Silver-copper-titanium active soldering paste

An activity and solder paste technology, applied in the direction of welding medium, welding equipment, welding/welding/cutting items, etc., can solve the problems of low activity, easy oxidation of Ti, easy segregation of silver-copper-titanium alloy melting, etc., to reduce process cost, The effect of reducing the impact

Inactive Publication Date: 2017-11-07
GUANGZHOU XIANYI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a silver-copper-titanium active solder paste, which can effectively solve the problems of easy segregation of silver-copper-titanium alloy during smelting, easy oxidation of Ti, and low activity during brazing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A silver-copper-titanium active soldering paste comprises: solder powder and a binder, wherein the mass percentage of the solder powder and the binder is 85% of the solder powder and 15% of the binder.

[0033] The above-mentioned solder powder includes: silver-copper alloy powder and titanium hydride powder; wherein, the silver-copper alloy powder is Ag72Cu28 alloy powder;

[0034] The mass percentages of the above silver-copper alloy powder and titanium hydride powder are: 96% of Ag72Cu28 alloy powder and 4% of titanium hydride powder.

[0035] The above-mentioned binders include: paste forming agents, solvents and thixotropic agents;

[0036] The mass percent of each composition in above-mentioned pasting agent, solvent and thixotropic agent is specific as follows:

[0037] Paste: 15% polyvinyl alcohol, 10% ethyl cellulose;

[0038] Solvent: 30% triethanolamine, 25% butyl cellosolve, 17% N,N-dimethylformamide;

[0039] Thixotropic agent: hydrogenated castor oil 3%...

Embodiment 2

[0041] A silver-copper-titanium active solder paste comprises: solder powder and a binder, wherein the mass percentage of the solder powder and the binder is 88% of the solder powder and 12% of the binder.

[0042] The above solder powder includes: silver powder, copper powder and titanium hydride powder; wherein, the mass percentage of silver powder, copper powder and titanium hydride powder is: silver powder 70%, copper powder 26%, titanium hydride powder 4%.

[0043] The above-mentioned binders include: paste forming agents, solvents and thixotropic agents;

[0044] The mass percent of each composition in above-mentioned pasting agent, solvent and thixotropic agent is specific as follows:

[0045] Paste: 30% acrylic resin;

[0046] Solvent: 20% tert-butanol, 18% polyvinyl alcohol, 17% N,N-dimethylformamide, 11% nonylphenol polyethylene glycol ether;

[0047] Thixotropic agent: polyamide wax 4%.

Embodiment 3

[0049] A silver-copper-titanium active solder paste comprises: solder powder and a binder, wherein the mass percentage of the solder powder and the binder is 90% of the solder powder and 10% of the binder.

[0050] The above solder powder includes: silver powder, copper powder and titanium hydride powder; wherein, the mass percentage of silver powder, copper powder and titanium hydride powder is: silver powder 80%, copper powder 16%, titanium hydride powder 4%.

[0051] The above-mentioned binders include: paste forming agents, solvents and thixotropic agents;

[0052] The mass percent of each composition in above-mentioned pasting agent, solvent and thixotropic agent is specific as follows:

[0053] Paste: polyvinyl alcohol 13%, carboxymethyl cellulose 7%;

[0054] Solvent: 21% diethylene glycol, 25% triethanolamine, 31% nonylphenol polyethylene glycol ether;

[0055] Thixotropic agent: polyurea 3%.

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PUM

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Abstract

The invention provides a silver-copper-titanium active soldering paste. The paste comprises, by mass, 85-90% of brazing powder and 10-15% of bonding agent; the brazing powder is mixed powder including silver powder, copper powder and titanium hydride powder, wherein the mixed powder comprises, by mass, 65-93% of silver, 5-35% of copper and 1-4% of titanium; the bonding agent comprises, by mass, 20-30% of paste forming agent, 50-70% of solvent and 2-5% of thixotropic agent. According to the silver-copper-titanium active soldering paste, titanium hydride is added to metal mixed powder of the brazing powder so that hydrogen can be released in the brazing process and have reduction and protection effects on welding; meanwhile, the titanium activates the surface of ceramic so that metal and the ceramic can be subjected to brazing, and the temperature of brazing is lowered to 850 DEG C, so that the influence of high temperature on metal performance is reduced, and meanwhile the technology cost is also lowered.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a silver-copper-titanium active solder paste. Background technique [0002] Ceramic materials have unique characteristics of oxidation resistance, corrosion resistance, high temperature resistance, high hardness and wear resistance, high strength, and good insulation. However, ceramics have poor toughness and it is difficult to create complex components. Usually, brazing is used. Combining ceramics and ceramics, ceramics and metal materials to better play the superiority of ceramics. [0003] But pottery is difficult to be wetted by general metal material, so the brazing method of pottery that the prior art adopts is divided into two kinds: a kind of is indirect welding, and a kind of is direct welding. Indirect welding, most of them use Mo-Mn method, chemical coating method, thick film and thin film technology to form a metallized layer on the ceramic surface. However, the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/14B23K35/363
CPCB23K35/025B23K35/3006B23K35/3616B23K35/362B23K2103/52
Inventor 陈卫民易丹
Owner GUANGZHOU XIANYI ELECTRONICS TECH
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