A kind of manufacturing method of buried copper block circuit board

A production method and technology for burying copper blocks, which are applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problem of difficulty in cleaning the circuit boards of buried copper blocks, avoid the phenomenon of glue residue on the board surface, and improve the glue removal efficiency. , to avoid the effect of board surface deformation and damage

Active Publication Date: 2022-03-15
DONGGUAN SHENGYI ELECTRONICS
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for making a buried copper circuit board, which can solve the problem that the residual glue on the surface of the buried copper circuit board is not easy to remove, so as to improve the glue removal efficiency

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  • A kind of manufacturing method of buried copper block circuit board

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0032] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention discloses a method for manufacturing a copper-buried circuit board, and relates to the technical field of printed circuit board manufacturing. The present invention firstly controls the thickness of the buried copper block to be smaller than the thickness of the circuit board, and the height difference prevents the colloid from flowing to the board surface of the circuit board after lamination, avoiding the phenomenon of residual glue on the board surface; Copper reduction treatment makes the thickness of the circuit board smaller than that of the buried copper block, and the height difference makes the upper and lower surfaces of the buried copper block protrude from the circuit board, so as to facilitate the cleaning of the upper and lower surfaces of the buried copper block; finally, the upper and lower surfaces of the circuit board The board surface and the upper and lower surfaces of the buried copper block are uniformly ground to remove the colloid on the upper and lower surfaces of the buried copper block, and at the same time ensure that the upper and lower surfaces of the circuit board are flush with the upper and lower surfaces of the buried copper block. The above manufacturing method not only improves the glue removal efficiency, but also avoids the deformation and damage of the board surface of the buried copper circuit board.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing printed circuit boards with buried copper blocks. Background technique [0002] Nowadays, embedded copper blocks are generally arranged in the circuit board to ensure good heat dissipation of the circuit board. During the production process of the buried copper block circuit board, it is necessary to use colloid to connect the buried copper block and the circuit board. However, during the pressing process of the circuit board, the colloid is easy to overflow and flow to the board surface and the buried copper block, thus making the buried copper block There are different degrees of residual glue on the surface of each circuit board. [0003] There is a method for making a buried copper circuit board, which controls the thickness of the buried copper block to be greater than the actual board thickness after lamination, so th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
CPCH05K3/4007
Inventor 何思良宋祥群刘梦茹杨云
Owner DONGGUAN SHENGYI ELECTRONICS
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