Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Detape method for integrated circuit packaging post-treatment

An integrated circuit and glue removal technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid devices, etc., can solve the problem that the potion cannot remove tape glue and overflow in one step, the damage of the plastic package and the substrate, and the short life of the chemical potion, etc. problems, to achieve the effect of facilitating automatic operation, prolonging life, and shortening the glue removal time

Pending Publication Date: 2019-07-30
SHANGHAI SINYANG SEMICON MATERIALS
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is to overcome the various colloidal substances left on the pins such as tape glue or overflow in the process of semiconductor packaging in the prior art. The chemical potion has defects such as short service life, insufficient removal power, damage to the plastic package and the substrate, and the potion cannot remove tape glue and overflow in one step, and provides a post-processing deglue method for integrated circuit packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Detape method for integrated circuit packaging post-treatment
  • Detape method for integrated circuit packaging post-treatment
  • Detape method for integrated circuit packaging post-treatment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0070] Table 1 The raw material components of glue remover

[0071]

[0072]

[0073] Table 2 The pH value of each raw material component mass fraction and glue remover

[0074]

[0075] According to the raw material components and their mass fractions recorded in the above Tables 1 and 2, each raw material component was weighed and mixed to obtain 7 different adhesive removers, and the adhesive removers in the following examples were also prepared by the same method .

Embodiment 13-14

[0089] Each raw material component of table 4 adhesive remover

[0090]

[0091] The mass fraction of each raw material component of table 5 and the pH value of gel remover

[0092]

[0093] The preparation method of the adhesive remover in Examples 13-14 is the same as the preparation method of the adhesive remover in Examples 1-7. The operation process in the following application examples is the same as the above application examples 1-120.

Embodiment 1

[0104] Example 1'-Example 6'

[0105] Each raw material component of table 8 glue remover

[0106]

[0107] The mass fraction of each raw material component of table 9 and the pH value of gel remover

[0108]

[0109] The degumming agent of embodiment 1'-6' is operated according to the degumming temperature and time of table 10, can obtain better degumming effect (see table 10 specifically), and after adding bubbling, overflow and megasonic When one or more of the operations are performed, the effects of tape removal, flash removal and tin plating can still be obtained in the case of shortening the removal time (5 minutes). The effect of de-flashing and tin-plating; only when the single method of Megasonic is added, the effect of removing tape glue, de-flashing and tin-plating is not significantly improved. When observed by a metallographic microscope, no damage to the substrate of the lead frame before and after tin plating was observed. In addition, changing the ope...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a detape method for integrated circuit packaging post-treatment. The detape method for integrated circuit packaging post-processing method comprises the following steps that ina chemical detape process, the following operations are added: one or more of inert gas bubbling, overflow and ultrasonic processing are carried out. According to the detape method, the service lifeof an adhesive remover can be prolonged (up to 4 months or above), and a conventional adhesive remover is matched, so that tape glue or flash or bur can be independently removed, or the tape glue andthe flash and bur can be removed simultaneously, and the occurrence of burrs of a subsequent electroplating process can be reduced; no damage is caused to a plastic package body and a base material; and the detape time can be obviously shortened.

Description

technical field [0001] The invention relates to a glue-removing method for post-processing of integrated circuit packaging. Background technique [0002] During the packaging process of semiconductors, various gelatinous substances will remain on the plastic package and pins, such as tape glue (the film of the tape, or tape film, the composition is generally silane resin) or flash (also known as Burrs or flash, the composition is generally epoxy molding compound), etc., need to be removed. Otherwise, it will lead to frame deformation, missing plating, and coating defects in the packaging process, which will affect the reliability of the product, cause problems such as product open circuit, virtual soldering, etc., affect the electrical conduction performance of the pins, and seriously lead to rework and chip function failure or even Scrap, which brings the complexity of the packaging process and the increase of cost. Therefore, detape (detape) and deflash (deflash or debur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 王溯于仙仙马伟
Owner SHANGHAI SINYANG SEMICON MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com