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Water-base halogen-free no-clean scaling powder used for lead-free solder

A lead-free solder, water-based technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems affecting circuit board insulation, corrosion resistance, potential safety hazards of electronic products, smoke and irritating odors and other problems, to achieve the effects of good wettability and anti-oxidation performance, low solid content and long protection period

Inactive Publication Date: 2013-04-17
郴州金箭焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional rosin-based flux has stable performance and reliable effect, but as a low-boiling solvent, it is volatile at the flux temperature, producing smoke and pungent odor, and there are obvious rosin residues on the substrate, which affects the insulation of the circuit board. Corrosion resistance, etc., bring certain safety hazards to electronic products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Water-based halogen-free no-cleaning flux for lead-free solder, its components and weight percentages are:

[0033] Succinic acid 1.0%, sebacic acid 1.0%, diethanolamine 0.5%, triethanolamine 0.5%, acetamide 12%, AEO-12 0.5%, benzothiazole 0.1%, benzimidazole 0.1%, PEG-600 5.0% , allicin 0.25%, deionized water 79.05%.

Embodiment 2

[0035] Water-based halogen-free no-cleaning flux for lead-free solder, its components and weight percentages are:

[0036] Glutaric Acid 2.0%, Sebacic Acid 4.0%, Lauric Acid 2.0%, Monoethanolamine 0.5%, Acetamide 8.0%, AEO-15 0.1%, Triethylamine 0.8%, PEG-1000 2.0%, Allicin 0.05%, Deionized water 80.55%.

Embodiment 3

[0038] Water-based halogen-free no-cleaning flux for lead-free solder, its components and weight percentages are:

[0039] Sebacic acid 1.0%, Lauric acid 1.0%, Salicylic acid 2.0%, Itaconic acid 1.0%, Monoethanolamine 0.3%, Diethanolamine 0.5%, Formamide 9%, Acetamide 16%, AEO-18 1.0%, Benzene And imidazole 0.3%, triethylamine 0.3%, PEG-1500 4.0%, allicin 0.15%, deionized water 63.45%.

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Abstract

The invention discloses a water-base halogen-free no-clean scaling powder used for lead-free solder. The water-base halogen-free no-clean scaling powder used for lead-free solder comprises, by weight, organic acid activating agent 2.0%-8.0%, alkyl alcohol amine 0.5-1.0%, cosolvent 8-25%, surface active agent 0.1-1.0%, corrosion inhibitor 0.2-0.8%, film-forming agent 2.0-5.0%, antibacterial agent 0.05-0.25%, and the balance deionized water. The scaling powder is long in term of protection, free of rosin and halogen, low in solid content and good in wettability, no residual is left after welding, requires not cleaning, is full and bright in welding points, and has no corrosion in copper mirror test; and surface insulation resistance of a substrate is larger than 108 Omega, and the substrate is low in cost, good in reliability and suitable for electronic material lead-free solder.

Description

technical field [0001] The invention relates to the field of PCB welding in the electronics industry, in particular to a water-based halogen-free cleaning-free flux for lead-free solder. Background technique [0002] In the soldering of electronic materials, the widespread use of lead-free solders has increased the requirements for its matching flux. The quality of soldering flux directly affects the entire production process and product quality of electronic technology. It removes the oxide layer on the surface of the metal substrate, promotes the flow and diffusion of solder, affects the surface tension of solder and controls its diffusion. How to improve the high-temperature activity, safety and environmental protection of the flux, ensure the soldering performance and eliminate the post-soldering cleaning work has become the main goal of the research. [0003] The traditional rosin-based flux has stable performance and reliable effect, but as a low-boiling solve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362
Inventor 李曼娇胡洁
Owner 郴州金箭焊料有限公司
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