36results about How to "Shorten the stripping time" patented technology

The invention discloses a pneumatic connection rod type rotary cutting mould which comprises an upper mould and a lower mould, wherein the upper mould comprises an upper mould seat, a convex mould fixing plate, a discharge plate and a pressure plate; a nitrogen spring is arranged in the upper mould seat; a rotary cutting concave mould and a guide pin are arranged in the pressure plate; the lower mould comprises a lower mould plate, a lower base plate and a lower mould seat; a rotary cutting convex mould is arranged in the limit grooves arranged on the upper surface of the lower base plate and the lower end surface of the lower mould plate, and corresponds to the rotary cutting concave mould; the lower part of the rotary cutting convex mould is also provided with a rotary cutting convex mould resetting mechanism; in the convex mould fixing plate, a front driving block, a rear driving block, a left driving block and a right driving block of the rotary cutting convex mould are also arranged in the front, rear, left and right directions of the mould; the four driving blocks cooperate with the outer side of the rotary cutting convex mould; and a pneumatic connection rod mechanism is arranged in a limit groove formed by the upper surface of the pressure plate and the lower end surface of the discharge plate. The pneumatic connection rod type rotary cutting mould disclosed by the invention not only can guarantee the product precision and improve the production efficiency, but also finish all processes in a set of progressive mould, thereby greatly saving the cost and improving the market competitiveness.

The invention provides an anisotropic conductive adhesive remover. The anisotropic conductive adhesive remover contains a solvent, a surfactant and a stable solubilizer, wherein the solvent comprises halogenated alkane, ethanol and ethyl acetate, and the stable solubilizer is a butyl ether derivative. The invention also provides a preparation method for the anisotropic conductive adhesive remover. The anisotropic conductive adhesive remover provided by the invention is high in adhesive removing efficiency and short in adhesive removing time.

The invention discloses a preparation method of fermented Pu'er tea. The preparation method comprises the following steps of S1, picking of tea leaves; S2, fixation; S3, rolling; S4, airing; S5, wetting by water; S6, piling; S7, finishing of piling; S8, deblocking; S9, drying; S10, steaming and compressing; S11, spreading and airing. The preparation method of the fermented Pu'er tea has the advantages that the whole set of production technology of finished fermented Pu'er tea from picking of tea leaves to final spreading and airing is provided, the high-quality fermented Pu'er tea can be quickly prepared, the appearance feature and inherent quality of the prepared fermented Pu'er tea are high, and the fermented Pu'er tea is suitable for long-term drinking, and is suitable for being used asthe raw material for producing tangerine Pu'er tea; by utilizing the rolling technique, compared with the prior art, the strip forming time of the fermented Pu'er tea is obviously shortened, the strip forming efficiency and strip forming appearance quality are improved, and the processing efficiency of the fermented Pu'er tea is further improved.

The invention provides a hollow blade easy-to-remove aluminum oxide ceramic core and a preparation method thereof. According to the ceramic core, a shell and a space lattice structure in the shell arecombined, and when the relative density of the space lattice structure is 20 to 50 percent and the thickness of the shell is 0.4 to 0.5 mm, high void ratio of the ceramic core is realized and the deflection and the bending resistance of the ceramic core are guaranteed; and according to the preparation method, stable printing is facilitated by high flowability and low viscosity of ceramic slurry,the properties of the ceramic core are improved well by cooperating with the space lattice structure, the ceramic slurry is printed into a needed forming green body by 3D printing equipment, and the formed ceramic core is obtained by degreasing and sintering the formed green body. The ceramic core has high strength and short core removing time, saves ceramic materials, shortens process flow and provides an efficient solution for the problem about removal of the aluminum oxide ceramic core.

The invention discloses a fixing device used for stripping an insulating layer of an insulated conductor. The fixing device comprises a right-angled connecting rod, one end of the right-angled connecting rod is provided with a bib clamp, the other end of the right-angled connecting rod is provided with a duckbilled clamp, and the duckbilled clamp is provided with a turncap further facilitating rotating and screwing. A rod body, close to one end of the bib clamp, of the right-angled connecting rod is provided with a round hole, and a steel wire rope provided with a bolt is tied on the rod body and is fixed to the rod body. The bib clamp comprises a first part and a second part which are freely connected through a hinge piece, the first part is an inverted-U-shaped block body, a round hole is formed in the middle of the first part, a spiral bolt penetrates through the round hole and is connected with a W-shaped contact face which is in fit contact with the second part, and the W-shaped contact face can move upwards and downwards along with screwing of the spiral bolt. The fixing device has the advantages that the fixing device can fix a wire, so the wire can not rotate and the wire stripping time can be greatly shortened; manual support is not needed, and physical output is greatly reduced.

The invention provides a solder-resistor/character ink stripping technology. The technology comprises the following steps that a 10-16wt% of a stripping agent solution of a solder-resistor/character ink is configured, and a stripping agent comprises 40g/L of NaOH, 10g/L Na2S2O3 and TX-101ml/L; a heater heats a stripping cylinder to 80 to 85 DEG C; a returned printed circuit board rack is placed in the stripping cylinder and immersed for 1 hour; the immersed returned printed circuit board rack is taken out and washed by tap water or brushed by a nylon brush at the room temperature; and drying is carried out for 1 hour at the temperature of 100 DEG C, and a pretreatment process of solder-resist/character ink screen-printing is turned to. The technology is suitable for common FR-4 base materials and halogen-free base materials, ripple exposure is prevented, and copper and golden surfaces are not attacked. According to the technology, complex equipment is not needed, the technology is simple, material resources are wide, the cost is low, the preparation cost is low, the production process is free of pollution, and the technology is suitable for industrial production.

The invention discloses a removal method of a composite mark for injecting high-energy particles. The mask is a composite photoresist mask with a three-layer structure; a photoresist mask pattern is manufactured between an injecting resisting layer dielectric film and a surface sacrificing dielectric film through the mask to be used as a high-energy particles injecting mask; two dielectric film etching agents for removing the composite mask are different; when removing the mask, the sacrificing dielectric film, the photoresist mask and the resisting layer dielectric film are sequentially removed. With the adoption of the composite mask, the problem that the photoresist mask is cracked and denatured under the attack of the high-energy particles can be avoided; in addition, the mask can be removed without residue; the cleanness of the surface of a chip is ensured, and the device performances can be improved.

The invention relates to a new ceramic mold material and a molding technique for replacing gypsum mold and technique needed by traditional ceramic mold technique. Compared with a traditional mold, the inventive mold has the advantages of high strength, long service (a single mold can be used for more than million times), high preciseness, small number of needed single variety mold (hundreds of molds are needed in the traditional technique, while 2-3 molds are needed for the new material rolling technique, 6-8 molds are needed for pressure casting to achieve continuous production), and the like. The popularization of the mold and molding technique can radically change the existing ceramic production situation, save resources and energies, reduce pollution, enhance efficiency and product quality, and provide conditions for modernization and automation of ceramic production.

The invention discloses a low bending loss low water peak single mode fiber with a stable diameter. The cladding diameter of the optical fiber is 124-125 mu m, the inner coating diameter is 190-195 mu m, and the outer coating diameter is 240-246 mu m. A production process of the low bending loss low water peak single mode fiber includes the following steps that an F element is added to a core of the optical fiber, the refractive index section of a rod is prefabricated to be a recessed cladding structure, the recessed amplitude is 0.05%-0.14%, and simultaneously, a coating material is subjected to modified optimization. The low water peak single mode fiber is simple in structure, high in practicability, excellent in bending resistance and suitable for being widely used in the industry, simultaneously, stripping performances of coatings are superior to those of similar optical fibers, and the coating stripping time of a single optical fiber is shortened by two seconds.

The invention discloses a detape method for integrated circuit packaging post-treatment. The detape method for integrated circuit packaging post-processing method comprises the following steps that ina chemical detape process, the following operations are added: one or more of inert gas bubbling, overflow and ultrasonic processing are carried out. According to the detape method, the service lifeof an adhesive remover can be prolonged (up to 4 months or above), and a conventional adhesive remover is matched, so that tape glue or flash or bur can be independently removed, or the tape glue andthe flash and bur can be removed simultaneously, and the occurrence of burrs of a subsequent electroplating process can be reduced; no damage is caused to a plastic package body and a base material; and the detape time can be obviously shortened.

The invention relates to a chip stripping method of LED lamp beads. The method comprises the steps of: a) shearing the upper end of LED lamp beads to allow a distance between the sheared region and achip to be 0.25-0.5mm; b) welding and fixing the N sheared lamp beads on a LED support strip in a linear direction, wherein the heights of the lamp beads after welding are consistent; c) putting the LED support strip into an oven for baking to heat and soften the lamp beads; and d) putting the baked LED lamp beads into a culture dish for immersion by employing an organic solvent, wherein the glueat the surfaces of the chips in the LED lamp beads are dissolved by the organic solvent, and the chips are stripped off from the lamp beads, and the stripped chips are taken out from the culture dishby employing tweezers. The time of stripping of the LED lamp bead chips is reduced, an ordinary organic solvent is only used to prevent the chips from being damaged by lamp bead corrosive liquid so asto improve the stripping efficiency of the lamp bead chips, reduce the use of the lamp bead corrosive liquid, reduce the damaging to the personnel, the environment and LED chips caused by the lamp bead corrosive liquid and improve the analysis efficiency of the poor LED lamp beads.

The invention relates to the technical field of cable outer layer stripping, and particularly relates to an automatic cable stripping machine. The automatic cable stripping machine comprises a machinestand and a machine stand cable placement table; a left cable stripping mechanism and a right cable stripping mechanism which are used for carrying out cable stripping on a cable on the cable placement table are respectively arranged at both sides of the cable placement table; a cable pressure mechanism is arranged at the upper side of the cable placement table; the cable pressure mechanism comprises a pressure rod, a pressure plate and a driving mechanism; the pressure rod is connected with the pressure plate by a connection rod; the bottom end of the connection rod sleeves the upper end ofthe pressure rod; a spring is arranged between the bottom end of the connection rod and the top end of the pressure rod; the top end of the connection rod is connected with the pressure plate by a force unloading mechanism; the force unloading mechanism comprises a force unloading barrel arranged at the bottom of the pressure plate and a force unloading spring inside the force unloading barrel; the upper end of the connection rod is embedded in the force unloading barrel and is in sliding fit with the inner wall of the force unloading barrel; the bottom end of the force unloading spring is pressed against the top end of the connection rod; and a limiting mechanism for limiting a descent height of the connection rod is arranged at the position of the cable placement table. The single-side or both-side simultaneous stripping operation of the cable is implemented, and production efficiency is high.

The invention discloses an efficient photoresist removing process method for wafer optical thin film graphical processing. According to the method, the optical thin film deposited on the photoresist is removed by adopting a stripping adhesive tape pasting mode, and the exposed photoresist is directly contacted with the photoresist removing liquid in the photoresist removing process and is easier to remove, so that the photoresist removing time is greatly shortened, and the wafer optical thin film patterning processing efficiency is improved. The problems that in a traditional photoresist removing lift mode, due to blocking of an optical thin film above a photoresist layer, photoresist removing liquid cannot make direct contact with photoresist, photoresist removing is difficult, time is long, and efficiency is low are solved.