Water-base halogen-free no-clean scaling powder used for lead-free solder
A lead-free solder, water-based technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems affecting circuit board insulation, corrosion resistance, potential safety hazards of electronic products, smoke and irritating odors and other problems, to achieve the effects of good wettability and anti-oxidation performance, low solid content and long protection period
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Embodiment 1
[0032] Water-based halogen-free no-cleaning flux for lead-free solder, its components and weight percentages are:
[0033] Succinic acid 1.0%, sebacic acid 1.0%, diethanolamine 0.5%, triethanolamine 0.5%, acetamide 12%, AEO-12 0.5%, benzothiazole 0.1%, benzimidazole 0.1%, PEG-600 5.0% , allicin 0.25%, deionized water 79.05%.
Embodiment 2
[0035] Water-based halogen-free no-cleaning flux for lead-free solder, its components and weight percentages are:
[0036] Glutaric Acid 2.0%, Sebacic Acid 4.0%, Lauric Acid 2.0%, Monoethanolamine 0.5%, Acetamide 8.0%, AEO-15 0.1%, Triethylamine 0.8%, PEG-1000 2.0%, Allicin 0.05%, Deionized water 80.55%.
Embodiment 3
[0038] Water-based halogen-free no-cleaning flux for lead-free solder, its components and weight percentages are:
[0039] Sebacic acid 1.0%, Lauric acid 1.0%, Salicylic acid 2.0%, Itaconic acid 1.0%, Monoethanolamine 0.3%, Diethanolamine 0.5%, Formamide 9%, Acetamide 16%, AEO-18 1.0%, Benzene And imidazole 0.3%, triethylamine 0.3%, PEG-1500 4.0%, allicin 0.15%, deionized water 63.45%.
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