Glass water degumming device and degumming method

Abstract

The invention discloses a glass wafer degumming device. The glass wafer degumming device comprises a degumming tank, a dehydrating component, a concentrated sulfuric acid tank, a hydrogen peroxide tank and a microprocessor; the degumming tank comprises a washing tank and a rinsing tank which are arranged adjacently; the washing tank is filled with concentrated hydrochloric acid and hydrogen peroxide; the upper portion inside the washing tank is provided with a washing basket; the upper portion inside the rinsing tank is provided with a rinsing basket; the concentrated sulfuric acid tank communicates with the washing tank via concentrated sulfuric acid pipe; the hydrogen peroxide tank communicates with the washing tank via a hydrogen peroxide pipe; one side of the upper portion of the washing tank is provided with a tank cover; the other side of the upper portion of the washing tank is used for arranging the dehydrating component; and the dehydrating component comprises an electric heating plate, an absorption bin, a temperature sensor, a circulating pipe, a desiccant bag and a fan. The invention further provides a method for degumming glass wafers by using the glass wafer degummingdevice. The glass wafer degumming device can be used for effectively removing ultraviolet curing glue on the glass wafer, can realize continuous proceeding of a degumming process without frequently replacing the degumming liquid, improves the work efficiency, saves resources and protects the environment.

Description

technical field [0001] The invention relates to the field of water washing and degumming, in particular to a glass wafer degumming device and a degumming method. Background technique [0002] With the development of the electronic semiconductor industry, the requirements for glass wafers are higher, and the different requirements for the size of the glass wafers lead to the need to cut the glass wafers. At present, the common cutting method in the market is to bond the glass wafer with UV curing glue with good adhesion performance, and then cut it, and dissolve the cured glue in the cut wafer with a suitable solvent to obtain Glass wafers of the desired size. However, the UV-curable adhesive is more firmly bonded, which ensures the quality of wafer cutting, but it also brings us a new problem: the removal of UV-curable adhesive. [0003] At present, the most effective method for removing UV-curing glue is concentrated sulfuric acid and hydrogen peroxide method. This method...

AI Technical Summary

Problems solved by technology

However, the UV-curable adhesive is more firmly bonded, which ensures the quality of wafer cutting, but it also brings us a new problem: the removal of UV-curable adhesive

[0003] At present, the most effective method for removing UV-curing glue is concentrated sulfuric acid and hydrogen peroxide method. This method first adds concentrated sulfuric acid and concentrated sulfuric acid to carbonize the glue, and then reacts it with hydrogen peroxide to finally generate carbon dioxide and water. This method has a better removal effect , but because the water generated by the reaction will dilute the concentrated sulfuric acid, and the carbonization effect of the diluted concentrated sulfuric acid is reduced, and the next round of carbonization cannot be carried out, so it can only be used once, and the waste is huge. In addition, the discarded concentrated sulfuric acid It also needs to be treated before it can be discharged, resulting in a waste of human and financial resources

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