a ceramic element by aluminum plating or aluminum alloy coating through a magnetron sputtering process. Comprising the following steps: cleaning and drying the surface of a ceramic element, putting the ceramic element into magnetron sputtering equipment with aluminum or aluminum alloy as a target material, and directly depositing the aluminum or aluminum alloy material on the surface of the ceramic element through magnetron sputtering to form a metallized electrode. A layer of aluminum or aluminum alloy metallization can be directly deposited on the surface of the ceramic element to serve as an electrode instead of silver, copper and other materials, the material cost is greatly reduced, the binding force and conductivity are good, and the process is simple and controllable.

A process for producing a silver concentrate from metallurgical residues, in particular from residues containing copper, iron, lead, silicon, silver and antimony and optionally containing elements such as arsenic and bismuth, comprising: (i) copper leaching of the metallurgical residues with a first acid solution in order to obtain a first leach solution rich in copper and iron and optionally in arsenic and a first leached sludge having a reduced copper and iron content and optionally a reduced arsenic content and being rich in lead, germanium, silver and silicon, (ii) leaching of the first leached sludge, wherein the first leached sludge is treated with a first solution of a carboxylate in order to obtain a second leached sludge lacking lead and a second leach solution rich in lead, (iii) alkaline leaching of the second leached sludge, wherein a base is added in order to form an alkaline leach solution in order to obtain a third leached sludge having a reduced silicon content and a third leach solution rich in silicon and optionally in arsenic, (iv) hydrochloric acid leaching of the third leached sludge, wherein an acid solution is used in a chloride environment in order to obtain a fourth leached sludge for final disposal and a fourth leach solution rich in silver, copper, lead and iron and optionally in arsenic, (v) precipitation of silver from the fourth leach solution rich in silver, copper and iron and optionally in arsenic with a neutralizing slurry in order to produce a fifth solution rich in chlorides and a first precipitated solid rich in iron, copper, lead and silver and optionally in arsenic, (vi) leaching of the first precipitated solid rich in iron, copper, lead and silver and optionally in arsenic with a sulfuric acid solution in order to produce a sixth leach solution rich in copper, iron and optionally in arsenic and a first silver and lead concentrate, and (vii) leaching of the first silver concentrate with a second carboxylate solution in order to produce a seventh leach solution and a second silver concentrate.

The invention relates to a high-hardness and high-strength palladium-silver-copper-nickel quaternary alloy rod for a probe and a preparation method thereof, and the palladium-silver-copper-nickel quaternary alloy rod comprises the following elements in percentage by mass: 30-38% of Pd, 40-46% of Cu, 10-20% of Ag and 8-15% of Ni. The sum of the mass of Ag and Ni is 18-30%, and the sum of the mass of Pd and Ni is 41-50%; the hardness of the palladium-silver-copper-nickel quaternary alloy bar subjected to heat treatment is larger than 300 HV, and the strength is larger than 1000 MPa. According to the invention, nickel with low cost is used as an important strengthening element and cooperates with silver and copper to realize strengthening in an alloy matrix with low palladium content, and an efficient quality-improving forming process is matched, so that the balance of high hardness and high strength of the alloy is realized on the premise of controllable cost, and the harsh demand of a test probe can be met.

The invention discloses an integrated racking structure based on three-dimensional stacked packaging and a manufacturing method of the integrated racking structure, and belongs to the field of integrated circuit packaging shells. The structure comprises an upper ceramic substrate, three stacked integrated parts and a lower ceramic substrate from top to bottom, and the upper ceramic substrate and the integrated parts, the integrated parts, and the integrated parts and the lower ceramic substrate are in brazed connection through integrated silver-copper solder layers. The invention has the following advantages: (1) the enclosure frame and guide pin integrated structure provides high alignment precision for the small-size enclosure frame and the guide pin; (2) the integrated solder reduces solder deviation and operation difficulty possibly caused by multiple times of laying of the solder; (3) the stress of layered multi-time brazing is lower than that of normal one-time brazing, and the reliability risk of the multi-layer stacked packaging structure is lower; and (4) the method is compatible with an HTCC process, and on the premise of realizing high microwave performance, miniaturization, integration and low cost, the processing and forming method is simple, and batch production is facilitated.

The invention discloses a preparation method suitable for spherical and flaky silver-coated copper powder, and belongs to the technical field of silver-copper micron composite material preparation. The method comprises the following steps: (1) mixing an amino acid solution with a silver nitrate solution to obtain a mixed solution; (2) placing the copper micron particle dispersion solution or the copper micron sheet dispersion solution under a reaction temperature condition, stirring to enable the copper micron particle dispersion solution or the copper micron sheet dispersion solution to reach the reaction temperature, keeping stirring and the temperature unchanged, then adding the mixed solution into the copper micron particle dispersion solution or the copper micron sheet dispersion solution, and stirring to obtain a copper micron particle dispersion solution or a copper micron sheet dispersion solution; reacting for a period of time to obtain a silver-coated copper powder stock solution; and (3) centrifuging the silver-coated copper powder stock solution to obtain solid powder, and washing and drying the solid powder to obtain the silver-coated copper powder. In the preparation process of the silver-coated copper powder, only amino acid is used as an additive, the preparation process is simple, efficient, green and environmentally friendly, the cost is low, and the applicability is wide.

The invention belongs to the technical field of conductive adhesives, and particularly relates to an ultralow-hardness silver-copper conductive adhesive and a preparation method thereof. The ultralow-hardness silver-copper conductive adhesive comprises the following components in parts by weight: 50-100 parts of liquid silicone rubber, 30-80 parts of a diluent, 1-10 parts of a chain extender, 0.1-5 parts of a heat-resistant agent, 0.1-5 parts of a coupling agent, 0.1-5 parts of an inhibitor and 100-400 parts of conductive filler. The shielding performance of the ultralow-hardness silver-copper conductive adhesive can reach 100 dB, the tensile strength is larger than 1 Mpa, the volume resistivity is smaller than 0.005 ohm.cm, and the hardness is smaller than 30 ShoreA. On the premise that the requirements of products for mechanical strength and shielding effectiveness are met, the ultralow-hardness silver-copper conductive adhesive has lower product hardness, the internal stress of the adhesive to electronic components is greatly reduced, and market requirements are met.