51 results about "Electroless nickel immersion gold" patented technology

The invention discloses a PCB or package substrate chemical nickel gold production new process. The new process comprises the steps of chemical gold pretreatment, deoiling, micro-etching, activation,alkaline chemical nickel, nickel activation, acid chemical nickel, chemical gold, gold surface hole sealing and chemical gold aftertreatment. The invention further provides novel chemical nickel plating liquid. The process is low in nickel cylinder temperature and high in chemical nickel deposition speed; nickel simple substances are difficultly separated out from the wall of a chemical nickel plating liquid stabilizing tank; the horizontal production of chemical nickel gold can be realized; a production line is shortened; the emission of waste water is reduced; and the comprehensive production cost of the production line is reduced. In the novel chemical nickel plating liquid, through adjustment of types of complexing agents and stabilizing agents in the chemical nickel plating liquid, even if under the conditions of higher PH and higher deposition speed, higher P content is achieved to meet various performance requirements of existing chemical nickel gold for the surface treatment ofPCBs and package substrates.

The invention discloses a graded gold finger. The graded gold finger comprises upper golden fingers, lower gold fingers, and leads, wherein the upper gold fingers, the lower gold fingers, and the leads are all rectangular. The graded gold finger is characterized in that the leads are arranged between the upper gold fingers and the lower gold fingers; the upper sides and lower sides of the lead arefixedly connected with the upper gold fingers and the lower gold fingers respectively; and the width of the leads is smaller than the width of the gold fingers. The invention also discloses a manufacturing method of an optical module PCB comprising the graded golden finger. The method comprises the following steps of: plate preparation; selective electroless nickel immersion gold of photosensitive ink; electroplating gold and ink removal; secondary dry film treatment; lead etching and dry film removal; solder masking; selective electroless nickel/immersion gold of heat-set ink; electroless nickel/immersion gold; and plate after-treatment. The method is based on the structural characteristics of the above graded gold finger. With the method adopted, the problem of the falling off of soldermasking sites of a finished board can be solved; and the quality of a PCB manufactured by the method can be further improved.

The present invention provides a method and composition for manufacturing printed circuit boards, which can reduce or eliminate the problem of electroless nickel depositing in through holes that do not need to be plated. The present invention also provides a method and composition for maintaining smooth and bright finish deposits. The invention is particularly useful in the manufacture of printed circuit boards containing one or more electroless nickel immersion gold layers.

The invention discloses a processing method for nickel gold immersion at the bottom of a PCB step groove. The method comprises the steps: carrying out selective gold immersion on a first core plate, and carrying out pre-controlled deep electric milling of a blind groove on a second core plate; respectively carrying out browning treatment on the first core plate and the second core plate; carryingout electric milling through groove treatment on a pp composite layer; enabling the gold immersion PAD of the first core plate, the through groove of the pp composite layer and the blind groove of thesecond core plate to correspond in position; sequentially laminating the first core plate, the pp composite layer and the second core plate to obtain a PCB inner plate; carrying out post-processing on the PCB inner plate; and carrying out depth-controlled uncovering electric milling treatment on the second core plate to expose the gold immersion PAD of the first core plate. The method has the advantages that the depth of the step groove is accurately controlled, the problem of residual glue at the bottom of the step groove is avoided, and the requirement of a PAD at the bottom of the PCB stepgroove for chemical nickel-gold plating is met; and according to the detailed processing steps of the invention, no special high-standard requirement on equipment exists, the method is suitable for the existing conditions of general factories, and batch production can be realized without adding other equipment.

The invention discloses a post-immersing liquid of circuit board electroless nickel immersion gold. The post-immersing liquid comprises the components of 1 to 10V/V% of sulfuric acid, 1 to 30g/L of a reducing agent and 10 to 80g/L of a complexing agent. According to the post-immersing liquid of the invention, the reducing agent and the complexing agent are added so as to modify the post-immersing liquid, so that oxidation substances such as micro etching solution, Cu<2+> and activated Pd<2+> left in semi-plugged holes can be removed, and therefore, plating omission in the electroless nickel immersion gold can be avoided, and the yield of high-density printed-circuit boards can be improved.

A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.

Embodiment of the invention discloses a surface processing method for a printed circuit board and the corresponding printed circuit board, wherein the surface processing method for a printed circuit board comprises selecting electroless nickel immersion gold processing mode or electrogilding processing mode according to plug frequency of connectors on the printed circuit board, performing surfaceprocessing on the connectors of the printed circuit board. The printed circuit board comprises a main body of PCB and the connectors, the surface processing mode of the connectors is electroless nickel immersion gold processing mode or electrogilding processing mode selected according to plug frequency of the connectors, and the surface processing mode of the main body of PCB is electroless nickelimmersion gold processing mode and/or a first surface processing mode. The invention differentiates the surface processing modes of the connectors of PCB with different plug frequencies, which reduces waste of resources.

The invention discloses an in-plate electroless nickel-immersion gold classification connecting finger optical module PCB manufacturing method which comprises steps of plate preparation, partial photosensitive ink treatment, gold electroplating, removing ink, secondary membrane drying, lead etching, dried membrane removal, protection welding, partial thermosetting ink treatment, electroless nickel-immersion gold and later plate treatment. Compared with a conventional common manufacturing process, the method is capable of reducing the cost on the one hand since production procedures are adjusted, that is, the step of protection welding is carried out after the step of lead etching, and thus the three times of membrane removal steps after protection welding are reduced into once; and on theother hand, attack of a strong-alkali eluant to the welding protection ink can be reduced, the bonding force of protection welding parts can be improved, and the problem that protection welding partsof finished plates are peeled off can be reduced.

A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.

The invention provides a method for producing environment-friendly lead-free electroless nickel immersion gold. The method comprises the following steps of: etching a line, and treating a circuit board by using solder mask ink; performing pretreatment, namely polishing and brushing or blasting sand; placing the circuit board in an oil removal trough and treating for 5 minutes; washing by using tap water and conveying into a microetching trough for 2 minutes; washing by using deionized water, and feeding into a preimpregnation trough for 1 minute; directly feeding into an activation trough and treating for 1 minute; washing by using the deionized water, and treating in chemical nickel at the temperature of 80 DEG C for 20 minutes; and washing by using the deionized water, and treating in immersion gold which is prepared from 10 percent KOZO 806 and citric acid gold with density of 2g/L. By the method, the technical problem that the conventional production method is not environment-friendly can be solved; lead in the chemical nickel is replaced and is totally environment-friendly; and the condition that tin is not soldered well can be avoided. The toxic potassium aurous cyanide in the immersion gold is replaced, and the immersion gold is totally environment-friendly; and a solution is stable and is prevented from being decomposed.

The invention is suitable for the technical field of printed circuit boards, and provides a surface treatment method of a printed circuit board, which comprises the following steps: providing a printed circuit board, the printed circuit board comprising an outer layer circuit pattern, and the outer layer circuit pattern comprising an electroless nickel immersion gold (ENIG) pad and a first OSP pad; forming a solder mask layer on the printed circuit board, wherein the solder mask layer covers the first OSP bonding pad and exposes the ENIG pad; performing ENIG surface treatment on the printed circuit board; ablating the solder mask layer covering the first OSP bonding pad through laser so as to expose the first OSP bonding pad; and carrying out anti-oxidation surface treatment on the printed circuit board. According to the surface treatment method of the printed circuit board, ENIG treatment and anti-oxidation mixed surface treatment can be carried out on the printed circuit board with relatively high integration level, and the production efficiency is relatively high. The invention further provides a printed circuit board.

The invention discloses a production line and a production process of electroless nickel immersion gold. The production line comprises a conveying mechanism, a pretreatment area, an electroless nickel immersion gold area and an aftertreatment area, wherein the pretreatment area, the electroless nickel immersion gold area and the aftertreatment area are adjacently arranged on a movement path of the conveying mechanism sequentially. Pretreatment, electroless nickel immersion gold treatment and aftertreatment are integrated to the same production line and operations for transferring and frequently loading and unloading boards during production are not needed, so that manpower can be saved, treatment process can be shortened, and damage such as pollution and scratching of circuit boards can be avoided; a lot of repeated cleaning equipment on the front portions of the electroless nickel immersion gold area and the aftertreatment area in the prior art is omitted, so that the objectives of simplifying equipment, shortening the production line, reducing occupied area, reducing personnel and reducing sewage discharge are achieved, and both the manufacturing cost and production cost of the production line are greatly lowered.

The invention provides a thermosetting ink for selectively resisting electroless nickel/immersion gold. The thermosetting ink comprises the following components in parts by weight: 30-40 parts of modified phenolic resin, 3-4 parts of pigment, 30-50 parts of solvent, 20-30 parts of modified talcum powder, 1-10 parts of curing agent and 0.5-10 parts of aid. The modified phenolic resin is a 2-(4-hydroxybenzoyl)benzoic acid modified phenolic resin; and the modified talcum powder is stearic-acid-containing octaphenyloctasilsesquioxane-modified acrylic acid talcum powder. The curing agent is one of a polyamide resin, an imidazole curing agent and a 590 curing agent.

The invention discloses a method for removing burrs of a metallized half hole of a gold plating plate. The method comprises the following steps of: drilling a hole in a production board, and then metallizing the hole through copper deposition and full-plate electroplating in sequence; plating a tin layer on the board surface of the production board; forming half holes in the production board through a forming process; removing burrs in the holes and at the hole openings through alkaline etching, and then removing the tin layers; pasting a film on the production board, and then sequentially performing exposure and development to form an outer layer circuit pattern; carrying out chemical nickel-gold treatment on the production board; pasting a second layer of film on the production board, and windowing the position, needing gold plating, of the corresponding outer layer circuit pattern; carrying out local gold plating treatment on the production board, and retreating the film; and etching the production board to form an outer-layer circuit. According to the method, a tin plating procedure, half-hole milling and alkaline etching are added before outer layer circuit manufacturing, under the condition of tin layer protection, half-hole burrs are etched and removed firstly, and metalized half-hole manufacturing is achieved.

The invention discloses a chemical nickel-gold process of a wafer aluminum-copper base material applied to the field of IGBT power devices. The chemical nickel-gold process comprises a process flow, an activating solution formula, a chemical nickel formula, a chemical gold formula and the like. The technological process comprises the steps of oil removal, water washing, micro-etching, water washing, presoaking, activation, water washing, vacuum water washing, dry ice spray washing, thin copper electroplating, water washing, chemical nickel plating, water washing and chemical gold plating. The formula of the activating solution comprises ruthenium salt, platinum salt, concentrated sulfuric acid, a surfactant, a stabilizer, a complexing agent and a dispersing agent. The nickel plating formula comprises nickel salt, a complexing agent, a brightening agent, a reducing agent, a stabilizing agent, a bridging agent and a carrying agent. The gold plating formula comprises gold salt, a complexing agent, a stabilizing agent, an underpotential agent, a reducing agent and a nucleating agent. The excellent chemical nickel-gold plating process of the wafer aluminum-copper base material in the field of IGBT power devices can be realized, and the chemical nickel-gold plating process has the characteristics of being excellent in stability, bright and smooth, free of skip plating and diffusion plating, good in oxidation resistance, good in weldability and the like.

The invention relates to a method for reducing the waste of gold salt in a nickel-gold PCB, comprising the following steps: 1) removing or reducing the width of the choke strips near the edge of the inner core board when making the PCB, and then presetting the Reserve a certain width of copper-free area for edge milling; 2) Use a milling cutter to perform edge milling in the copper-free area reserved on the edge of the board to avoid exposed copper on the edge of the board; 3) Treat the surface of the PCB with nickel-gold, at this time , Since there is no exposed copper on the edge of the board, it can prevent gold from attaching to the edge of the board and reduce the waste of gold salt. This method does not require glued paper when nickel-gold is deposited, so the processing cost can be reduced, and the quality of PCB products will not be affected by the reduction of the board edge baffle strips.

The invention discloses a PCB manufacturing process, which comprises a solder mask manufacturing step, a electroless nickel immersion gold (ENIG) step, a baking step, a dividing step and a straightening step, and can avoid the defect of copper exposure on PCB unit boards caused by bonding of solder resist ink on adjacent PCB unit boards in a straightening process. And meanwhile, the plate surface pollution and the expansion and shrinkage size out-of-tolerance are avoided.

The invention discloses a non-toxic and environment-friendly electroless nickel immersion gold solution applied to the field of printed circuit boards. The non-toxic and environment-friendly electroless nickel immersion gold solution comprises, by mass concentration ratios, 0.2-1.0g/L of cyanide-free gold salt based on Au content, 20-100g/L of complexing agent, 1-5g/L of stabilizer, and the balance water. After the components are uniformly mixed according to the mass concentration ratios, a buffer agent is utilized to adjust a pH value to 7.0-8.0, and then an immersion gold solution is formed. The system of the electroless nickel immersion gold solution does not use high-toxicity substances such as gold potassium cyanide and is free of cyanide, thereby reducing the impact on the health of operators and potential safety hazards in the working environment, and greatly reducing the burden and impact on the environment. Meanwhile, plating of a gold plating layer is stable, good in adhesion and uniform in distribution.