8results about How to "Lower peak temperature" patented technology

The utility model relates to the technical field of mobile phone heat dissipation films, in particular to a high-heat-conduction mobile phone middle frame graphite heat dissipation film which comprises a heat dissipation film body, the heat dissipation film body sequentially comprises matte black single-faced adhesive tape, a high-heat-conduction graphite layer and double-faced adhesive tape from top to bottom, the high-heat-conduction graphite layer is formed by stacking low-temperature carbonization layers and is 0.2 mm in thickness, and the high-heat-conduction graphite layer is formed by stacking low-temperature carbonization layers. The low-temperature carbonization layer is formed by graphene through low-temperature carbonization treatment, the heat conductivity coefficient reaches 2000-2100 W / M.K, energy consumption is reduced through low-temperature treatment, the production cost is indirectly reduced due to the low temperature requirement, the graphene is subjected to low-temperature carbonization treatment, the lattice defect density is reduced, and the stability of the heat conductivity coefficient is ensured; and meanwhile, the 0.2 mm high-thermal-conductivity graphite layer is formed by stacking the low-temperature carbonization layers, so that the occupied space of the heat dissipation film body in the middle frame is reduced.

The application discloses an optimization method of integrated micro-modules based on complex power distribution, and relates to the technical field of integrated circuit thermal management, comprising the following steps: constructing a power distribution characteristic matrix by multi-physical field coupling analysis based on a structured data set, and generating micro-channel geometric parameters by using a gradient descent algorithm; constructing a structure thermal conduction efficiency mapping model, combining the micro-channel geometric parameters to obtain flow channel cross-section thermal resistance characteristic change data, and outputting a thermal conduction efficiency optimization matrix; extracting thermal resistance distribution characteristics in the thermal conduction efficiency optimization matrix, combining the flow channel cross-section thermal resistance characteristic change data to generate a collaborative optimization parameter instruction; obtaining thermal power distribution characteristics by executing the collaborative optimization parameter instruction, calculating an equivalent thermal resistance gradient, and obtaining a heat dissipation efficiency regulation and control instruction through dynamic mapping. By constructing the structure thermal conduction efficiency mapping model, real-time prediction of the micro-channel geometric parameters to thermal performance is realized, the efficiency is improved, and the global performance optimization is ensured.

The application provides a kind of high efficiency DC-DC power module of power saving type for tractor, it is related to power module technical field, including substrate, DC-DC power module, top plate, air-cooled heat sink and at least one heat conducting piece.The application, by setting heat conducting piece between the heat generating element of DC-DC power module and top plate, the equivalent thermal conductivity of the heat conducting piece from first end (heat source end) to second end (top plate end) shows decreasing trend;It is realized that the equivalent thermal conductivity is high near the heat generating element, the heat can be quickly exported from heat source, avoid heat accumulation to cause element junction temperature too high;With the heat transfer along the heat conducting piece to top plate direction, the equivalent thermal conductivity gradually reduces, and the heat flow transmission capacity weakens, to make heat more dissipate through the side wall of heat conducting piece to the surrounding environment (especially the airflow driven by air-cooled heat sink).

The application discloses a low-density corrosion-resistant thin-gauge high-aluminum medium-manganese steel, and chemical components and mass percentages of the low-density corrosion-resistant thin-gauge high-aluminum medium-manganese steel include the following: C: 0.1-0.4%, Mn: 3-12%, Al: 2-5%, and the balance of Fe and inevitable impurities. The application has the advantages that a stirring friction processing method is used to introduce a microstructure feature of a phase and a grain size in a matrix in a gradient distribution into the medium-manganese steel, so that the surface modification purpose is achieved, and then the corrosion resistance is effectively improved.

The invention aims to provide a W-shaped boiler burner based on pulverized coal particle size separation, belongs to the technical field of pulverized coal combustion, and can solve the problems that coarse pulverized coal particles are located on the periphery of the burner and fine pulverized coal particles are located in the center due to airflow rotation inertia of the W-shaped boiler burner; and the problems of delayed pulverized coal ignition, low combustion efficiency, high NOx emission and the like are solved. A vertical downward injection type structure is adopted, and a cross deflection flow guide structure is arranged in the combustor, so that pulverized coal is finally distributed at a contraction nozzle of the combustor in the mode of'centralized injection of center coarse powder and coating of outer layer fine powder '. By means of the structure, fine pulverized coal can be preferentially ignited in a hearth with the low temperature to establish a stable high-temperature field, central coarse-particle pulverized coal is promoted to be completely burnt out, the burning stability of inferior coal and wide-particle-size pulverized coal is remarkably improved, and the loss of unburnt carbon and the generation amount of NOx are effectively reduced.

This invention relates to the field of chemical mechanical polishing (CMP) pad technology, specifically to a highly hydrophilic and wear-resistant CMP polishing pad, its preparation method, and its application. The invention uses cyanosiloxane monomers as raw materials, preparing highly active carboxylate silsesquioxane powder through one-step alkaline hydrolysis, and achieving nanoscale uniform dispersion of this powder in polyurethane. After pre-treating the base fabric with an acid-base oscillating impregnation agent, the nanoscale uniformly dispersed slurry is coated onto the base fabric, and then solidified to obtain the target product. This invention solves the technical problems of difficulty in balancing hydrophilicity and wear resistance, and poor polishing uniformity in existing hydrophilic modification polishing pads. The polishing pad produced is used for wafer polishing, exhibiting less than 3% intra-wafer non-uniformity, fewer surface defects, and extended service life. The process of this invention is fully compatible with existing wet production lines for polyurethane polishing pads, requiring no additional equipment. The process is simplified, batch stability is strong, and industrial mass production is possible, adapting to the high-precision, low-defect polishing requirements of advanced semiconductor processes below 14nm.

The present disclosure provides a soft package battery, a battery device and a power utilization device. The soft package battery comprises a soft package battery core body and a shell. The soft package battery core body is arranged in the shell. The shell is provided with a weak area which melts or ruptures before other areas of the shell when the soft package battery core body has thermal runaway, so as to serve as a pressure relief structure of the soft package battery. Through the above structural design, the present disclosure can increase the area of the region where the shells of adjacent soft package batteries contact each other, greatly improve the heat conduction efficiency, and can regulate the temperature of the internal battery by heating or cooling the shell of the peripheral battery after grouping. The present disclosure can realize the directional spray valve of the soft package battery, and reduce the possibility of thermal runaway spreading between adjacent battery devices. By utilizing the good heat conduction performance of the shell itself, the heat dissipation can be accelerated, the peak temperature of the thermal runaway battery can be reduced, and the heat conduction to the rear battery can be accelerated, thereby reducing the heat absorption of the battery adjacent to the thermal runaway battery.

The application discloses a kind of chip thermal risk pre-judgment and active thermal management method and related equipment, including in training phase according to the first chip is collected to obtain time shift training sample according to prediction lead time, using time shift training sample to train thermal state prediction model, in prediction phase second chip is surface thermal map collection and obtains second surface thermal map sequence, second surface thermal map sequence is input to the thermal state prediction model and is handled to obtain thermal state prediction value, according to the thermal state prediction value, second chip is carried out thermal risk pre-judgment and active thermal management etc. Step.The application can output early warning result before future internal thermal risk occurs, and control action is executed in advance, therefore, can reduce internal temperature out-of-range times, reduce hotspot peak temperature, and relieve reliability risk caused by control action lag, can more accurately judge future internal thermal risk.The application is widely applied in chip thermal management technical field.