Anti-static protective film for wafer cutting and preparation method thereof

Abstract

The invention provides an anti-static protective film for wafer cutting. The anti-static protective film sequentially comprises a first anti-static layer, a substrate layer, a second anti-static layer, a viscosity reduction layer and a release film layer. According to the invention, the protective film for wafer cutting is prepared by combining the double-sided antistatic layers and a viscosity reducing film material containing an antistatic filler, so the phenomenon of residual glue easily occurring in long-term storage or under a high-temperature condition is avoided; and meanwhile, the peeling strength of the protective film for wafer cutting before viscosity reduction can be improved, and the peeling strength of the protective film after viscosity reduction can be reduced, so accuratefixing and picking efficiency are improved.

Description

technical field [0001] The invention belongs to the technical field related to semiconductors, and more specifically, the invention provides an antistatic wafer cutting protection film and a preparation method thereof. Background technique [0002] In the process of semiconductor wafer processing, especially in the process of picking up crystal grains after wafer dicing in the later stage of wafer packaging testing, it is often because the small grains after cutting are easy to generate static electricity during the process of peeling off the dicing film. The functionality of the die causes damage, resulting in lower yields in subsequent testing. [0003] At present, there are some protective films with anti-static coating in the market to play the role of stable protection, but this current protective film is simply anti-static treatment on the surface of the material, and there will still be a large static voltage during use. Phenomenon, the use in some fields of cutting ...

AI Technical Summary

Problems solved by technology

[0002] In the process of semiconductor wafer processing, especially in the process of picking up crystal grains after wafer dicing in the later stage of wafer packaging testing, it is often because the small grains after cutting are easy to generate static electricity during the process of peeling off the dicing film. Die functionality causes damage, resulting in reduced yield in subsequent tests

[0003] At present, there are some protective films with anti-static coating in the market to play the role of stable protection, but this current protective film is simply anti-static treatment on the surface of the material, and there will still be a large static voltage during use. Phenomenon, the use is limited in some fields of cutting electronic parts that require high static electricity

[0004] At present, the wafer dicing protective film generally includes thermal debonding protective film and UV debonding protective film. These protective films generally have a long storage time or high temperature. The small molecules of the adhesive layer will remain on the surface of the bonded object, causing pollution to the bonded object; in addition, the peel strength of the protective film produced in China is low before the viscosity is reduced, and the peel strength is high after the viscosity is reduced. Realize high-accuracy fixing and efficient picking

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