Embedded element circuit board and manufacturing method thereof

A technology of embedded components and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, and printed circuit assembly of electrical components, which can solve problems such as increased damage, impact on product reliability, and increased cost to achieve improved reliability. , It is conducive to high-density layout and overcomes the effect of poor filling

Pending Publication Date: 2022-05-06
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the SMT (Surface Mount Technology) solder paste solidifies, the flux will overflow and partially remain on the via layer around the solder pad, which will affect the reliability of subsequent products
Therefore, it is necessary to specially select solder paste that is easy to remove flux residues and increase the corresponding removal process and equipment, which will increase the cost of product development and increase the risk of components being scratched and damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Embedded element circuit board and manufacturing method thereof
  • Embedded element circuit board and manufacturing method thereof
  • Embedded element circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0023] Some embodiments of the present invention will be described in detail below in conju...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embedded element circuit board comprises an inner layer circuit substrate, an embedded element and an adhesive layer, the inner layer circuit substrate is provided with an opening penetrating through the inner layer circuit substrate along a first direction, and the adhesive layer is filled in the opening; the embedded element is completely embedded into the opening, the embedded element comprises an electronic element and two connecting pads arranged on one side of the electronic element at intervals, and the connecting pads are exposed from one end of the opening; the circuit board with the embedded element further comprises a first outer layer circuit structure and a second outer layer circuit structure which are respectively stacked on two opposite sides of the inner layer circuit substrate along the first direction so as to package the embedded element and the adhesive layer, and the connecting pad comprises a copper pad and a chemical nickel-gold layer. And the chemical nickel-gold layer coats the copper pad except the area away from the surface of the second outer layer circuit structure. The invention further provides a manufacturing method of the embedded element circuit board.

Description

technical field [0001] The invention relates to a circuit board, in particular to a circuit board with embedded components and a manufacturing method thereof. Background technique [0002] Embedded circuit board component technology is mainly to embed electronic components inside the circuit board, so that the circuit board module has the advantages of miniaturization, shortening the connection path between components, and reducing transmission loss. It can realize portable electronic equipment. A technical approach to smaller and lighter, multi-functional and high-performance. However, when the SMT (Surface Mount Technology) solder paste solidifies, the flux will overflow and partially remain on the via layer around the solder pad, which will affect the reliability of subsequent products. Therefore, it is necessary to specially select solder paste that is easy to remove flux residues and increase the corresponding removal process and equipment, which will increase the cost...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32H05K3/30H05K3/46
CPCH05K3/323H05K3/301H05K3/4611
Inventor 钟浩文黄美华李彪侯宁黎耀才
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap