2results about How to "Avoid short circuit and other problems" patented technology

This utility model relates to a rechargeable foot support, comprising: a base assembly including a housing with a cavity, a charging coil and a PCB circuit board disposed within the cavity, the housing having an installation area communicating with the cavity, and a heat sink installed at the installation area, through which heat from the cavity is conducted to the heat sink; and a support rod movably connected to the housing and the heat sink, through which heat from the cavity is dissipated, thus preventing overheating of the PCB circuit board and the charging coil that could cause short circuits, reducing the temperature inside the cavity, and improving charging efficiency.

This invention provides a bottom-lead non-hermetic SiP module, comprising: a package base including pins and a base plate, with one end of the pins fixed to the upper surface of the base plate and the other end extending from the lower surface of the base plate; an adapter board including a wiring layer, a substrate layer, and a first electrical interconnect structure, the substrate layer being bonded to the surface of the package base, the wiring layer being fabricated on the upper surface of the substrate layer, and the wiring layer and pins being interconnected through the first electrical interconnect structure; a chip stack including bare chips, an adhesive layer, and a second interconnect structure, the bottom bare chip being formed on the upper surface of the adapter board through the adhesive layer, the second layer of bare chips and higher layers of bare chips being formed on the upper surface of the next layer of bare chips through the adhesive layer, and the bare chips being interconnected with each other and with the wiring layer through the second electrical interconnect structure; and a molding compound encapsulating the upper half of the pins, the adapter board, and the chip stack, and forming an integral part with the base plate. This invention can improve the reliability between the SiP module and the circuit board.