64results about How to "Improve soldering effect" patented technology

The invention relates to the technical field of soldering pastes, in particular to a halogen-free tin-bismuth-copper soldering paste and a preparation method thereof. A soldering flux of the halogen-free tin-bismuth-copper soldering paste consists of the following components in percentage by weight: 20 to 40 percent of polymerized rosin, 1 to 6 percent of rosin amine, 4 to 8 percent of thixotropic agent, 5 to 10 percent of organic acid, 5 to 10 percent of organic amine, 1 to 5 percent of antioxidant, 0.5 to 3 percent of surfactant and an organic solvent. The halogen-free tin-bismuth-copper soldering paste is mainly characterized by adopting the organic acid and the organic amine serving as activating agents and comprising no halogens at all, so not only the solderability is not reduced, but also the expansion rate and the insulation resistance value of the soldering paste are improved, and simultaneously the corrosivity of residues after soldering to a base material is reduced and the service life of the soldering paste is prolonged; and particularly, the peak temperature of the soldering paste during soldering is lower in favor of reducing the thermal damages to electronic components.

The invention discloses a soldering metal replacement no lead welding scaling powder for aluminum and aluminum alloy, which is composed of the following weight proportions: 5 to 50 percent of metal salt that can be reduced by the aluminum, 10 to 15 percent of stripper, 3 to 40 percent of wetting agent, 3 to 20 percent of activating agent, 1 to 15 percent of surface active agent, 2 to 20 percent of inhibiter and a carrier with the rest percent. The invention has an extremely excellent matching effect with a lead-free solder in the welding temperature and is suitable for being made into a welding stick or a welding paste with the lead-free solder. After welding, the invention has a high welding intensity and a good expansion rate, belongs to an environment protection scaling powder, and has the function of inhibition protection on the aluminum and aluminum alloy as well as a simple and practical preparing method. Undoubtedly, the embodiment can also be used for the no lead soldering on the materials like stainless steel, galvanized iron, copper and copper alloy, etc., and bear the same effects as well.

A terminal (1) for an electrical connector includes a flat soldering portion (11), a flexed portion (12) extending from the soldering portion, and a contacting portion (14) extending upwardly from the flexed portion. The soldering portion has a soldering face (111) and the connecting portion extends away from the soldering face. A rectangular overflowing aperture (120) extends through a centre of the flexed portion. Thus, the terminal is securely soldered on a printed circuit board to thereby achieve a reliable electrical connection between the terminal and the printed circuit board.

The invention discloses a PCB or package substrate chemical nickel gold production new process. The new process comprises the steps of chemical gold pretreatment, deoiling, micro-etching, activation,alkaline chemical nickel, nickel activation, acid chemical nickel, chemical gold, gold surface hole sealing and chemical gold aftertreatment. The invention further provides novel chemical nickel plating liquid. The process is low in nickel cylinder temperature and high in chemical nickel deposition speed; nickel simple substances are difficultly separated out from the wall of a chemical nickel plating liquid stabilizing tank; the horizontal production of chemical nickel gold can be realized; a production line is shortened; the emission of waste water is reduced; and the comprehensive production cost of the production line is reduced. In the novel chemical nickel plating liquid, through adjustment of types of complexing agents and stabilizing agents in the chemical nickel plating liquid, even if under the conditions of higher PH and higher deposition speed, higher P content is achieved to meet various performance requirements of existing chemical nickel gold for the surface treatment ofPCBs and package substrates.

The invention relates to a lead-free environmentally friendly soldering flux and a preparation method thereof. The method comprises the following steps of: mixing synthetic organic acid, an activating agent and a mixed alcohol solvent at normal temperature according to a component formula; pouring an obtained mixture into a stainless steel container, and then adding modified rosin particles; stirring materials in the container until the rosins are all dissolved, and then stopping stirring; and standing still, filtering and hermetically packaging to obtain a soldering flux product. The lead-free environmentally friendly soldering flux is a no-clean soldering flux with low solid content, less rosin and no halide, has the characteristics of quick dry, bright and firm welding spot, uniform spreading, full structure, no corrosivity, excellent solderability, good soldering wetting, stable property, and the like, conforms to the property requirements of various electrical appliances and is suitable for soldering computers and peripheral equipment or high-precision multilayer board electronic assemblies. When in use, the soldering flux product has the advantages of low smoke, no pollution to working environment, no influence on the human health, no pollution to tracks and clamps of a tinning furnace, higher insulating impedance, good environment friendly performance and stronger market competitiveness.

An electrical connector that includes: an insulating body, having a plurality of receiving holes disposed thereon, a plurality of solder balls, respectively received in one of the receiving holes, a plurality of terminals, in which each terminal has a base correspondingly received in one of the receiving holes, a first extending portion and a second extending portion extend downwards from the base, a first hook extends laterally from an end of the first extending portion, a second hook extends laterally from an end of the second extending portion, and the first hook and the second hook respectively hook a periphery of the solder ball under a horizontal center line of the solder ball.

The invention relates to the technical field of transformer production, in particular to an automatic tin scraping machine and a tin soldering device. The automatic tin scraping machine structurally comprises a time relay, a first air cylinder, a second air cylinder and a tin scraping mechanism, wherein the first air cylinder and the second air cylinder are controlled by the time relay, and the tin scraping mechanism is connected with the second air cylinder in a driving mode. The first air cylinder is connected with the second air cylinder in a driving mode and enables the second air cylinder to do lifting motion to drive the tin scraping mechanism to do lifting motion. The second air cylinder is provided with a second air cylinder rod and a second air cylinder plain shaft, and the second air cylinder rod and the second air cylinder plain shaft are connected with the tin scraping mechanism and enable the tin scraping mechanism to do horizontal motion. The tin soldering device comprises a machine frame, a tin smelting furnace arranged on the machine frame and the automatic tin scraping machine. The automatic tin scraping machine has the advantages that the tin scrapping movement is standard, the labor intensity is low, the tin scrapping effect is ideal and the production efficiency is high. The tin soldering device has the advantages that the tin soldering time and the tin soldering height are standard and the tin scrapping effect is good.

The invention provides a soldering flux of colophony compound (A) containing a metal content below 50ppm and having a conductivity below 1.0uS/cm when being produced into 20% ethanol solution by weight. The invention also provides a soldering paste containing the soldering flux.

The invention provides no-clean soldering flux which comprises, by mass, 1%-4% of organic acid activating agents, 0.5%-3% of non-ionic surface active agents, 0.1%-3% of antioxidants, 0.005%-0.02% of modified rosin and the balanced organic solvents. The invention further provides a preparation method of the no-clean soldering flux. The preparation method includes the steps of melting the modified rosin, sequentially adding the organic acid activating agents, the non-ionic surface active agents, the antioxidants and the organic solvents, evenly stirring the mixture, naturally cooling the mixture, filtering the mixture, and obtaining the no-clean soldering flux. According to the no-clean soldering flux, dilution and dilution control are not required, direct use can be achieved, heavy metal is not contained, and residues do not exist. The no-clean soldering flux has the advantages of being high in drying speed, bright and firm in soldering point, even in spreading, full in structure, free of corrosiveness, excellent in solderability, good in soldering smoothing performance, stable in performance and the like.

The invention provides a method for producing environment-friendly lead-free electroless nickel immersion gold. The method comprises the following steps of: etching a line, and treating a circuit board by using solder mask ink; performing pretreatment, namely polishing and brushing or blasting sand; placing the circuit board in an oil removal trough and treating for 5 minutes; washing by using tap water and conveying into a microetching trough for 2 minutes; washing by using deionized water, and feeding into a preimpregnation trough for 1 minute; directly feeding into an activation trough and treating for 1 minute; washing by using the deionized water, and treating in chemical nickel at the temperature of 80 DEG C for 20 minutes; and washing by using the deionized water, and treating in immersion gold which is prepared from 10 percent KOZO 806 and citric acid gold with density of 2g/L. By the method, the technical problem that the conventional production method is not environment-friendly can be solved; lead in the chemical nickel is replaced and is totally environment-friendly; and the condition that tin is not soldered well can be avoided. The toxic potassium aurous cyanide in the immersion gold is replaced, and the immersion gold is totally environment-friendly; and a solution is stable and is prevented from being decomposed.

The invention discloses a soldering machine for manganese-copper terminals. The soldering machine for the manganese-copper terminals comprises a body which comprises a control box, a base, a first transfer motor and a second transfer motor. The base is arranged under the body; the control box is arranged on the surface of the base, and a rosin feeding work table is arranged on the left side of the control box; a manual discharging table is arranged on the right side of the rosin feeding work table; the first transfer motor is arranged above the rosin feeding work table; the second transfer motor and a third transfer motor are arranged on the left side of the first transfer motor; the output portions of the first transfer motor, the second transfer motor and the third transfer motor are connected with a transfer mechanism; a soldering furnace is arranged on the left side of the rosin feeding work table; buffering rails are arranged on the upper portion of the soldering furnace and comprise the first buffering rail and the second buffering rail; and a discharging rail is arranged on the left side of the soldering furnace. The soldering machine for the manganese-copper terminals has the advantages of being reasonable in structural design, convenient to use, good in soldering effect and the like.

The invention discloses a production method and products of metal exposed terminals. The production method includes: making the metal exposed terminals by new manufacturing process, namely plating a functional area of metal alloy with Au, plating a weld leg area with metal for enhancing solderability. In other words, the metal for enhancing solderability replaces part of plated Au, and a layer of black Ni is plated on the surface of the metal alloy plated with the Au and the metal for enhancing solderability by rack plating. Therefore the function and appearance requirements of the metal exposed terminals are met, production efficiency of the metal exposed terminals is improved, the cost is lowered, and benefit is created. According to related production and applications, the treatment cost of the metal exposed terminals can be reduced by about 50% by improving the production efficiency and saving precious metals.

The invention relates to a cable weaving tin dipping device which comprises a base, a support, a tray, a location carrier, a tin furnace and a plurality of cylinders. The support is installed on the base, the tin furnace is arranged on the base and used for containing a tin material, the tray is installed on the support and used for placing a cable, the location carrier is located under the tray and used for clamping and fixing the cable, the tail of the cable stretches downwards out of the location carrier, and the weaving portion on the tail is exposed to the outer portion. The device is characterized by further comprising a tin spoon located above the tin furnace and connected with one cylinder, the tin spoon is located in a tin material in the tin furnace, the tin spoon can move upwards out of the tin furnace under the driving of the cylinder, the location carrier is connected with another cylinder, the cylinder can drive the location carrier to move downwards to drive the tail portion of the cable to be immersed into the tin material of the tin spoon and then move upwards out of the tin spoon, the tin spoon contains the tin material of identical quantity every time, and the tin dipping length of the front and the back of the cable is consistent.

The invention relates to a welding system of a relay coil processing device, and relates to the field of relay production equipment. The welding system of the relay coil processing device comprises a rack, wherein a rotating shaft is rotatably assembled on the rack; multiple clamping mechanisms are arranged on the rotating shaft at intervals in the circumferential direction; a semi-bending mechanism, a soldering flux dipping mechanism, a tinning mechanism, a flattening mechanism and a discharging detection mechanism are sequentially arranged on the periphery of the rotating shaft of the rack; the semi-bending mechanism comprises a first base, a first abutting plate, bending rollers, a plate power piece and a roller power piece; the first base is arranged on the rack; the plate power piece is arranged on the first base; the first abutting plate is arranged at the output end of the plate power piece so as to be driven to abut against coils on the clamping mechanisms; the roller power piece is arranged on the first base; the bending rollers are arranged at the output end of the roller power piece so as to be driven to bend pins on the coils into a half-bent state; and the pins are bent flatly in two times and are not prone to being broken, so that the welding system of the relay coil processing device has the effect of being high in yield of coil production.

The embodiment of the invention relates to a packaging substrate and a manufacturing method thereof. According to the packaging substrate in one embodiment, the packaging substrate comprises a circuittop layer, a circuit bottom layer, a first insulating layer and at least one stepped inclined side surface, wherein the first insulating layer is located between the circuit top layer and the circuitbottom layer; and the stepped inclined side surface is provided with a first stepped inclined side surface extending from the circuit top layer to the first insulating layer and a second stepped inclined side surface extending from the first insulating layer to the circuit bottom layer. According to the packaging substrate and the manufacturing method thereof provided by the embodiment of the invention, the soldering tin performance of the packaging substrate can be effectively evaluated from the appearance.

The invention relates to an automatic tin soaking machine special for tin soaking of an induction transformer. At present, no tin soaking machine suitable for conducting tin soaking operation on induction transformers exists. The automatic tin soaking machine comprises a machine frame, a tin melting device, a scaling powder holding device, induction transformer input devices, an induction transformer output device and an induction transformer grabbing and tin soaking device. The automatic tin soaking machine is characterized in that the automatic tin soaking machine further comprises a tin slag lead-in piece, a tin slag collecting trough, a collecting trough supporting platform and a collecting trough limiting bar; a tin slag outlet is formed in a tin furnace body, and the upper portion of the tin slag lead-in piece is fixed to the furnace wall, provided with the tin slag outlet, of the tin furnace body; the lower portion of the tin slag lead-in piece makes contact with the inner wall of the tin slag collecting trough; and the tin melting device, the scaling powder holding device, the induction transformer output device and the induction transformer input devices are sequentially arranged in the horizontal direction. The automatic tin soaking machine can efficiently, completely and effectively scrape tin slag in a tin melting cavity into the tin slag collecting trough.