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Reflow soldering method for improving device thermal expansion deformation

A technology of reflow soldering and thermal expansion, which is applied in the direction of welding equipment, tin feeding devices, auxiliary devices, etc., to reduce the peak temperature, widen the PWI, and avoid the effects of virtual soldering and deformation

Active Publication Date: 2019-04-12
HUIZHOU GUANGHONG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a reflow soldering method that improves thermal expansion and deformation of devices, which can effectively reduce soldering problems caused by thermal expansion of devices

Method used

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Embodiment Construction

[0020] The present invention will be described in further detail below in conjunction with specific embodiments.

[0021] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications without creative contribution to this embodiment according to needs after reading this description, but as long as they are within the protection of the present invention are protected by patent law.

[0022] In a preferred embodiment, a reflow soldering method for improving thermal expansion and deformation of devices of the present invention includes the following steps:

[0023] A. Prepare the SMT stencil, print solder paste on the PCB board through the SMT stencil, and send the printed PCB board with solder paste into the placement machine for SMT placement;

[0024] B. Put the mounted PCB board into the reflow soldering furnace, and pass heated nitrogen gas into the reflow solder...

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Abstract

The invention discloses a reflow soldering method for improving device thermal expansion deformation. The reflow soldering method comprises the following steps: an SMT steel net is prepared, solder paste is printed for a PCB through the SMT steel net, and the PCB printed with the solder paste is sent into a placement machine to be subjected to SMT placement; the PCB subjected to placement is put into a reflow furnace, and heated nitrogen is introduced into the reflow furnace; primary heating is conducted, and the heating speed is smaller than or equal to 2 DEG C / s; heat preservation is conducted, the rotating speed of a fan at an upper air opening is increased, and the rotating speed of a fan at a lower air opening keeps unchanged; secondary heating is conducted, and the heating speed is smaller than or equal to 2 DEG C / s; reflow soldering is conducted; temperature decreasing for cooling is conducted, and soldering is completed; and subsequent detecting is conducted. The peak value temperature of reflow soldering can be lowered, thus the process window index (PWI) is increased, the good soldering hot melting effect is generated, the temperature difference between components and thePCB is reduced, and the problems of pseudo soldering and deformation caused by the too large temperature difference are avoided.

Description

technical field [0001] The invention relates to circuit board patch technology, in particular to a reflow soldering method for improving thermal expansion and deformation of devices. Background technique [0002] Due to the continuous miniaturization of PCB boards of electronic products, traditional welding methods can no longer meet the needs. Reflow soldering is to realize the mechanical and electrical connection between the surface mount component solder terminal or pin and the printed board pad by remelting the cream solder that is pre-distributed on the printed board pad. With the continuous maturity and development of technology, the application of reflow soldering technology and equipment is becoming more and more extensive, and has been applied in almost all electronic product fields. [0003] In actual production, due to the variety of materials of components and PCB boards, and the specific heat capacity and thermal expansion coefficient of different materials are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K3/06B23K3/08
CPCB23K1/008B23K3/0607B23K3/08B23K3/085
Inventor 张龙叶更青
Owner HUIZHOU GUANGHONG TECH CO LTD
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