A kind of antistatic wafer cutting protective film and preparation method thereof

Abstract

The first aspect of the present invention provides an antistatic wafer dicing protection film, which sequentially includes a first antistatic layer, a substrate layer, a second antistatic layer, an adhesion-reducing layer and a release film layer. The invention adopts the double-sided antistatic layer combined with the anti-adhesive film material containing antistatic performance filler to prepare the wafer cutting protective film, which avoids the phenomenon of residual glue that is easy to appear under long-term storage or high temperature conditions, and can also improve the quality of the wafer. Cutting the peel strength of the protective film before detackification and reducing the peel strength of the protective film after detackification, so as to improve the accuracy of fixing and picking efficiency.

Description

technical field [0001] The invention belongs to the technical field related to semiconductors, and more specifically, the invention provides an antistatic wafer cutting protection film and a preparation method thereof. Background technique [0002] In the process of semiconductor wafer processing, especially in the process of picking up crystal grains after wafer dicing in the later stage of wafer packaging testing, it is often because the small grains after cutting are easy to generate static electricity during the process of peeling off the dicing film. The functionality of the die causes damage, resulting in lower yields in subsequent testing. [0003] At present, there are some protective films with anti-static coating in the market to play the role of stable protection, but this current protective film is simply anti-static treatment on the surface of the material, and there will still be a large static voltage during use. Phenomenon, the use in some fields of cutting ...

AI Technical Summary

Problems solved by technology

[0002] In the process of semiconductor wafer processing, especially in the process of picking up crystal grains after wafer dicing in the later stage of wafer packaging testing, it is often because the small grains after cutting are easy to generate static electricity during the process of peeling off the dicing film. Die functionality causes damage, resulting in reduced yield in subsequent tests

[0003] At present, there are some protective films with anti-static coating in the market to play the role of stable protection, but this current protective film is simply anti-static treatment on the surface of the material, and there will still be a large static voltage during use. Phenomenon, the use is limited in some fields of cutting electronic parts that require high static electricity

[0004] At present, the wafer dicing protective film generally includes thermal debonding protective film and UV debonding protective film. These protective films generally have a long storage time or high temperature. The small molecules of the adhesive layer will remain on the surface of the bonded object, causing pollution to the bonded object; in addition, the peel strength of the protective film produced in China is low before the viscosity is reduced, and the peel strength is high after the viscosity is reduced. Realize high-accuracy fixing and efficient picking

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