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402results about How to "Avoid process problems" patented technology

Preparation method for synthesizing Cu-SSZ-39 molecular sieve based catalyst by using one-step method and application

The invention provides a preparation method for synthesizing a Cu-SSZ-39 molecular sieve based catalyst by using a one-step method and application. By using the one-step method, the Cu-SSZ-39 molecular sieve based catalyst is synthesized through a double template; the copper load is controlled at 2.00-5.00 wt.% by controlling the input ratio of copper sulfate-tetraethylenepentamine to the organic template; and meanwhile, the silica-alumina ratio of USY is controlled to reach the silica-alumina ratio of 4.5-16.4 in the controlled product so that the Cu-SSZ-39 molecular sieve based catalyst with higher degree of crystallization, excellent catalytic activity and hydrothermal stability; and the Cu-SSZ-39 molecular sieve based catalyst is suitable for the nitrogen oxide purification processes in diesel vehicle aftertreatment Urea-SCR system catalysts and fixed sources NH3-SCR. Compared with the existing synthetic method, the preparation method for synthesizing the Cu-SSZ-39 molecular sieve based catalyst by using the one-step method, provided by the invention, has the advantages that the process is simple, repeated uses of an ammonium nitrate and copper salt solution ion exchanging and calcining process are avoided, and a defect that the traditional one-step synthetic method can only load an active component through the later ion exchanging process is overcome. By using the cheap template, the preparation method for synthesizing the Cu-SSZ-39 molecular sieve based catalyst by using the one-step method greatly reduces the production cost and is beneficial for industrial amplification applications.
Owner:HUAZHONG UNIV OF SCI & TECH

Preparation method for inverted LED white-light chip of chip scale package

The invention discloses a preparation method for an inverted LED white-light chip of chip scale package, and the method comprises the following steps: temporarily fixing an UV solidifying adhesive tape (2-1) on the upper surface of a die bonding positioning light cover (1); setting flip chips (3) on the upper surface of the UV solidified adhesive tape (2-1) according to the position of the die bonding positioning light cover (1); employing a fluorescent glue film (4) to cover the flip chips (3); carrying out vacuumizing and heating, and enabling the fluorescent glue film (4) to be solidified and packaged on the flip chips (3); carrying out cutting along gaps among the all packaged flip chips (3); removing the die bonding positioning light cover (1); carrying out UV irradiation and enabling the UV solidified adhesive tape (2-1) to be solidified, and obtaining the inverted LED white-light chip (5) of chip scale package. The method simplifies the technological flow, avoids glue mixing and dispensing in the original technology, improves the production efficiency and yield, and greatly reduces the production cost. The method completely avoids the sinking of phosphor, enables the batch stability of the inverted LED white-light chips (5) to be high, and enabling the color temperature of the inverted LED white-light chips (5) to be consistent.
Owner:TECORE SYNCHEM

Self-pushed type radial horizontal well steering device

The invention relates to a self-pushed type radial horizontal well steering device which is applicable to the fields of transformation of gasoline, natural gas and coalbed methane drilled wells and reservoirs. The self-pushed type radial horizontal well steering device comprises a steering valve, a stroke switch, a piston cylinder assembly, an automatic clamping mechanism, a connector and a steering track and is characterized in that the steering valve is composed of a valve body and a valve core; the stoke switch comprises a runner and a filling block arranged on the upper end of a piston rod; the piston cylinder assembly is mainly composed of a cylinder body, a piston, a wing plate and a limiting groove; the automatic clamping mechanism comprises a spring, a small piston, a rubber block and a pressing cap; the piston automatically holds a high pressure drilling tube tightly when traveling downwards to be fed, and releases vice versa; the connector is used for connecting the high pressure chambers where the piston and the automatic clamping mechanism are located; two flow passages above the connector control the feeding speed; the steering track provides a passage for steering of the high pressure drilling tube inside a casing, so that the complex processes of the milling of a casing section and hole expansion are avoided; the working risk is reduced; and the length of a horizontal section is increased effectively.
Owner:CHINA UNIV OF PETROLEUM (EAST CHINA)

Low-temperature solution preparation method of high-dielectric zirconium oxide thin film

The invention belongs to the fields of new materials and micro-electronics, and particularly relates to a low-temperature solution preparation method of a high-dielectric zirconium oxide thin film. The method comprises the following steps: weighing soluble zirconium salt and measuring a solvent to prepare a zirconium oxide precursor solution with the concentration of 0.01 to 0.5 mole / liter, and performing magnetic stirring and ultrasonic dispersion for 0.1 to 3 hours to form a clarified zirconium oxide precursor solution; preparing a zirconium oxide thin film: coating a cleaned substrate with the zirconium oxide precursor solution to form a zirconium oxide precursor thin film, performing preheating treatment at 50 to 150 DEG C, then performing light wave annealing at certain power and temperature for certain time, coating the zirconium oxide precursor solution for multiple times according to the requirement on the thickness of the zirconium oxide thin film, and annealing to obtain the zirconium oxide dielectric thin film. The zirconium oxide thin film obtained by the method disclosed by the invention is high in dielectric property, and has important application prospect in the micro-electronics field of transistors, capacitors and the like. By means of the process, the conventional high-temperature solution process, the long process cycle or expensive equipment and the like can be avoided; the method is low in cost and suitable for industrial large-scale production.
Owner:QILU UNIV OF TECH

Method for producing calcium carbide raw materials through carbide slag

The invention relates to the field of carbide slag recycling in calcium carbide method acetylene production, in particular to a method that after physical separation is performed on carbide slag impurities, a calcium hydroxide component in the carbide slag impurities is extracted, and then calcium carbide raw materials are produced through carbide slag. The method for producing the calcium carbide raw materials through the carbide slag mainly comprises the following steps of fresh carbide slag screening; magnetic separating; ore grinding; ore pulp preparing; suspension separating; dewatering; carbon mixing, wherein filter cakes which are obtained after dewatering is performed and contain certain moisture are mixed with carbon material particles of which the particle size is smaller than or equal to 2 mm and the fixed carbon content is larger than or equal to 70% in a mixing machine according to the mass fraction ratio of 1.63:1-2.91:1; granulating and forming; drying; calcining. According to the method for producing the calcium carbide raw materials through the carbide slag, the shortcomings and defects in the prior art can be effectively overcome, reclamation recycling of the carbide slag is achieved, the impurities in the carbide slag can be effectively removed, the technology is simple and convenient, and the economical efficiency and practicability are achieved.
Owner:丰镇市嘉鑫硅锰合金有限公司

Display panel and preparation method thereof

Embodiments of the invention provide a display panel and a preparation method thereof. The display panel comprises a mother board and a plurality of back boards which are mutually arranged and bound on the mother board; a driving lead is arranged on the mother board; a leading-out electrode and a light-emitting unit are arranged on each back board; the surface of one side, provided with the leading-out electrode and the light-emitting unit, of the back board faces the surface of one side, provide with the driving lead, of the mother board; and the leading-out electrodes on the back boards areconnected with the driving lead on the mother board. According to the display panel, the driving lead is arranged on the mother board, the leading-out electrode is arranged on each back board, and theplurality of back boards are inversely arranged on the mother board, and the leading-out electrodes are connected with the driving lead, so that the phenomenon that a leading-out wire or a through hole penetrating through the back board is arranged on the side edge of the back board or behind the back plate is avoided, the distance between the adjacent back boards is reduced to the largest extent, the non-mature side edge leading wire process and the double-sided process are also avoided, and the process implementation difficulty is reduced to the maximum extent.
Owner:BOE TECH GRP CO LTD +1

Thixotropic epoxy resin, preparation method and application thereof in LED chip packaging

The invention discloses thixotropic epoxy resin, a preparation method and application thereof in LED chip packaging. The preparation method consists of: (1) weighing bisphenol A epoxy resin, aliphatic epoxy resin, a thixotropic agent fumed silica, an adhesive force promoter, an antioxidant, an ultraviolet absorbent and a defoaming agent, and mixing them evenly to obtain a mixture 1; (2) weighing anhydride, diol, hydroxyl-terminated polybutadiene, and 2, 6-di-tert-butyl-4-methylphenol to carry out reaction to obtain a mixture 2; and (3) mixing the mixture 1 with the mixture 2, adding a phosphine-containing catalyst, and stirring the substances evenly at room temperature, thus obtaining the thixotropic epoxy resin. The method provided by the invention is simple, the technological parameters are easily controllable, and the preparation process does not involve solvent, and is green and environment-friendly. The obtained thixotropic epoxy resin has long storage life and good packaging effect. The thixotropic epoxy resin can be applied in chip packaging, and is especially suitable for chip packaging on a planar substrate, the glue mixing and dispensing process in original technology can be avoided, the production efficiency is high, the rate of finished products is high, and the cost is low.
Owner:TECORE SYNCHEM OPTOELECTRONIC TECH (TIANJIN) CO LTD

Graphite-metal frame composite bipolar plate and preparation method thereof

The invention relates to a graphite-metal frame composite bipolar plate and a preparation method thereof. The bipolar plate comprises a negative electrode plate and a positive electrode plate; the negative electrode plate and the positive electrode plate are both formed by a metal frame and a graphite plate in a gluing manner separately, wherein the whole graphite plate is glued in the metal framethrough a gluing region on the metal frame; and the negative electrode plate and the positive electrode plate are connected in a sealing manner to form the graphite-metal frame glued composite bipolar plate. The preparation method comprises the steps of preparation of the graphite plate, preparation of the metal frame of the positive electrode plate and preparation of the metal frame of the negative electrode plate. The graphite-metal frame glued composite bipolar plate prepared in the invention has the characteristics of high intensity, excellent conductive performance, high corrosion resistance and the like; the main body of the graphite-metal frame composite bipolar plate is the graphite plate and each frame is a metal plate, so that coating treatment of the large-area metal plate is omitted, and the problem of performance inconsistency and the like caused by troublesome large-area coating process and uneven coating can be avoided, and extremely high application prospect is achieved.
Owner:QINGDAO INST OF BIOENERGY & BIOPROCESS TECH CHINESE ACADEMY OF SCI
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