3results about How to "Easy to remove glue" patented technology

The application relates to a glue removing mechanism and glue removing equipment. The glue removing mechanism comprises a cutter head assembly and a pressure obtaining assembly. The cutter head assembly comprises a first clamping piece and a second clamping piece, and the first clamping piece and the second clamping piece form a clamping space. A heating piece is arranged in the first clamping piece and the second clamping piece, and the heating piece is used for heating a blade. The pressure obtaining assembly is connected to the first clamping piece and the second clamping piece to sense the force applied by the cutter head assembly to a product to be removed of glue. In the application, the heating piece is arranged in the first clamping piece and the second clamping piece, which effectively heats the blade to soften the glue, facilitating glue removal. By connecting the pressure obtaining assembly to the first clamping piece and the second clamping piece, the pressure obtaining assembly senses the force applied to the product to be removed of glue during glue removal, so that the glue removing mechanism can adjust the pressure. The glue removing mechanism applies a suitable force, avoids scratching the product due to excessive pressure, or causes incomplete glue removal due to insufficient pressure.

The application discloses a circuit board explosion-proof glue structure, which comprises a bottom glue layer, a surface glue layer and a reinforcing structure. The bottom glue layer is coated and solidified on the surface of the circuit board. The surface glue layer is coated and solidified on the side, away from the circuit board, of the bottom glue layer. The reinforcing structure is embedded in the surface glue layer, so that the surface glue layer forms a continuous body which can be integrally peeled off. The temperature resistance of the bottom glue layer is lower than that of the surface glue layer and the reinforcing structure. The application sets a layer of low-temperature-resistant glue between the circuit board and silica gel or electronic glue, so that the surface glue layer can be easily removed in pieces. The reinforcing structure is arranged in the surface glue layer, so that the surface glue layer is integrated. The glue is attached to the circuit board, and the glue can be easily removed, so that the difficulty of maintenance is reduced, the balance between high adhesion and maintainability of the explosion-proof glue is achieved, and the damage of physical glue scraping to the PCBA is avoided.

The utility model discloses a printed book glue remover which comprises a shell, a glue removing stick is fixedly installed at the lower end of the shell and comprises a PTC heating body arranged in the glue removing stick and a metal rod sleeve arranged on the outer surface of the PTC heating body in a sleeved mode, a switch button is arranged on the shell, a battery block is arranged in the shell, and the metal rod sleeve is connected with the switch button. The battery block is electrically connected with the PTC heating body through the switch button; compared with the prior art, the battery block and the switch button are arranged on the shell, the glue removing rod is arranged at the lower end of the shell, and the PTC heating body is arranged in the shell, so that when glue needs to be removed, the PTC heating body is electrified to work and heat, and the heated PTC heating body can enable the metal rod sleeve to heat; therefore, the excessive glue needing to be removed can be well softened, and the glue removing work is more convenient.