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11results about How to "Avoid glue residue" patented technology

SMT automatic feeding and discharging carrier plate jig

The utility model discloses an SMT automatic feeding and discharging carrier plate jig, which relates to the technical field of surface mounting and comprises a positioning plate, a magnet is fixed on the surface of the positioning plate, a magnetic steel sheet is connected to the upper end of the magnet, a positioning pin is fixed to the upper end of the magnetic steel sheet, a groove is formed in the middle of the positioning plate, and a positioning pin is fixed to the lower end of the groove. The fixing mode of the magnetic steel sheet is high in reliability, is not influenced by environmental factors, is also convenient to disassemble and assemble quickly, improves the operation convenience and stability, avoids the problem that adhesive residues are generated after a high-temperature adhesive tape is disassembled, and ensures the surface quality of a substrate and the smooth proceeding of subsequent procedures; due to automatic operation, the labor intensity of operators is remarkably relieved, fatigue is reduced, and the comfort of the working environment is improved; and high-consistency operation of automatic equipment ensures that the fixing effect of each substrate is consistent, and the stability and reliability of product quality are improved.
Owner:PAYTON TECHNOLOGY (SHENZHEN) CO LTD

Preparation method of solar cell and solar cell

The invention discloses a preparation method of a solar cell and the solar cell, and relates to the technical field of solar cells. The preparation method comprises the following steps: sequentially forming a functional layer and a seed layer on a textured surface of a silicon substrate; preparing a leveling layer on the seed layer; coating a photosensitive material on the leveling layer, and performing local exposure and development to form grooves arranged at intervals; preparing metal grid lines in the grooves; and removing the remaining photosensitive material after development and the leveling layer and the seed layer below the remaining photosensitive material. According to the embodiment, the smooth flat layer is prepared on the seed layer of the silicon substrate textured surface, so that the problem that residual glue is generated due to the fact that the seed layer with a pyramid structure is directly coated with a photosensitive material is avoided, and the bottom morphology of the metal grid line is improved.
Owner:JA SOLAR TECH YANGZHOU

A replaceable protective film structure for a cash register touchscreen

This utility model discloses a replaceable protective film structure for a cash register touchscreen, belonging to the technical field of cash register touchscreen protection equipment. It includes a cash register body, with a screen frame mounted on top of the body via a bracket. A touchscreen is embedded within the screen frame. The screen frame has a combination of concave and linear frames along its four perimeter. A non-adhesive protective film is pressed and fixed inside the concave and linear frames, covering the touchscreen area. A threaded post is located at the middle of the front side of the vertical section of the concave frame, and a concave bracket is fitted onto the threaded post, distributed along the inner end of the outer side of the concave frame. This replaceable protective film structure is used to fix a non-adhesive protective film to the touchscreen panel of the cash register. It also facilitates quick replacement when the protective film is heavily soiled, improving replacement efficiency and avoiding the problem of residual adhesive on the touchscreen panel.
Owner:SHANGHAI AOJIA TECH CO LTD

Sand blasting shielding protection device for wafer bearing table in semiconductor manufacturing process

ActiveCN224182845Uprecise positioningAchieve shielding and protection effectAbrasive machine appurtenancesSand blastingEngineering physics
The utility model belongs to the technical field of semiconductor manufacture procedures, and relates to a semiconductor manufacture procedure wafer bearing table sand blasting shielding protection device. Comprising a shielding cover plate (1), a shielding chuck (2) and a device base (3), the shape and the size of the inner edge of the shielding chuck (2) are equal to the shape and the size of the outer edge of the shielding cover plate (1), base positioning holes (4) are formed in the device base (3), and cover plate positioning columns (5) are arranged on the shielding cover plate (1). The semiconductor process wafer bearing table sand blasting shielding protection device is simple in structure, sand blasting shielding of a non-processing area of the wafer bearing table is guaranteed, and it is guaranteed that only the area needing sand blasting is processed.
Owner:WUHU XINTONG SEMICON MATERIALS CO LTD

High-temperature-resistant masking tape and preparation method thereof

The invention discloses a high-temperature-resistant masking tape and a preparation method thereof. The masking tape comprises a release layer, a first base material layer, a first adhesive layer, a second base material layer and a second adhesive layer which are sequentially laminated, the second adhesive layer comprises olefin polysiloxane, vinyl silicone resin, a cross-linking agent, a platinum catalyst, an anchoring agent, a physical foaming agent and a solvent; and the foaming temperature of the physical foaming agent is 150-230 DEG C. The masking tape disclosed by the invention has good insulating property, chemical resistance and fitting property; the high-temperature shielding film is suitable for the fields of electroplating, powder spraying and the like needing high-temperature shielding protection, has the characteristics of quick film tearing, no brittle failure and no adhesive residue, is adaptive to an automatic equipment film tearing process, greatly improves the production efficiency and reduces the cost.
Owner:CYBRID TECHNOLOGIES INC

Re-peel adhesive tape

The present invention provides a removable adhesive tape having excellent anchoring force between an adhesive layer and a substrate. The removable adhesive tape of the present invention comprises a substrate, a primer layer containing a binder resin and a filler, and an adhesive layer in this order. The removable adhesive tape has a protrusion in which at least a part of the filler protrudes from the primer layer to the adhesive layer, and the interface between the primer layer and the adhesive layer has a concavoconvexity.
Owner:NITTO DENKO CORP

Junction box cable fixing tool and photovoltaic module

According to the junction box cable fixing tool and the photovoltaic assembly, the fixing assembly is embedded into the frame to be kept fixed, the fixing assembly is provided with the insertion opening and the fixing cavity, so that a cable can be placed into the fixing cavity from the insertion opening or taken out of the fixing cavity, and the brush is arranged in the fixing cavity, so that the fixing assembly is more convenient to use. A cable placed in the fixing cavity can penetrate into a gap between the brushes, the brushes are used for fixing and supporting the cable, the cable is prevented from moving at will, cables of various lengths can be fixed, the cable can be pulled out of the brushes by directly pulling the other end of the cable when the cable is used, and the use is convenient. Compared with the prior art, the cable fixing device has the advantages that the short cable or the long cable can be conveniently and repeatedly fixed, adhesive residue and damage are avoided, the cost is lower, and the cable fixing device is stable and reliable.
Owner:江苏海博瑞光伏科技有限公司

Polyacrylate containing photocurable olefinic groups in the side chain and UV viscosity-reducing adhesive composition

The present application specifically discloses a polyacrylate containing photocurable alkenyl groups in the side chain and a UV viscosity-reducing adhesive composition. The polyacrylate is polymerized by thermal reaction with a polyurethane monomer containing different active alkenyl groups, a hydroxyl- and alkenyl-terminated acrylic acid ester copolymer, a flexible monomer and a rigid monomer. The UV viscosity-reducing adhesive composition mixed with such a polyacrylate containing photocurable alkenyl groups in the side chain can fully infiltrate the epoxy molding material of the electronic components, and has a high adhesion to the epoxy molding material; at the same time, the UV viscosity-reducing adhesive composition does not need to use low molecular weight UV monomers and UV prepolymers. After low-energy UVLED irradiation and curing, the peel strength of the UV viscosity-reducing adhesive composition is greatly reduced, and the residual adhesive phenomenon is avoided.
Owner:JIANGSU KEMAITE TECH DEV CO LTD

A heat-expandable peelable pressure-sensitive adhesive tape

The invention discloses a heat-expandable peelable pressure-sensitive adhesive tape, belonging to the technical field of pressure-sensitive adhesive tape. 90-100 parts of resin, 10-20 parts of monomer, 15-25 parts of expanded microspheres, 8-15 parts of flame retardant, 2-4 parts of photoinitiator, and 110-130 parts of solvent are fully stirred by weight, applied on a plastic film by a coating machine, dried at 60-90°C, and then UV-cured under a 300-500nm UV furnace, rolled up, and a heat-expandable peelable pressure-sensitive adhesive tape is obtained. The flame retardant of the present invention is rich in halogen-free flame retardant elements nitrogen, phosphorus, and silicon, and the flame retardant and the monomer can produce a chemical reaction under the action of a photoinitiator and cross-link, and then the flame retardant can be stably present in the pressure-sensitive adhesive, give full play to the effect, and then the pressure-sensitive adhesive tape of the present invention has high efficiency, safety and long-term flame retardant effect. At the same time, the synergistic effect between the flame retardant and the remaining raw materials makes the pressure-sensitive adhesive tape of the present invention have good bonding effect and no residual glue is left after peeling.
Owner:SUZHOU K-HIRAGAWA ELECTRONIC TECHNOLOGY CO LTD

Polyacrylate pressure-sensitive adhesive and adhesive tape for electronic products

The invention relates to the technical field of pressure-sensitive adhesives, and specifically discloses a polyacrylate pressure-sensitive adhesive and an adhesive tape for electronic products. The polyacrylate pressure-sensitive adhesive comprises the following raw materials: butyl acrylate, glycidyl methacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, mercapto-α-cyclodextrin, a monomer containing adamantane, a chain extender, a filler, an initiator, and water. The preparation method comprises the following steps: adding butyl acrylate, glycidyl methacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, mercapto-α-cyclodextrin, and an initiator into water, heating and stirring for reaction, adding the monomer containing adamantane, a chain extender, and a filler, continuing the stirring for reaction, and cooling to room temperature to obtain the obtained pressure-sensitive adhesive. The obtained pressure-sensitive adhesive has the advantages of high temperature resistance, high peel strength, and low residual adhesive, and can be widely used in electronic products.
Owner:KUNSHAN BYE MACROMOLECULE MATERIAL CO LTD