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Water-based halogen-free resin-free antimicrobial no-clean soldering flux

A no-clean, flux technology

Inactive Publication Date: 2014-05-14
SUZHOU LOTTE CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] General water-based, halogen-free, rosin-free, no-clean fluxes do not include antibacterial ingredients, which have certain dangerous ingredients to the human body, and fluxes without antibacterial agents also have certain limitations in terms of solder oxidation and quality control.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0027] 20 parts of activator, 4 parts of surfactant, 4 parts of film former, 0.08 part of corrosion inhibitor, 1 part of antioxidant, 0.5 part of antibacterial agent, 0.4 part of organic solvent and the balance of deionized water.

[0028] Wherein, the activator is compounded with DL-malic acid, succinic acid, phthalic acid, citric acid and lactic acid in a mass ratio of 2:1:0.5:1:1;

[0029] The surfactant is a mixture of fatty acid methyl ester ethoxylate and isomeric tridecyl alcohol ethoxylate with a mass ratio of 1:1;

[0030] The corrosion inhibitor is benzotriazole (BTA);

[0031] Described antioxidant is t-butyl hydroquinone;

[0032] The film-forming agent is a mixture of anionic polyacrylamide and polyethylene glycol 3000 with a mass ratio of 1:2;

[0033] Described organic solvent is the mixture that absolute ethanol, acetamide and ethylene glycol ether are compounded with a mass ratio of 1:2:2;

[0034] The antibacterial agent is chitin.

Embodiment

[0036] Make 100g of flux, by mass, including 20 parts of activator (DL-malic acid, succinic acid, phthalic acid, citric acid and lactic acid are compounded at a mass ratio of 2:1:0.5:1:1) ; 4 parts of surfactant (fatty acid methyl ester ethoxylate and isomeric tridecyl alcohol ethoxylate mixed in a mass ratio of 1:1); 4 parts of film forming agent (anionic polyacrylamide and polyethylene glycol 3000 mixed with a mass ratio of 1:2); corrosion inhibitor (benzotriazole BTA) 0.08 parts; antioxidant (tert-butyl hydroquinone) 1 part; antibacterial agent (chitin) 0.5 part, 0.4 part of organic solvent (a mixture of absolute ethanol, acetamide and ethylene glycol ether in a mass ratio of 1:2:2); the balance is deionized water;

[0037] Weigh the raw materials of each component according to the weight ratio. At room temperature, add the co-solvent into a clean enamel kettle with stirring, first add the insoluble raw materials, stir for half an hour, then add other raw materials in turn,...

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PUM

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Abstract

The invention discloses a water-based halogen-free resin-free antimicrobial no-clean soldering flux. The soldering flux comprises, by weight, 9-25 parts of activating agents, 1-5 parts of surface active agents, 1-5 parts of film-forming agents, 0.01-0.08 part of corrosion inhibitor, 0.1-1 part of antioxidant, 0.5-1 part of antibacterial agent, 0.1-0.5 part of organic solvent and the balance deionized water. The activating agents comprise at least two kinds of DL-malic acid, succinic acid, glutaric acid, adipic acid, phthalic acid, citric acid and lactic acid; the surface active agents comprise at least one of fatty acid methyl ester ethoxylate or isomerism tridecane alcohol ethoxylate, the corrosion inhibitor comprises at least one of benzotriazole (BTA) and triethylamine, and the antibacterial agent is chitosan. Through the mode, the water-based halogen-free resin-free antimicrobial no-clean soldering flux has the advantages of being free of resin and halogen, low in solid content, good in wettability, low in cost and good in stability.

Description

technical field [0001] The invention relates to the field of soldering flux, in particular to a water-based halogen-free and rosin-free antibacterial no-cleaning flux. Background technique [0002] General water-based halogen-free rosin-free antibacterial no-clean flux uses APEO as the composition of surfactant, APEO includes nonylphenol polyoxyethylene ether (NPEO), octylphenol polyoxyethylene ether (OPEO), dodecane Dinonylphenol polyoxyethylene ether (DPEO) and dinonylphenol polyoxyethylene ether (DNPEO), among which the widely used emulsifier OP is also a kind of APEO, APEO will cause serious harm to the ecological environment, including toxicity Large, difficult to biodegrade, environmental hormones and harmful by-products produced in the production process, etc., people are gradually looking for its substitutes for the configuration of flux. [0003] General water-based, halogen-free, rosin-free, no-clean fluxes do not include antibacterial ingredients, which have cert...

Claims

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Application Information

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IPC IPC(8): B23K35/362
CPCB23K35/3613B23K35/362
Inventor 杨伟帅
Owner SUZHOU LOTTE CHEM TECH
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