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Lead-free environmentally friendly soldering flux and preparation method thereof

A flux and environmental protection technology, applied in the field of preparation of solder flux, can solve the problems of decreased electrical insulation performance, decreased production efficiency, increased production cost, etc., and achieves the effects of excellent solderability, improved production efficiency, and stable performance.

Inactive Publication Date: 2012-06-27
DANFENG RONGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronics industry and the improvement of people's awareness of environmental protection, lead-free solders are more and more widely used in the electronics industry. However, compared with traditional tin-lead solders, currently known lead-free solders also have some shortcomings and deficiencies. Its main manifestations are: ①. Existing lead-free solder residues contain a large amount of halogen ions, which will cause a decrease in electrical insulation performance, resulting in failure problems such as short circuits and open circuits; ②. Stronger, more residues, there are some potential adverse effects on the mechanical properties and electrical properties of the product, and cleaning a large amount of rosin residues leads to increased production costs and decreased production efficiency; ③, most of the solvents in the existing lead-free solder Use ethanol, methanol and other alcohols with low boiling points as solvent carriers, which will form photochemical smog, cause transportation difficulties and air pollution, easily cause fires, and have poor safety performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An embodiment of the present invention is made of raw materials containing the following mass percentages:

[0019] Polymerized rosin 0.005%,

[0020] Hydrogenated rosin 0.006%,

[0021] Succinic acid 0.5%,

[0022] Salicylic acid 0.4%,

[0023] Malic acid 0.599%,

[0024] Polyoxyethylene octylphenol ether 1.3%,

[0025] Diethylene glycol 50%,

[0026] Glycerol 47.19%.

[0027] The preparation process of the flux is: the polymerized rosin and hydrogenated rosin are pulverized by an X7-D small pulverizer, the pulverization fineness is 20-80 mesh, and the pulverization is once per 500 grams. The organic synthetic acid is pulverized at room temperature. Activator and mixed alcohol solvent are mixed according to the component formula ratio, poured into a stainless steel container, and then polymerized rosin and hydrogenated rosin powder are added to stir, stir until all the rosin is dissolved, then stop stirring, let stand for 4-6 hours, using 30 tablets The stainless steel plate and f...

Embodiment 2

[0029] An embodiment of the present invention is made of raw materials containing the following mass percentages:

[0030] Polymerized rosin 0.002%,

[0031] Hydrogenated rosin 0.003%,

[0032] Water white rosin 0.005%,

[0033] Oxalic acid 0.6%,

[0034] Succinic acid 0.5%,

[0035] Sorbic acid 0.5%,

[0036] Isooctylphenol polyoxyethylene ether 1.19%,

[0037] Ethylene glycol 48.5%,

[0038] Glycerol 48.7%.

[0039] The preparation method is the same as in Example 1.

Embodiment 3

[0041] An embodiment of the present invention is made of raw materials containing the following mass percentages:

[0042] Polymerized rosin 0.01%,

[0043] Oxalic acid 0.6%,

[0044] Salicylic acid 0.6%,

[0045] Sorbic acid 0.4%,

[0046] Fatty alcohol polyoxyethylene ether 1.39%,

[0047] Diethylene glycol 49.3%,

[0048] Glycerol 47.7%.

[0049] The preparation method is the same as in Example 1.

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PUM

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Abstract

The invention relates to a lead-free environmentally friendly soldering flux and a preparation method thereof. The method comprises the following steps of: mixing synthetic organic acid, an activating agent and a mixed alcohol solvent at normal temperature according to a component formula; pouring an obtained mixture into a stainless steel container, and then adding modified rosin particles; stirring materials in the container until the rosins are all dissolved, and then stopping stirring; and standing still, filtering and hermetically packaging to obtain a soldering flux product. The lead-free environmentally friendly soldering flux is a no-clean soldering flux with low solid content, less rosin and no halide, has the characteristics of quick dry, bright and firm welding spot, uniform spreading, full structure, no corrosivity, excellent solderability, good soldering wetting, stable property, and the like, conforms to the property requirements of various electrical appliances and is suitable for soldering computers and peripheral equipment or high-precision multilayer board electronic assemblies. When in use, the soldering flux product has the advantages of low smoke, no pollutionto working environment, no influence on the human health, no pollution to tracks and clamps of a tinning furnace, higher insulating impedance, good environment friendly performance and stronger market competitiveness.

Description

Technical field [0001] The invention belongs to the technical field of solder flux preparation, and relates to a lead-free environmental protection suitable for soldering electronic components such as electronics, electrical engineering, printed circuit boards, aerospace industry, military industry, household appliances and other products that require high quality reliability. Flux and its preparation method. Background technique [0002] With the rapid development of the electronics industry and the improvement of people’s awareness of environmental protection, lead-free solders are more and more widely used in the electronics industry. However, currently known lead-free solders also have some shortcomings and deficiencies compared with traditional tin-lead solders. The main manifestations are: ①, the existing lead-free solder residue contains a large amount of halogen ions, which will cause the electrical insulation performance to decrease, and cause failure problems such as sh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
Inventor 徐保田陈元星李宏涛
Owner DANFENG RONGYI ELECTRONICS
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